Tracealyzer 4 Now Supports On Time RTOS-32
Mouser Electronics and Grant Imahara Launch New Series All Things IoT about Technology Redefining How We Live
Percepio Partners with UltraSoC For Unified Hardware and Software Tracing
Percepio Announces Tracealyzer Support for STLINK-V3 Debug Probes
Samtec Announces Acquisition of PCI
Mouser Electronics First Authorized Distributor to Receive AS6496 Accreditation for Strong Anti-Counterfeit Measures
Authorized Distributor Mouser Electronics Stocking Widest Selection of Texas Instruments Products
oneM2M Release 3: Leading Global IoT Standard Delivers Enhanced Operator Support, New Capabilities for Home and Industrial Uses
NETCOMM’S New Industrial IoT Product to Accelerate Businesses Productivity using LTE CAT M1/NB-IOT Networks
Intel Arria 10 module, smaller than a credit card
Samtec Releases Flyover QSFP28 Cable System
Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the Flyover™ QSFP28 Cable System. This new system can support 28G NRZ/56G PAM 4 data rates per channel, and it provides system design flexibility. Samtec’s Flyover™ QSFP28 Cable System allows sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew. This system can provide aggregate data rates of 100Gbps NRZ/200 Gbps PAM4, and is compatible with all MSA QSFP pluggables. A variety of heat sink options are available and allow a heat dissipation of approximately 3.5W per cable. The Samtec Flyover™ QSFP28 Cable System consists of the FQSFP assembly, the QSFPC cage, HS-QSFP heat sink, and LP-FQSFP light pipe. The FQSFP offers multiple End 2 options including DCH, ECUE, and ARC6. FQSFP utilizes 30 & 34 AWG 100 Ω Eye Speed® Ultra Low Skew Twinax Cable. Samtec also offers an FQSFP SI Characterization Kit for evaluation and development. “Using the FQSFP series allows for a much longer electrical trace and convenient selection for the endpoint of the SerDes termination,” said Aaron Ram, Applications Engineer at Samtec, Inc. “The process of routing through the FQFSP series allows designers to locate the QSFP interface much further from the ASIC or processor than traditional PCB routing would allow. This also removes the need for expensive retimers or power hungry drivers and receivers.”
Mouser Electronics New Product Insider: August 2018
Mouser Electronics, Inc. specializes in the rapid introduction of new products and technologies. As the industry leader in New Product Introductions (NPIs), Mouser makes it a priority to stock the newest products and technologies from our 700+ manufacturer partners, giving customers an edge and helping speed time to market. February 2018 Product Insider Last month, Mouser launched more than 433 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Linear Technology / Analog Devices LTM46xx µModule Regulators Analog Devices LTM46xx µModule regulators are system-in-package (SiP) power management solutions with integrated DC-DC controllers, inductors, power transistors, compensation components, input and output capacitors in compact, surface-mount BGA or LGA packages. ROHM Semiconductor BH1749NUC Digital Color Sensor IC ROHM Semiconductor BH1749NUC is a 16-bit serial-output color sensor with I2C bus interface and built-in IR-cut filter. Molex HarshIO modules for EtherNet/IP Molex HarshIO IP67 compact modules for EtherNet/IP are four- or eight-port modules that provide a reliable solution for connecting industrial controllers to I/O devices. Dialog Semiconductor SmartBond DA14585 IoT Sensor Development Kit Developed by Dialog Semiconductor and including TDK Invensense motion and Bosch Sensortec environmental sensors, the DA14585 IoT Multi-sensor Development Kit combines Bluetooth® wireless communications and an Arm® Cortex®-M0 processor with an accelerometer, gyroscope, magnetometer and environmental sensors.
