Mouser Electronics Stocks Wide Selection of Latest Analog Devices Products
TYAN Uses New 3rd Gen Intel Xeon Scalable Processors to Drive Performance for AI and Cloud Data Centers
Samtec Compression Mount PCB Connectors With Reach To 65 GHz
TYAN Now Offering AMD EPYC™ 7003 Processor Powered Systems
StereoPi V2, the Open-Source Raspberry Pi Stereoscopic Camera, Now Available from Crowd Supply
Mouser Stocks Industry’s Widest Selection of Products
Now at Crowd Supply: Watchy, the Fully Customizable E-Ink Watch with Open Source Hardware and Software
QNAP TL SAS 12Gb/s JBOD Series for Windows Server Expansion
Nuvoton Technology launches new NuMicro® ML56 series microcontrollers
Mouser Electronics Stocks Broadest Selection of Texas Instruments Components
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Seoul Semiconductor and Seoul Viosys Introduce Four Application Solutions Applied the World’s First LED Technologies at CES 2021
Seoul Semiconductor Co., Ltd. (“Seoul”) (KOSDAQ 046890) and Seoul Viosys (KOSDAQ: 092190), the leading global compound semiconductor providers, announced that they participate in the world’s largest consumer electronics trade show ‘All Digital CES 2021’ from January 11 to 14 (EST), and introduce four application solutions with the world’s first LED technologies. Under the theme of ‘Light Everywhere’ and the concept of ‘Light for every moment’, Seoul Semiconductor and Seoul Viosys introduce the 2nd generation LED technology which can be applied in applications including display, automobile, consumer electronics, lighting and more. Under the theme of ‘Light Everywhere’ and the concept of ‘Light for every moment’, Seoul Semiconductor and Seoul Viosys introduce the 2nd generation LED technology which can be applied in applications including display, automobile, consumer electronics, lighting and more. During this year’s CES, both companies introduce their world-first technologies. The core technology of miniLED and microLED display, Micro Clean Display and WICOP; a laser diode technology enabling safe autonomous driving, VCSEL (Vertical Cavity Surface Emitting Laser); SunLike with 3 USPs: Better Study – support for students’ learning and concentration; Better Eye – protection from myopia in children; Better Immunity – support for immune system boost; and a safe and new-concept UV LED technology enabling virus disinfection within a second, Violeds. This year’s CES will take place online. Seoul Semiconductor and Seoul Viosys will hold seminar sessions on both January 12th and 13th to introduce four application solutions, and they plan to exhibit the products to visitors via 1:1 Chat. Chung Hoon Lee, CEO of Seoul Semiconductor said “Seoul Semiconductor and Seoul Viosys are leading the compound semiconductor industry with the exclusive and innovative technologies. We are pleased to introduce our core LED technologies which will be applicable to the industries such as 5G, autonomous vehicle, smart home, digital health, well-being, and more at the All Digital CES.” He added, “I expect that both companies will enhance their recognition and position as the global leader of compound semiconductor companies on the occasion of CES.”
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Sonnet Launches Portable External Graphics (eGPU) Docks
Sonnet Technologies today announced the launch of the eGPU Breakaway™ Puck Radeon® RX 5500 XT and eGPU Breakaway Puck Radeon RX 5700, the newest members of the company's popular family of portable all-in-one Thunderbolt™ 3 external graphics processing (eGPU) systems. Replacing the now discontinued eGFX Breakaway Puck Radeon RX 560 and Radeon RX 570 eGPUs, the new models retain the same form factor but in many cases deliver more than 300% performance improvement over the previous-generation models. The new models now include two USB ports for connecting peripheral devices and a second Thunderbolt port for fully supporting a Thunderbolt/USB-C® display, including the 6K Apple® Pro Display XDR. What They Do: eGPU systems boost a computer's graphics performance by connecting a more powerful graphics processor via a Thunderbolt 3 connection and bypassing the computer's onboard GPU to deliver graphics performance not otherwise possible. Sonnet's eGPU Breakaway Puck Radeon RX 5500 XT and Radeon RX 5700 systems are designed for professionals who need to run graphics-intensive applications on their Intel®-based MacBook Air®, MacBook Pro®, Mac mini®, or iMac® with Thunderbolt 3 ports, with the focus on high performance, portability, and flexible external display connectivity plus quiet, reliable operation. eGPU Breakaway Pucks accelerate a computer's graphics performance on its built-in display (if equipped) and on up to four externally connected displays. Why They're Important: Most popular professional video applications rely on powerful GPUs to do the heavy lifting in tasks such as exporting, rendering, and more. A problem for many pro users is that their preferred computers are often only equipped with a basic graphics controller or a low-power discrete GPU that is less