Samtec Announces Completion of new VITA 57.4 FMC+ Standard
As an ANSI/VITA member, Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly supports the release of the new ANSI/VITA 57.4-2018 FPGA Mezzanine Card Plus Standard. VITA 57.4, also referred to as FMC+, expands upon the I/O capabilities defined in ANSI/VITA 57.1 FMC by adding two new connectors that enable higher data rates. FMC+ modules provide a standardized mezzanine card often employed in FPGA development solutions and by COTS manufacturers. Due to features such as their small form factor and user defined pins, FMC+ provides attractive features to the end user while maintaining modularity. In addition to providing backwards compatibility with FMC mezzanine cards, FMC+ also extends computing performance and bandwidth, all fitting within the same form factor as FMC. Samtec’s SEARAY™ vertical connectors are featured in the VITA 57.4 standard, which specifies 8.5 mm and 10 mm stack heights. SEARAY™ is capable of speeds up to 28 Gbps, provides low insertion/extraction forces, and also features solder charge terminations. In addition, the FMC+ standard also specifies the use of an optional extension connector (the High Serial Pin Connector extension, or HSPCe). Employing this extension connector increases the total pin count by 80 positions, arranged in a 4 x 20 array. This brings data rates from 28 to 32 Gbps over full duplex channels. The expanded SEARAY™ connector was chosen based on its successful performance in the VITA 57.1 FMC Standard, as well as its high-speed capabilities and rugged design. “Samtec is proud to offer the next-generation FMC+ connector solution” says David Givens, Standards Director at Samtec. “The customized SEARAY™ has flawless reliability. It provides extensive flexibility to FPGA developers and VITA-hardware users alike, while maintaining ideal signal integrity.”
Coilcraft Wirewound Ferrite Beads Offer a High Magnitude of Attenuation across a Wide Frequency Range
Coilcraft offers a broad range of wirewound ferrite beads in standard package sizes from 0201 (0603) to 1812 (4532). Superior attenuation and frequency performance enable smaller solution sizes compared to traditional thick-film chip ferrite beads. Ferrite beads are used as low pass filters to eliminate high frequency noise while allowing low frequency signals or DC current to pass through a circuit. Coilcraft wirewound ferrite beads feature a ferrite construction and heavy gauge wire for high current handling. They provide extremely low DCR while maintaining high filtering impedance across a wide bandwidth – up to GHz band. These features enhance the performance of the choke circuit while potentially reducing board space by replacing a larger chip ferrite bead with an equivalent, or higher-performing wirewound ferrite bead. Coilcraft offers 11 families of wirewound ferrite beads, all of which are RoHS-compliant and halogen free. Three models (the 0603LS, 0805LS and 1008LS) are qualified to AEC-Q200 Grade 3 standards (-40° to +85°C ambient), making them suitable for automotive and other harsh-environment applications.
Samtec Announces New VITA 57.4 FMC+ Development Kits with FireFly Optical Engines
Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the two new FireFly™ FMC+ Development Kits. The first supports data rates of 25 Gbps per channel while the second runs at 28 Gbps per channel. These new solutions offer easy-to-use evaluation and development platforms for Samtec’s FireFly™ optical engines. Samtec’s 25/28 Gbps FireFly™ FMC+ Modules provides up to 400/448 Gbps full-duplex bandwidth over up to 16 channels from an FPGA/SoC to an industry-standard multi-mode fiber optic cable. The new kits support protocols including Ethernet, InfiniBandTM, Fibre Channel and Aurora typically found in Video, Mil/Aero, Embedded Computing, Instrumentation, HPC and Date Center applications. FireFly™ optical engines make the electrical to optical conversion in the transmit path and the optical to electrical conversion in the receive path. They are based on proven MultiMode optics and support cable lengths up to 100 m. As a VITA 57.4-compliant FMC+ Module, Samtec’s new solutions can be used for optical data communication on any FPGA/SoC development platform that supports the VITA 57.4 interface. Both kits can run system data or BERT testing from a single channel to all sixteen channels in parallel. Technical documentation and FPGA reference designs are available for quick start-up. “Evaluating 100 Gbps/112 Gbps optical engine technology has high barriers of entry,” said Matt Burns, Product Marketing Manager at Samtec, Inc. “Samtec’s new FireFly™ FMC+ Development Kits simplify the evaluation and development of FireFly™ technology by using the emerging FMC+ interface typcal of high-performance FPGA/SoC development tools.”
Mouser Offers Intel RealSense D400 Series Depth-Sensing Cameras with Unparalleled Functionality and Size
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is now stocking the Intel®RealSense™ D400 product family. Built specifically to help embedded systems sense, understand, interact and learn from real-world environments, the Intel RealSense D400 product family offers designers a comprehensive platform of ready-to-use cameras, depth modules and vision processors that deliver embedded depth-sensing technology, real-time processing, and high-speed 3D imaging that is versatile and robust for a variety of indoor and outdoor applications.Mouser Offers Intel RealSense D400 Series Depth-Sensing Cameras with Unparalleled Functionality and SizeThe Intel RealSense D400 product family, available from Mouser Electronics, includes two depth-sensing cameras: the D415 and D435. Both incorporate the latest Intel RealSense Vision Processor D4 to handle the complex depth algorithm, and use stereo image sensors to capture and calculate disparity between images. The D415 camera features a rolling shutter stereo camera pair, standard infrared (IR) projector and a full HD RGB camera that is ideal for stationary and slow-moving applications. The D435 camera, by contrast, features a global shutter stereo camera pair, wide IR projector and a full HD RGB camera, which is more suitable for applications such as virtual reality (VR) or robotics. Both cameras deliver low light performance with less than 1 lux minimum sensitivity and use a USB 3.0 connection with power over USB. Both cameras offer a depth stream output resolution of up to 1280 × 720 px with a frame rate of 30 fps.For higher volume embedded applications, Intel offers the Vision Processor D4 and Depth Module D400 Series, also available from Mouser Electronics. The compact Vision Processor D4 computes high-resolution 3D depth maps in real time without requiring a dedicated GPU or host processor when paired with RealSense Depth Modules. The D400 Depth Module Series can capture indoor or outdoor environments with long-range capabilities, high-depth resolution and IR stereo, and are offered with multiple options, including standard or wide field of view, rolling or global shutter technology and passive or active IR depth sensing.The Intel RealSense Depth Camera D400 product family is supported by a cross-platform (Windows, Linux, macOS) and open-source software development kit (SDK), which features libraries, wrappers, computer vision sample code and tools to help designers start coding projects and debugging camera settings. Additionally, designers can quickly download the Intel RealSense viewer for use with either the D435 or D415 Depth Camera to quickly evaluate the D400 product family.
Xilinx Zynq UltraScale+ SoC module with two memory channels
The Mercury XU5 SoC module from Enclustra is an extremely powerful all- rounder. Based on the Xilinx Zynq UltraScale+ MPSoC, it features 6 ARM cores, a Mali 400MP2 GPU, up to 10 GByte of extremely fast DDR4 SDRAM, numerous standard interfaces, 178 user I/Os and up to 256,000 LUT4 equivalents. Thanks to two independent storage channels – one on the PS and one on the PL – it achieves memory bandwidths of up to 24 GByte/sec. Mars XU3The Mercury XU5 MPSoC module from FPGA specialists Enclustra features more direct interfaces to the FPGA fabric, in addition to a Gigabit Ethernet connection as well as up to 2 GByte DDR4 SDRAM. The module, with dimensions of just 56 × 54 mm, has up to 8 GByte DDR4 ECC SDRAM connected directly to the processing system, 16 GByte eMMC flash memory as well as various standard interfaces, such as Gigabit Ethernet, USB 3.0, a display port, SATA and SGMII. Both the processing system and the FPGA matrix boast four PCIe® Gen2/3 connections. The Xilinx Zynq UltraScale+ MPSoC is manufactured in a 16 nm FinFET+ process and comes equipped with 6 ARM cores – four 64-bit ARM CortexTM- A53 with a clock rate of up to 1333 MHz as well as a 600 MHz fast 32-bit ARM® dual-core CortexTM-R5. The processors are supported by a MaliTM 400MP2 GPU and a H.264/H.265 video codec (EV variants). - Reference design and Linux at the push of a button Enclustra offers broad design-in support for their products. With the Mercury PE1-200 baseboard, the Mercury XU5 is a powerful development and prototyping platform. Further expansion options are provided by the LPC FMC connector on the PE1 base board, which is compatible with a wide range of plug-in cards from various manufacturers - ADCs, DACs, motor control cards and RF links are just a small selection of the possibilities on offer. Enclustra also offers a comprehensive ecosystem for the XU5, offering all of the hardware, software and support materials required. Detailed documentation and reference designs make it easy to get started, in addition to the user manual, user schema, a 3D-model (STEP), PCB footprint (Altium®, OrCAD®, PADS®, EAGLE®) and differential I/O length tables. The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and base board are selected by a graphical interface. Afterwards, the Enclustra Build Environment downloads the appropriate Bitstream, First Stage Boot Loader (FSBL) and the required source code. Finally, U-Boot, Linux and the root file system, which is based on BusyBox, are compiled. Thanks to the family concept with compatible connectors, different types of modules can be used on the same base board. If, for example, an ARM processor is not required, the Mercury KX1 FPGA module can be used on the same base board instead.