suitable for many of those tasks. The use of an eGPU overcomes those limitations. While eGPU enclosures like Sonnet's just-announced eGPU Breakaway Box 750 and 750ex allow users to connect a desktop GPU PCIe® card to boost their computer's graphics processing abilities and enable great performance with pro apps, they are not portable and have a larger desktop footprint. Sonnet's eGPU Breakaway Pucks deliver a great graphics performance boost yet are small enough — measuring just 6 inches wide by 5.1 inches deep by 2 inches tall — to toss in a computer bag. How They're Unique: Both eGPU Breakaway Puck models support up to three 4K @ 60 Hz displays (four with one of Sonnet's dual-display adapters, sold separately) or one 6K plus two 4K displays at the same time. Through a second Thunderbolt 3 port, the Pucks provide both graphics and data to fully support all popular Thunderbolt/USB-C displays, including the LG UltraFine™ 4K and 5K displays sold in the Apple® store. They also provide enough power to drive the 6K Apple Pro Display XDR without compromise. Both models include two USB Type A ports to enable connection of peripherals — such as a keyboard, mouse, or even a software license authorization key dongle — to the computer without taking up its few onboard ports. When You Can Get Them: The eGPU Breakaway Puck Radeon RX 5500 XT (part number GPU-RX55-TB3-S) and eGPU Breakaway Puck Radeon RX 5700 (part number GPU-RX57-TB3-S) are available now from Sonnet at suggested retail prices of $599.99 and $899.99, respectively.
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Global tech firms test interoperability of IoT technologies
Significant steps have been made towards the realisation of a standardised Internet of Things (IoT) ecosystem, during the global IoT standards initiative oneM2M’s 7th Interoperability event. Global technology companies with a stake in the IoT joined a two-week virtual event of interoperability testing with oneM2M’s IoT standards, using a remote testing platform developed by ETSI[1] with the support of the EU-funded InDiCo project. Results from the event showed a 96% interoperability rate with oneM2M’s standard. ETSI Technical Expert Laurent Velez said: “The event was a unique opportunity for companies to debug their products and check interoperability with other vendors. The event helped validate and enhance interoperability of products among the participating companies and this gives them the confidence to implement the standard and go to market”. “The results confirm that oneM2M standards have matured to a level ready for further global implementation, which will deliver a truly interoperable IoT landscape. What makes the results even more impressive is the fact that many companies took part in the event and testing for the first time, so the success rate is a testament to the instant adoptability of the oneM2M standard,” Velez added. The purpose of the event was to verify interoperability as defined in the oneM2M standards and to check end-to-end functionality on oneM2M interfaces, including Application Entities and Common Service Entities. The testing was based on the latest specifications of the oneM2M Releases 1, 2 and 3, and some advanced features of the upcoming Release 4. Telecommunications Technology Association (TTA)’s Principal Researcher Keebum Kim said: “Crucial to the event’s success was the ability of participants to report any technical issues discovered during the testing stage, for any corrective actions to be made. oneM2M could also verify (and improve when required) the test specifications for conformance and interoperability. By correcting errors on the products in a controlled manner, early in the development, late, expensive fixes in the product cycle can be avoided – an obvious concern for any vendor.” Two days of the event were held ‘face-to-face’ at the Global IoT Testing and Certification Centre in Pangyo, South Korea and were supported by Ministry of Science and ICT (South Korea). Interoperability events enable oneM2M to validate its standard; validation may reveal errors or ambiguities in the requirements which prevent correct implementation of the standard, which can lead to interoperability issues. The event marked the first time such a high volume of tests have been conducted at an Interoperability event and included 235 interop tests and more than one thousand for conformance, covering Releases 2 and 3 of the oneM2M standard. Relevant results and observations will be reported to the oneM2M Working Group TDE in charge of testing activity to produce normative content to fix and improve the standard and the related tests specifications. ### [1] ETSI HIVE Test Automation Platform: ETSI's remote testing service developed to automatically execute conformance and interoperability test items as needed. It internalized the oneM2M interoperability test cases for the first oneM2M Interop event and deploys custom VPN clients to allow IUTs to connect to each other. The platform acts as an intermediary to capture and analyse the exchanged packets to deliver results.