Fujikura Europe Announces Launch of its New Smart Single Fibre Fusion Splicer: The 41S
Fujikura Europe, leaders in connectivity and splicing technology, has announced the launch of its latest single fibre active cladding alignment fusion splicer. Designed for FTTX applications, the next-generation smart 41S splicer boasts innovative features in a compact and robust package. Wirelessly connecting to the CT50 fibre cleaver using Bluetooth technology, the 41S enables a range of pioneering functions that will improve the overall installation time, cost and efficiency for operators. Compared to its predecessor the 22S, the 41S has been upgraded and offers installers the convenience of a 5” colour touch-panel display, improved v-groove illumination and the benefit of easy splice protector positioning. The machine re-assures users of reliable splice results using CORE loss estimation using Warm Image Splicing Technology. The issue of poor fibre cleaving due to worn, incorrectly adjusted or damaged cleaver blades is conveniently dealt with. When the 41S detects a high cleave angle or bad end shape, it sends a blade position change instruction to the cleaver. The CT50 cleaver then rotates the cleaver blade automatically to the next position, restoring optimum cleaving performance. By utilising the low radio power of Bluetooth technology, other equipment nearby will not be interfered with. Operators can benefit from the “always on” technology due to the low power consumption of the Bluetooth, which means that batteries can last for several months. “To ensure optimum results, fibres need to be spliced in a safe, hassle-free and efficient manner to avoid unnecessary, extra work for operators,” said Neil Bessant at Fujikura Europe. “Cleaving fibres using a cleaver without the benefit of wireless connectivity for an operator is a tricky, and often a less than successful game to play. If multiple errors are made it leads to increased costs to replace the fibres, as well as lost time and ultimately a decrease in overall optical performance. “Our latest addition to the splicing family, the 41S, is flexible, smart and efficient and therefore makes a huge difference to this process. The easy-to-handle qualities of the solution means quick and simple splicing, with performance never being compromised.” In addition to cleave performance, the smart splicer can also wirelessly monitor battery and power usage of the CT50 cleaver. The 41S comes enabled with a touch screen menu as standard, but also maintains the traditional easy-to-use hard button navigation system. The splicer retains all of the unique, class-leading features from the current high-performance flagship line-up of Fujikura splicers, including: quick splice and heat times, fully ruggedized features, and user customizable settings. The 41S, along with a full range of Fujikura Europe’s fibre optic solutions, will first be displayed at ECOC (European Conference on Optical Communication) in Rome, Italy from the 24th – 26th September 2018
Samtec Introduces new VITA 42 XMC 12 mm mated connector sets
As an ANSI/VITA member, Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, is proud to release new connector sets compliant with the revised ANSI/VITA 42.0-2016 XMC Standard. VITA 42 XMC defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed form factor. This revision further defined the concept for the preferred Standard connectors in XMC applications including: Solder ball attachment replaced Paste-On-Pad (POP) for improved solder joints Low Insertion Force (LIF) sockets to ease mating and un-mating Tin-lead alloy available as a solder option Revised ASP catalog numbers 12 mm stack height Based on these guidelines, Samtec is proud to release 12 mm stack height options expanding the existing family of ANSI/VITA 42 XMC Standard connectors. Chosen for high reliability stemming from the multipoint-of-contact SamArray® sockets and robust solder ball design, the updated connector set has been specified for current XMC systems. Samtec's growing catalog of XMC connectors enable switched communication between a mezzanine card and its carrier. In addition to transmitting sensitive high-speed data, these connectors provide power, ground, and auxiliary signals to the mezzanine. The 12 mm mated connector set further optimizes XMC cards for use in wider modules, designed for 1.00" pitch cage systems. “We were excited at the opportunity to update VITA 42.0, bringing the specified connectors to the state-of-the-art,” said David Givens, Standards Director. “Since the Standard was launched, Samtec supported hundreds of system designers who expressed the need for an alternative to Paste-On-Pad attachments while providing Low Insertion Force contacts.” For more information on Samtec’s complete line of VITA 42 XMC or SamArray® solutions, please email our technical experts at XMC@samtec.com or visit https://www.samtec.com/xmc