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Mouser Electronics New Product Insider: December 2020
Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,100 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. Last month, Mouser launched more than 555 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Semtech LR1110 LoRa Edge™ Tracker Reference Designs Semtech LR1110 LoRa Edge Tracker reference designs feature the LoRa Edge LR1110 transceiver pre-programmed with LoRa Basics Modem-E embedded software. Arduino OPLÀ IoT Starter Kit Arduino OPLÀ IoT Starter Kit is the first open programmable IoT platform that allows users to add smart connectivity to devices around the home or workplace and build custom IoT devices. Maxim Integrated MAX38802 & MAX38803 Step-Down Switching Regulators Maxim MAX38802 and MAX38803 are fully integrated, highly efficient switching regulators for applications operating from 6.5V to 14V input supplies that require up to 25A maximum load. Littelfuse SLD5S Unidirectional Surface Mount TVS Diodes Littelfuse SLD5S devices are AEC-Q101-qualified unidirectional surface mount TVS diodes designed to protect sensitive electronics against ESD, EFT, and 10/1000 surge events.
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HUBER+SUHNER launches MASTERLINE Ultimate Micro solution to advance 5G small cell deployment
HUBER+SUHNER, a leading global provider of optical connectivity solutions, has today launched its MASTERLINE Ultimate Micro (MLUM) compact and discreet fiber optic distribution box as part of its Network Densification product range, designed to ease installation and operation of 5G deployments. Operators are often faced with the challenge of providing cost-effective 5G in urban areas. Small cells are critical to providing increased capacity and coverage in these areas, where networks are highly congested with growing numbers of wireless devices. However, creating new cellular sites in urban areas is very challenging with only limited space available for installation in harsh conditions. To overcome this, HUBER+SUHNER has developed its versatile MLUM solution to address critical challenges in the planning, building and operation of new wireless infrastructure deployments. It provides an affordable solution that is simple to install and takes up the minimum amount of physical space. “An obstacle right from the initial planning stage of small cell sites is the unique demands of different locations, from street boxes, bus stops, streetlamps or even house walls,” said David Neher, Product Manager for Outdoor Fiber Connectivity at HUBER+SUHNER. “For this reason, there is a great need for products and solutions that are compact and can therefore be used flexibly in the available space. HUBER+SUHNER is proud to address 5G deployment requirements and challenges with its product portfolio to support the success of the next-generation ecosystem.” The MLUM features plug and play functionality with multiple mounting options, providing a number of placement possibilities to achieve robust, flexible, high-capacity deployments for up to 4 RRHs. “Given the increasing number of 5G sites, there is also the requirement to connect the products as quickly as possible to meet growing demand for faster site deployment. That’s why our MASTERLINE Ultimate Micro solution is a game-changer; easy and simple to install with a low visual impact,” concluded Neher. Adding to its extensive portfolio, with small antennas and Standard Plenum Jumpers (SPJ) solutions for both indoors and outdoors, the MASTERLINE Ultimate Micro establishes HUBER+SUHNER as a leading sustainable solution provider in the market.
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HUBER+SUHNER unveiled the MASTERLINE Flex Box
HUBER+SUHNER, a leading global provider of optical connectivity solutions, today unveiled its most versatile distribution box – the MASTERLINE Flex Box (MLFB) – offering operators greater efficiency when deploying new wireless infrastructure. Adding to the HUBER+SUHNER portfolio to create a full product range for edge optical systems with high flexibility in regard to Wavelength Division Multiplexing (WDM), fiber distribution and small cell deployment, the outdoor MASTERLINE Flex Box can hold up to two exchangeable field-proven, fiber optic IANOS® modules. Initially developed for indoor data centers, these modules can be utilised for outdoor applications for the first time, enabling functions such as splicing, transition, conversion and patching. The MASTERLINE Flex Box features plug and play functionality with multiple mounting options, providing a number of placement possibilities to achieve cost-effective, flexible, high-capacity deployments. The compact size coupled with a weight of just 2.2 kilograms, enables fast installation and minimal space take-up, allowing operators to install new fiber optic networks quickly and efficiently. “Operators are facing unprecedented demand within the mobile network due to trends such as virtual reality, cloud gaming, streaming and video calls. To meet this, they must deploy new sites or upgrade existing ones and there are several obstacles when it comes to this. The new MASTERLINE Flex Box was designed exactly for this purpose,” said David Neher, Product Manager Fiber Connectivity Outdoor at HUBER+SUHNER. “This latest product in our MASTERLINE range simplifies the deployment process and lets operators extend and build new fiber optic networks quickly and seamlessly without compromising on quality.” With strain relief and cost-saving termination due to its industry standard split grommets, the MASTERLINE Flex Box offers operators huge benefits for little investment. Ultimately, it provides the capability to achieve high-capacity networks while reducing equipment, material and deployment costs. “As the future of Internet connectivity advances, operators must utilise solutions that allow them to deliver high-quality performance and flexibility while reducing the cost per bit,” concluded Neher.
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MorphESP 240 Dev Board for the ESP32-S2 Now Available from Crowd Supply
Crowd Supply, the leading product development platform connecting hardware creators with early adopters and enthusiastic backers, announces the launch of the MorphESP 240, a user-friendly, open-hardware development board for the new Espressif ESP32-S2 Wi-Fi microcontroller. Designed to unite minimalist design with possibilities for scaling, the highly versatile MorphESP 240 dev board integrates a 240 MHz single-core microcontroller, built-in battery, and several GPIOs in a compact package. The MorphESP 240 dev board, developed by Morpheans and launched with support from Crowd Supply, is compatible with both Arduino and CircuitPython, making it a suitable choice for a range of ESP32-S2 applications. The open hardware MorphESP 240 board includes schematics; DTX, STL, and Solidworks files; and a KiCAD project source, as well as a breadboard-friendly dev shield, allowing users to quickly and easily upgrade the functionality of their device. The MorphESP 240 board is intuitive and easy to use, featuring an on-board, SPI-driven ST7789 display, in addition to multi-color WS2812B RGB LED. The device has a USB charging module for a JST-connected battery, while a 3.3 V to 5 V voltage regulator enables users to add extra modules.
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HUBER+SUHNER expands critical communications portfolio to provide comprehensive solution offering from a single supplier
HUBER+SUHNER, a leading developer and manufacturer of components and system solutions for electrical and optical connectivity, has announced the expansion of its critical communications portfolio with the full integration of Kathrein Special Communications. This development further strengthens the company’s ability to provide a host of products and solutions for critical applications. Suitable for use in critical communications networks across the industrial, energy, blue light, defence, government and rail sectors, the portfolio meets the rising demand for versatile, resilient and secure high-performance connectivity. In recent years, the security industry has experienced increasing pressure to provide effective and efficient services which ensure the safety of the public, military and emergency mobile field teams. Consequently, the professional mobile radio (PMR) networks must remain operational and secure at all times, particularly in the event of a crisis where ensuring reliable and resilient connection is critical. “Traditional PMR networks can no longer meet the growing demand for stable broadband digital connectivity. To support mission critical activities, we specially designed our portfolio to provide reliable and flexible connectivity in every component – all from one supplier,” said Andre Berninger, Vice President of Special Communication at HUBER+SUHNER. “With over 30 years of engineering design experience, the complete critical communications portfolio from HUBER+SUHNER is unlike any currently on the market, offering significant advantages over existing connectivity products through the development of broadband solutions combining TETRA and professional LTE.” Offering outdoor, indoor and vehicle antennas, GPS-over-Fiber, complementary components and more, the portfolio is specifically characterised by its mechanical attributes; every solution is ultra-rugged and durable by design, providing reliable communication capabilities in even the harshest environments. Having now extended its product range, HUBER+SUHNER has established itself as a leading supplier of components and system solutions for indoor and outdoor mission critical communication infrastructure, offering a one-stop shop for customers to ensure interoperability while minimising lead times. With the company’s membership in the 450 MHz Alliance, HUBER+SUHNER is committed to developing innovative solutions, advocating for the advancement of critical communications networks with the use of emerging technology. As part of this mission, its complete critical communications portfolio will be made accessible and readily available to customers across the industry to future proof and improve existing infrastructure.