Mars XU3: The Xilinx Zynq UltraScale+ MPSoC module able to deal with any circumstances
With the Mars MA3, Enclustra presents the most powerful SoC module based on the Xilinx Zynq UltraScale+ MPSoC in the Mars form factor. It features up to 6 ARM cores, a Mali 400MP2 GPU, up to 4 GByte of extremely fast DDR4 SDRAM, numerous standard interfaces, 108 user I/Os and up to 154,000 LUT4 equivalents. The Mars XU3 SoC module from FPGA specialists Enclustra provides a quick and easy introduction to the Xilinx Zynq UltraScale+ MPSoC technology. It comes in the extremely compact and well-established SO-DIMM form factor and is optimised for applications that require the greatest processing power possible in the smallest of spaces, without having to make any compromises when it comes to functionality. The Mars XU3 series offers up to 154,000 systems logic cells, 108 user I/Os, up to 6 ARM processors, a Mali 400MP2 GPU (only EG variants), up to 4 GByte of ultra-fast DDR4 SDRAM, 64 MByte QSPI flash memory, 16 GByte eMMC flash memory as well as Gigabit Ethernet and USB 2.0/3.0 ports, all on a surface area measuring just 67.6 × 30 mm. A heat sink developed for the Mars XU3 is available for optimum heat dissipation. It's compact design (less than 7 mm in height) and a mounting slot in the centre of the heat sink makes it easy to attach fans of different sizes. The Mars XU3 SoC module has a planned availability of 10 years. - Reference design and Linux at the push of a button Enclustra offers broad design-in support for their products. With the Mars EB1 base board, the Mars XU3 is a powerful development and prototyping platform. Enclustra also offers a comprehensive ecosystem for the Mars XU3, offering all of the hardware, software and support materials required. Detailed documentation and reference designs make it easy to get started, in addition to the user manual, user schema, a 3D-model (STEP), PCB footprint (Altium®, OrCAD®, PADS®, EAGLE®) and differential I/O length tables. The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and base board are selected by a graphical interface. Afterwards, the Enclustra Build Environment downloads the appropriate Bitstream, First Stage Boot Loader (FSBL) and the required source code. Finally, U-Boot, Linux and the root file system, which is based on BusyBox, are compiled. Thanks to the family concept with compatible connectors, different types of modules can be used on the same base board. If, for example, an ARM processor is not required, the Mars AX3 FPGA module can be used on the same base board instead.
Tupl Announces PoC with SoftBank in Japan to Provide IoT Solutions for the Sharing Industry
Tupl, a market leader in automation for the wireless industry, today announced a new PoC (Proof of Concept) with SoftBank to provide an IoT solution for SoftBank’s sharing services such as a shared parking service and a shared bicycle service. Through this PoC, Tupl will provide its AI engine “TuplOS”, which leverages AI technology, to build a model and application that is integrated with SoftBank's data. The turn-key platform will be able to predict demand as well as revenue generation for sharing services all within an accessible user interface. Petri Hautakangas, Tupl CEO, said: “We will provide SoftBank with the technology and tools to grow a potentially significant market segment within the sharing economy. We're looking forward to working with SoftBank, and further showcasing how our TuplOS platform and our use cases are expanding outside of the telecommunications market and into other key branches of the wireless industry, such as IoT.” In recent years, the sharing economy has been expanding into a wide variety of market segments. As part of the initiative for the growing market, SoftBank is going to work with business partners such as enterprises and individuals through its sharing services by leveraging SoftBank’s own IoT platform which manages IoT sensors. Tupl’s AI engine will be combined with the Softbank IoT platform to create new value to the services by predicting demand and revenue generation. Tupl offers AI and machine learning-based solutions that dramatically reduce operational costs and enable easy scalability. The TuplOS AI Engine builds effective models and solutions using partner data, which can be leveraged to create automation-powered products and applications for internal or commercial use.