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QNAP Launches Dual-port Thunderbolt™ 3 Expansion Card for TVS-h1688X and TVS-h1288X NAS
QNAP® Systems, Inc., a leading computing, networking and storage solution innovator, today launched the QXP-T32P Thunderbolt™ 3 expansion card. Providing dual-port Thunderbolt™ 3 connectivity, the QXP-T32P is a PCIe Gen 3 x4 card that can be installed in the TVS-h1288X and TVS-h1688X. By installing a QXP-T32P in a NAS, video editing studios in particular can greatly benefit from the increased bandwidth and connectivity to smoothly transfer, display and edit 4K videos in real-time. “Many video editing studios use QNAP products, providing us with greater understanding of their needs and requirements. We understand that not many of them have dedicated IT staff to handle upgrading and installing hardware, so we aim to provide easy solutions for adding additional connectivity and bandwidth” said Stanley Huang, Product Manager of QNAP, adding “the easy-to-install Thunderbolt™ 3 expansion card provides the ability to greatly boost teamwork between Final Cut Pro® and Adobe Premiere Pro® users. With SMB protocol support, Final Cut Pro users can create a library on a NAS volume and use it as if it were a local storage device.” QNAP is committed to providing users with the ability to upgrade their networks to meet modern high-speed demands. Cutting-edge Thunderbolt™ 4 computers can also be used by a NAS with a Thunderbolt™ 3 expansion cards when connected using Thunderbolt™ cables.
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HUBER+SUHNER unveils industry first 90 GHz multicoax testing solution
With the automotive, semiconductor and mobile communication sectors increasingly developing applications that require the E-band spectrum range, HUBER+SUHNER has today announced its MXPM90 test solution for frequencies up to 90 GHz. Created in response to these industry demands; this product will allow manufacturers to test their components with even greater accuracy. As testing of PAM4/400G ethernet, 5G mobile communication systems and automotive radar sensors becomes more urgent, so too does the technological demand for test solutions that are optimised for higher frequencies. The MXPM90 is the latest expansion to the already established MXPM70 multicoax product, offering an extended bandwidth from DC up to 90 GHz. This provides HUBER+SUHNER customers with a solution that allows for extremely accurate results through high speed digital, bench-top and system testing, as well as internal wiring in automated test systems. “This latest product offers best-in-class integrity for data analysis up to 112 Gbps/90 GHz and beyond, making it a highly efficient solution for precise, repetitive measurements, with its tight phase matching of single assemblies and broadband return and insertion loss characteristics across the entire bandwidth,” said Jürg Nussbaumer, Product Manager Radio Frequency PMD components at HUBER+SUHNER. “It demonstrates the ability of HUBER+SUHNER to rapidly innovate in line with changing expectations and needs, to provide our customers with high-quality components.” The MXPM90 has a high-density pitch down to the board, measuring 2.54mm (0.1 inch) centre-to-centre, which positions the MXPM as close as possible to the chip to keep traces short, giving manufacturers greater efficiency during the test process. Meanwhile, the plug and play functionality guarantees a trouble-free, user-friendly experience. Its magnetic mount connection facilitates a perfect transition between assembly and PCB socket. Additionally, the MXPM90 has automatic interface protection safeguarding every single channel from mechanical damage when disconnected.
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Operators need compact, flexible and customized solutions to solve network densification deployment challenges
“As the consumption of data increases exponentially, with further growth predicted in the future from technological advancements and consumers becoming dependent on more bandwidth-hungry applications, operators must densify the network to keep up with continuous network upgrade requirements,” Fabian Huber, Market Unit Manager Communication at HUBER+SUHNER, advised today. This rise in global data consumption requires even more network capacity worldwide. However, with reduced space, poor accessibility and growing numbers of new sites, operators are often confronted with a number of challenges when building or renewing wireless networks. According to Huber, there are fundamentally four things to consider when it comes to the building and renewal of network infrastructure, including air interface, location, energy, and network connection. These four aspects decide if and how wireless infrastructure is deployed and ultimately, are the main considerations behind the business case for each cell site. “With the availability of physical assets differing from one cell site to the next, operators must work with partners who have extensive experience and solutions in a varying range of applications,” emphasised Huber. “While the solution is conceptually easy and can be achieved by densifying the network and therefore reducing the cell site size, operators must deploy solutions specific to the requirements of that site: customised where necessary, and as standardised as possible.” The sheer volume of variances of sites is challenging to tackle, however Huber went on to explain that there are seven main application types that share similar physical assets or the same potential solution set. These include advertisement pillars, bus shelters, streetlights, department stores, in-building coverage, and campuses and play a vital role in the increased capacity of networks worldwide. “At HUBER+SUHNER we understand that difficulties can arise throughout the planning, building and operation of densified networks,” added Huber. “To address these trials, a distinction needed to be made between the phases and, subsequently, we can now provide operators with products and solutions to meet the challenges faced in all three phases and prepare their networks for the future.” In order to better understand the solutions offered by HUBER+SUHNER to simplify, speed up and reduce the cost of the network densification process, the company has released a catalogue of solutions to explicitly address the site densification challenges that operators worldwide are currently facing. To view the catalogue please click here.