HUBER+SUHNER launches world-first 230V AC cable system
HUBER+SUHNER, leading manufacturer of components and systems for optical and electrical connectivity, is tackling the increasing power and expansion challenges faced as 5G approaches, with the launch of its one-of-a-kind hybrid cabling system solution for remote radio installations. The pre-connectorised factory-sealed solution, the MLUH HV, has the features of the HUBER+SUHNER MASTERLINE Ultimate Hybrid (MLUH), yet offers a slimmer, lighter and more flexible solution. The cable is fast and easy-to-install, supports up to 12 remote radio heads (RRHs) and connects them with easy-to-install Q-ODC fiber optic jumpers and power jumpers. The latest addition to the HUBER+SUHNER MASTERLINE portfolio is able to deliver power at 230V AC directly to the radio heads, reducing loss and allowing higher power consumption for future 5G network equipment. Installers can achieve the same distance between the power source and radio head while utilising smaller diameter of the MLUH HV cable. “Ultimately, operators can save on capital expenditure with our new cable offering as less copper is used,” said Miroslaw Mrozik, Head of Product Management at HUBER+SUHNER. “The MLUH HV boasts higher power capabilities in a single cable, is flexible, future-proof, and easy-to-install. Fast and reliable rollouts for timely projects come together with reduced total cost of ownership, as no other product offers such a high-quality solution in an AC voltage compliant setting.” More information about the MASTERLINE Ultimate Hybrid High Voltage (MLUH HV) cable can be found at www.hubersuhner.com
Mouser Electronics New Product Insider : June 2018
Mouser Electronics, Inc. specializes in the rapid introduction of new products and technologies. As the industry leader in New Product Introductions (NPIs), Mouser makes it a priority to stock the newest products and technologies from our 700+ manufacturer partners, giving customers an edge and helping speed time to market. February 2018 Product Insider Last month, Mouser launched more than 218 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Texas Instruments OPT8241 Time-of-Flight Sensor Texas Instruments OPT8241 sensor combines time-of-flight (ToF) sensing with an analog-to-digital converter (ADC) and a versatile, programmable timing generator. The OPT8241 offers QVGA 320×240 resolution data at frame rates up to 150 fps. Semtech SX1261/SX1262 LoRa® Transceivers Designed for extended battery life with just 4.2 mA of active receive current consumption, the Semtech SX126x sub-GHz radio transceivers are ideal for long-range RF wireless applications and are fully compliant with the physical layer requirements of the LoRaWAN specification released by the LoRa Alliance™. Arduino MKR IoT Bundle The Arduino MKR IoT Bundle includes a powerful Arduino MKR1000 board — which combines the functionality of the Arduino Zero with a Wi-Fi Shield — and components for 5 IoT projects with step-by-step online tutorials on the Arduino Project Hub online platform. Bourns ChipGuard® ESD Suppressors Bourns ChipGuard ESD suppressors are multilayer varistor (MLV) products designed to protect against electrostatic discharge (ESD) strikes. To see more of the New Product Insider highlights, go to www.mouser.com/newproductinsider
Samtec Releases Industry Leading Ultra-Fine Pitch, High-Density Edge Card
Samtec announces the release of the industry’s first 0.50 mm pitch edge card socket (MEC5) with justification beam. This design meets the demands for decreased size and increased speeds, while also optimizing cost. The socket’s justification beam is designed to shift the card into proper alignment with the contacts. This allows for standard board tolerance on cards that would typically not work with ultra-fine pitch connectors. This optimizes manufacturing costs with a 30-50% PCB cost savings and a high yield for standard cards. The extreme density of this ultra-fine 0.50 mm pitch edge card socket provides incredible space savings compared to more common 0.80 mm pitch solutions. Available in both vertical (MEC5-DV) and right-angle (MEC5-RA), this socket features up to 300 total I/Os for high-density applications. In order to meet the industry’s demands for speed, the vertical socket is designed for 28 Gbps NRZ/56 Gbps PAM4 performance. Both orientations are designed to handle PCIe® Gen 4 signaling. “I’m excited to announce the release of the MEC5 edge card system as it will add another layer to Samtec’s already vast edge card offering,” said Terry Emerson, high-speed product manager at Samtec, Inc. “The ability to use standard board tolerances, on such a tight pitch, is not something currently found in the industry. This will allow our customers to pass high-speed signals through an incredibly dense connector while keeping the mating PCB at a reasonable cost.” Rated to 1.5 A per contact, this system accepts .062” (1.60 mm) thick cards and features standard alignment pins and card polarization. Choice of through-hole or surface mount rugged weld tabs are available for a secure connection to the board. For more information, please visit Samtec’s Micro Edge Card Systems webpage.