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Mouser Electronics New Product Insider: November 2020
Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,100 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. Last month, Mouser launched more than 387 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: • Renesas Electronics RA6M4 32-bit Microcontrollers Renesas RA6M4 microcontrollers boast a 200 MHz Arm® Cortex®-M33 core with Arm TrustZone® technology to unite exceptional connectivity, security, and performance. • ams TMD2755 Proximity Sensor Module The ams TMD2755proximity sensor module incorporates a low-power VCSEL emitter (with integrated driver), an IR photodetector, and an ambient light sensor in a narrow, low-profile package. • Amphenol Air LB Circular MIL Spec Connectors Amphenol Air LB circular MIL-SPEC connectors meet the demands of military, aerospace, and industrial applications. • OSRAM Opto Semiconductors SFH 4737 IR Broadband Emitter OSRAM Opto Semiconductors SFH 4737 is the smallest near-infrared LED (NIRED) for spectroscopy applications available in the market. Mouser offers the world's widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers' designs, Mouser's website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.
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QNAP Launches 24-bay U.2 NVMe All-Flash TS-h2490FU NAS
QNAP® Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the lightning-fast NVMe all-flash TS-h2490FU. With 24 drive bays for U.2 NVMe Gen 3 x4 SSD, the TS-h2490FU provides up to 472K/205K iSCSI 4K random read/write IOPS with ultra-low latency. Equipped with four 25GbE SFP28 and two 2.5GbE RJ45 LAN ports, five PCIe Gen 4 slots, and 1100W redundant power supplies, the TS-h2490FU provides exceptional hardware and connectivity. The ZFS-based QuTS hero operating system also includes powerful applications for data reduction and SSD optimization, ensuring that SSD performance and lifespan is maximized for mission-critical virtualized workloads and data centers with all-flash investments. “NVMe revolutionizes storage I/O performance and connectivity for eliminating productivity bottlenecks in modern data centers,” said David Tsao, Product Manager of QNAP, adding “the U.2 NVMe all-flash TS-h2490FU is perfect for I/O-intensive and latency-sensitive applications, and leverages the many advantages of ZFS to multiply SSD performance advantages. After comprehensive evaluation, we also recommend Western Digital Ultrastar® DC SN640 NVMe Data Center SSDs for attaining outstanding performance and reliability with the TS-h2490FU.” “NVMe is having a substantial impact on enterprises and what they can do with data, and Western Digital Ultrastar NVMe SSDs deliver excellent performance, endurance, and reliability for today’s evolving data center workloads,” said Swapna Yasarapu, senior director of data center SSD Flash at Western Digital. “We are pleased to partner with QNAP for their TS-h2490FU NVMe all-flash storage solution to demonstrate how Ultrastar NVMe SSDs can improve storage performance, efficiency, and overall TCO for modern IT infrastructure.” Armed with 2nd Gen AMD EPYC™ 7002 series processors, the all-flash TS-h2490FU delivers groundbreaking performance and ensures 32 Gb/s bandwidth for each individual NVMe SSD. The TS-h2490FU-7302P-128G model comes with two pre-installed Broadcom® dual-port 25GbE SFP28 SmartNICs, allowing for up to 100 Gbps transfer speeds under Port Trunking. Five PCIe Gen 4 slots are included for extending core NAS functionality, for example, adding additional high-speed network interface cards, QM2 cards to add M.2 SSDs, and storage expansion cards to connect QNAP SAS/SATA expansion enclosures to attain petabyte-scale storage capacity. Powered by the ZFS-based QuTS hero, the TS-h2490FU focuses on data integrity with self-healing. Data reduction with inline data deduplication, compression, and compaction significantly reduces the overall storage footprint - especially helpful for increasing SSD storage efficiency when highly-repetitive data or massive small files are generated. Additional SSD-optimizing features include Write Coalescing, TRIM, and Pool Over-provisioning to assist in attaining the highest performance and lifespan from your SSD investment. QuTS hero supports near-unlimited snapshots and versioning for enhanced data protection. The inclusive App Center also provides various install-on-demand apps to further expand the TS-h2490FU’s application potential, such as hosting virtual machines and containers, simplifying local/remote/cloud backups, setting up a cloud storage gateway to deploy hybrid cloud applications, and much more. Key specifications • TS-h2490FU-7232P-64G: AMD EPYC™ 7232P 8 cores/16 threads 3.1 GHz processor (Max. boost clock 3.2 GHz), 64 GB RDIMM DDR4 ECC memory (8 x 8 GB), 2x 25GbE SFP28 SmartNIC ports • TS-h2490FU-7302P-128G: AMD EPYC™ 7302P 16 cores/32 threads 3.0 GHz processor (Max. boost clock 3.3 GHz), 128 GB RDIMM DDR4 ECC memory (8 x 16 GB), 4x 25GbE SFP28 SmartNIC ports 2U rackmount NAS, 24x 2.5-inch U.2 NVMe Gen 3 x4 solid state drive bays, 2x 2.5GbE RJ45 ports, 5x PCIe Gen 4 slots, 2x USB 3.2 Gen 1 (5 Gbps) ports, 1100W redundant power supplies
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Fully Automated Microchip Electrophoresis Analyzer for Potential Life Detection Missions
Although Earth is uniquely situated in the solar system to support creatures that call it home, different forms of life could have once existed, or might still exist, on other planets. But finding traces of past or current lifeforms on other worlds is challenging. Now, researchers reporting in ACS’ Analytical Chemistry have developed a fully automated microchip electrophoresis analyzer that, when incorporated into a planetary rover, could someday detect organic biosignatures in extraterrestrial soil. One critical piece of evidence for life beyond Earth is the presence of certain organic molecules. Previous missions to Mars have relied on gas chromatography coupled to mass spectrometry (GC-MS) to separate and detect compounds. However, the technique has limitations for the analysis of some molecules, such as organic acids, especially when water, minerals or salts are also in the sample. Microchip electrophoresis (ME)-based separations, followed by laser-induced fluorescence (LIF) detection, would be ideal, but current instruments are only partially automated, which wouldn’t work for interplanetary missions. Peter Willis and colleagues wanted to develop a portable, battery-powered ME-LIF instrument that could accept a sample and perform labeling, separation and detection of organic molecules, all in a fully automated fashion. The researchers made a device that included two microchips –– one for processing and labeling a liquid sample, and the other (the ME chip) for separating compounds –– and an LIF detection system. After optimizing the device, the researchers put it to the test in a simulated Mars mission in a Chilean desert. The team coupled the analyzer to a portable subcritical water extractor on a remotely deployed rover system. The rover drilled into the soil to collect samples, which were delivered to the extractor. Then, water was added to the soil samples, and they were heated to extract compounds for analysis. The device detected parts per billion levels of amino acids in soil from three of four drilling locations. Importantly, the sensitivity was three orders of magnitude higher than that reported for GC-MS-based methods. Although more work is needed to ready the instrument for spaceflight and extraterrestrial conditions, this research lays the foundation for developing ME-LIF instruments for missions seeking signs of life beyond Earth, the researchers say. The authors acknowledge funding from NASA.
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Panasonic to Release SG-P Series Safety Door Switches with Highly Visible Indicators
Panasonic has developed the SG-P series safety door switches that enable workers to see the open/closed state of doors of the entire production equipment at a glance. The products will be released in October 2020. They will increase the safety of workers during maintenance at production sites, as well as reduce machine downtime, thereby improving the operating rate. Panasonic Corporation announced today that has developed the SG-P series safety door switches designed to increase the safety of workers by letting them see the open/closed state of doors of entire production equipment at a glance. The products will be released in October 2020. Until now, human workers and machines have worked separately at production sites. But in recent years, the environment in which people and machines work in cooperation while recognizing each other is increasing, which is further raising safety awareness on factory floors. However, switches that can easily disable safety functions are still used at production sites, which is one of the factors that cause serious accidents to workers. By detecting only the paired actuator, it prevents the intentional disabling of interlocks, which is a mechanism that deactivates machine operations when certain conditions are not met and enhances the safety of workers during maintenance. There was another problem. Machines could not be operated immediately when using switches with small indicators, because it takes time to check the open/closed state of the doors of the entire production equipment. To address this problem, Panasonic has equipped the newly developed switches with a large and bright indicator and configured the actuators to illuminate, enabling workers to swiftly identify open doors. This will reduce machine downtime and improve the operating rate. ■ Features 1. Prevention of the intentional disabling of interlocks 2. Large and bright indicators show the open/closed state of the doors of the entire equipment. 3. The parent-child structure saves wiring, allowing up to 30 units to be connected in series. ■ Product features 1. Prevention of the intentional disabling of interlocks During the maintenance at production sites, intentionally disabling interlocks when opening equipment doors can be a major cause of accidents because there is a risk that another person may operate the machine without noticing the worker. Panasonic’s new safety door switches prevent intentional disabling by adopting an RFID system (*1) that detects only the actuator paired with the switch. Its compliance with the coded levels specified in ISO 14119 (*2) increases the safety of workers. (*1) System for reading and writing individual actuator information by using weak radio waves (*2) General requirements for the design and selection of interlocking devices associated with the safety guards of machines. 