Samtec Announces Release of New VITA 74 VNX Compliant Products
As an ANSI/VITA member, Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly supports the release of the new ANSI/VITA 74.0-2017 Small Form Factor Base Standard. VITA 74, also referred to as VNX, defines both the mechanical and electrical standards necessary for a small form factor (SFF) system. Designed for deployment in rugged environments, VNX systems provide rapid serial fabric interconnects in a plug-in module format. These systems also feature improved size, weight, and power (SWaP) characteristics, crucial in an embedded system. Samtec’s SEARAY™ right-angle connectors are featured in the VITA 74 base standard, which specifies 12.5 mm and 19 mm stack height plug-in modules. SEARAY™ right-angle is capable of speeds up to 25 Gbps, provides low insertion/extraction forces, and also features solder charge terminations. This connector was chosen based on its successful performance in the VITA 57.1 FMC Standard, as well as its high-speed capabilities and rugged design. “The release of the ANSI/VITA 74 VNX Standard provides system designers with the ability to extend proven VPX technology into smaller form factor systems,” said David Givens, Standards Director. “Through the use of the proven Samtec SEARAY™ connectors, the Standard supports current generation rapid serial fabric interconnects such as 3rd Generation PCI Express®. Given the outstanding SEARAY™ performance, the Standard is ideally positioned to support future generation fabrics as they become entrenched in the rugged embedded system marketplace.” For more information on Samtec’s complete line of VITA 74 VNX or SEARAY™ right-angle solutions, please email our technical experts at VNX@samtec.com or visit https://www.samtec.com/standards/vita/vnx
Rainbow Technology Systems to Showcase Biosensor Capability
Rainbow Technology Systems , based In Glasgow, has leveraged its knowledge and expertise in printing, chemistry, design and engineering to further strengthen its' capability in the development and production of biosensors. David Westwood, Rainbow Technology Systems sales and marketing manager, who will be presenting at the BioDot Operon conference in Zaragoza, Spain (15-17 May), said: The complexity of processes required to both efficiently and economically produce sensors in their millions presents challenges to the industry. At Rainbow we are proud to be able to deliver a range of products and services that meet these challenges and which enable customers to acquire a broad range of capabilities from one partner, Rainbow Technology." By definition, a biosensor is a device which uses a living organism or biological molecules, especially enzymes or antibodies, to detect the presence of chemicals. It is an analytical device which converts a biological response into an electrical signal, so the finished product requires a controlled transformation of a base carrier material into useable individual sensors involving a complex additive process and precision handling of the sensors during production. Rainbow Technology Systems is one of the UK's leading process design and manufacturing specialists. With in-house laboratories, printing, 3D design suites and product fabrication, Rainbow Technology Systems is ideally positioned to help customers with the following specialist capabilities: - Biosensor design and prototyping - Biosensor printing - Complete automated biosensor processing to include handling, cropping, cleaning, alignment, dosing, singulation and packing. Rainbow Technology Systems, whose projects include the design and assembly of a fully automated process line for one of the world's leading manufacturers of water testing kits, continues to invest in highly skilled engineers to accommodate increased demand for its' products and services.
Tracealyzer 4 now supports Micrium µC/OS-III and Arm ITM Tracing
Percepio, the leader in software trace visualization for embedded systems and IoT, announces Tracealyzer version 4.1 with support for Micrium µC/OS-III, in addition to the already supported Amazon FreeRTOS and Keil RTX5. “Tracealyzer 4 is a massive improvement over previous versions and as we have been working closely with Micrium since 2013, supporting µC/OS-III has been a priority for us. Many users have asked for this and we are excited to bring the next generation in RTOS tracing to Micrium µC/OS-III users,” says Johan Kraft, CEO of Percepio. Developers using Micrium µC/OS-III can now benefit from the many new features in Tracealyzer 4, such as unlimited tracing, advanced live visualization, a new modern user interface and user-defined visualization. IIn addition, the new release introduces support for RTOS tracing via ITM (Instrumentation Trace Macrocell), a feature available on many ARM Cortex M-based MCUs. Streaming trace data via ITM can be very fast; in lab tests Percepio has achieved transfer speeds exceeding 2 Mbytes/s. Moreover, with ITM there is no need for a RAM buffer in the target. This allows for RTOS tracing with minimal overhead. Read more about the technology here: https://percepio.com/2018/05/04/tracealyzer-streaming-over-arm-itm-using-ulinkpro-ulinkplus/ Support for ITM tracing is initially available for Keil µVision with FreeRTOS and Micrium µC/OS-III, but support is planned for other RTOSes and development tools soon. Tracealyzer 4.1 is available for download at percepio.com. Those not yet familiar with Tracealyzer 4 can find a summary of the new capabilities at https://percepio.com/this-is-tracealyzer-4/