2. Large and bright indicators show the open/closed state of the doors of the entire equipment. The newly developed safety door switches are equipped with a large and bright indicator despite being compact enough to be fitted in a 30-mm square aluminum frame. Open doors are indicated with bright red lighting, whereas other doors linked to the open doors are indicated with green flashing lights to show their unsafe state. Conventional switches with a small indicator were not easy to see from the outside when mounted on the inside of doors, making it difficult for workers to identify open doors. However, the actuator of these products is configured to also illuminate, enabling the checking of the state of the switch even from the outside and consequently, the swift identification of open doors. This reduces machine downtime, improving the operating rate. 3. The parent-child structure saves wiring, allowing up to 30 units to be connected in series. Up to 29 sub switches, which are child devices, can be connected to one standard switch, which performs as a parent device, allowing up to 30 units to be connected in series. Only the parent device outputs, which eliminates the need for wiring used for output from linked child devices, thereby saving wiring required for mounting on equipment.
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Mouser Electronics New Product Insider: September 2020
Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,100 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. September 2020 Product Insider Last month, Mouser launched more than 379 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Analog Devices ADPD4100 and ADPD4101 Multimodal Sensor Front Ends Analog Devices ADPD4100 and ADPD4101 can act as sensor hubs for synchronous measurements of components in PPG, ECG, electrodermal activity (EDA), and more for healthcare, industrial, and consumer applications. HARTING T1 Industrial Single-Pair Ethernet (SPE) Products Selected by the International Electrotechnical Commission (IEC) as the standardized SPE mating face (IEC 63171-6), HARTING's innovative T1 Industrial products enable transmission of data via Ethernet using just two wires, and also offer simultaneous power supply for terminals using Power over Data Line (PoDL). Vishay Semiconductors VLMU35CL20-275-120 UVC LED Vishay Semiconductors VLMU35CL20-275-120 is a ceramic-based, low-power ultraviolet C (UVC) LED a silicone lens that enables a long product lifetime. Würth Elektronik Optocoupler Phototransistors Würth Elektronik optocoupler phototransistors feature a 5 kV isolation voltage rating, fast switching time, and good stability of inner isolation.
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HUBER+SUHNER and Rosenberger Hochfrequenztechnik publish an industry first extensive guide to determine most advantageous RF connector plating
White paper follows extensive performance testing – carried out with Rosenberger Hochfrequenztechnik – on five plating types under a 720 hrs salt spray corrosion test As leading suppliers of radio frequency (RF) and optical connectivity components for telecommunications, space and defence and test and measurement applications, HUBER+SUHNER and Rosenberger worked closely together to create this white paper. The findings of ground-breaking research into RF plating which discovers the most resilient plating for corrosion resistance have today been released as a new industry guide by HUBER+SUHNER and Rosenberger. Outdoor RF connectors require exceptional corrosion resistance in order to fulfil stringent mechanical and electrical requirements in extreme environmental conditions. With increasing performance demands on connectors, plating are key to withstanding stress and exposure in these harsh environments. The white paper – entitled ‘720 hrs Salt Spray Corrosion Resistance Plating for RF Connectors’ – investigates and evaluates the performance characteristics of plating types and is the first extensive reference guide in the industry for choosing the most resilient plating. With many plating options available on the market for RF connectors, HUBER+SUHNER and Rosenberger produced this guide to provide a detailed comparison of advantages and disadvantages of optional plating to find out which provides optimum corrosion resistance. The white paper investigates the performance qualities of the most popular RF connector plating types including silver, white bronze, SURO720, tin-nickel and electroless nickel-phosphorus. Under a 720 hrs salt spray test, the performance of the plating was tested in contact resistance, wearability, ductility, solderability and for passive intermodulation properties. The tests provided varied results with some plating showing best results for contact resistance and others performing best in wear resistance. The results from the white paper provide the industry with a comprehensive guide of recommendations for the best plating performances in various applications based on technical and economic requirements.
