Samtec and REFLEX CES Launch New 448 Gbps (16 x 28 Gbps) Embedded Optical Development Platform at SC19
New Compact, High-efficiency Power Inductors Optimized for 48 V Automotive Applications
QNAP Launches Dual Port 16Gb/32Gb Fibre Channel Expansion Cards
Avalue high-performance SOM provide AIoT solutions in harsh environment
QNAP Introduces QXG-10G2T-107, a Dual-port 5-Speed 10GBASE-T NICfor NAS or PC
Coilcraft Releases Two New Low-profile 0402-sized Chip Inductors
QNAP Launches Cost-Effective TVS-x72N Series NAS Featuring 5GbE/2.5GbE Connectivity, Intel Core i3 Processors, and SSD Caching
KDPOF Will Demo Galvanic Isolation of Gigabit Ethernet POF at IEEE-SA Technology Day and ELIV VDI Congress
Faster surfing with the first small cell antennas for 5G
Xilinx Zynq UltraScale+ high memory bandwidth MPSoC module
QNAP Releases QTS 4.4.1 Beta 4 Version, Delivering Optimal User Experience and Quality, Reliable Services
Taipei, Taiwan, August 16, 2019 – QNAP® Systems, Inc. (QNAP) today released QTS 4.4.1 beta 4, the latest version of the acclaimed QNAP NAS operating system. QTS 4.4.1 beta 4 has added many useful features, including a list of improvements and enhancements from the previous version. Starting from today, QNAP NAS users will receive QTS 4.4.1 beta 4 update. New Features Control Panel - Multimedia Console ▷ Replaced Multimedia Management with Multimedia Console, which integrates media indexing, transcoding, thumbnail generation, and content management, allowing users to manage multimedia applications and services more efficiently. Multimedia Console also provides the following features: ▷ Browse content in various multimedia applications in Content Management after adding folders as content sources ▷ Monitor the status of all multimedia applications and services ▷ Configure content sources for Qsirch advanced photo indexing File Station ▷ File Station now supports converting Apple iWork file formats to Microsoft Office file formats using CloudConvert. ▷ Added support for restoring QDFF files and folders with HBS 3 in File Station. PostgreSQL ▷ Added support for PostgreSQL 11.4. Desktop ▷ Changed the password requirements to enhance system security. Storage Management ▷ Added support for Marvell QLogic Fibre Channel host bus adapters for the following NAS models: TS-832X, TS-432XU, TS-432XU-RP, TS-832XU, TS-832XU-RP, TS-1232XU, TS-1232XU-RP, and TS-1635AX Enhancement QTS Security ▷ "IP Access Protection" is enabled by default for the SSH, Telnet, and HTTP(S) protocols to enhance system security. Fixed Issues ▷ Users could not wake the NAS using Wake-on-LAN in Qfinder Pro after updating QTS to 4.4.1.0978 build 20190626. ▷ The system fan speeds on the TVS-682 would increase abnormally after users updated QTS from 4.3.6 to 4.4.1. ▷ Storage & Snapshots would change the volume names on the TR-004 expansion enclosure after users updated QTS to 4.4.1. ▷ Dashboard would not display the fan information of the QM2-2S expansion card after users updated QTS to 4.4.1. ▷ The "create folder" and "upload" icons would disappear from the toolbar in File Station when users browsed subfolders. ▷ The Marvell Qlogic QLE2562-CK Fibre Channel host bus adapter could not successfully connect to the NAS. ▷ Qfiling could not decrypt files encrypted in File Station with passwords containing multibyte characters, or vice versa. ▷ Users could not replace disks one by one for a legacy volume after updating QTS to 4.4.1.
Mouser Electronics Now Stocking Broad Portfolio of Xilinx Products
Mouser Electronics, Inc. today announces a new global distribution agreement with Xilinx, Inc., the leader in adaptive and intelligent computing, to stock one of the industry’s broadest portfolios of Xilinx products, including digital downloads of development software and IP. Xilinx is the inventor of the FPGA, hardware programmable system-on-chips (SoCs) and the adaptive compute acceleration platform (ACAP), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future. “Xilinx is an industry leader and proven innovator in new technologies. We are very excited to expand our product portfolio for our customers by now offering a broad in-stock suite of Xilinx products and tools,” said Glenn Smith, Mouser President and CEO. “We look forward to assisting Xilinx expand its global customer base and revenue with our focus on e-commerce and new product introductions for design engineers.” “With Mouser’s exceptional customer service for engineers, world-class logistics, and expansive customer base, we are very excited to add them to our global distribution channel,” said Mark Wadlington, Senior Vice President of Global Sales at Xilinx. “We expect this to be the beginning of a long and successful relationship.” Mouser is stocking the full breadth of Xilinx products, including Zynq SoCs and MPSoCs, plus ACAPS, FPGAs, 3D ICs, RFSoCs, accelerator cards, evaluation boards, system on modules, FPGA mezzanine cards, embedded development platforms, and more to help expedite the design process. With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.
QNAP Introduces QSW-308-1C and QSW-308S, the Cost-optimized10GbE Switches for Home and SOHO Users
QNAP® Systems, Inc. (QNAP), a leading computing, networking and storage solution innovator, today released the QSW-308-1C and the QSW-308S, these 8-port Gigabit Unmanaged Switches feature three 10GbE SFP+ ports, and support both SFP+ and RJ45 ports for connecting network devices. The newly launched QNAP QSW-308 series switches provide a cost-effective 10GbE solution to satisfy various kinds of hybrid 10GbE/1GbE network infrastructures in homes and offices. The QSW-308-1C and QSW-308S are equipped with three 10GbE SFP+ ports and eight Gigabit ports for users to optimize high-speed networking. The QSW-308-1C includes one additional 10GbE SFP+/RJ45 combo port that is compatible with 10GbE and NBASE-T technologies to support five networking speeds (10Gbps, 5 Gbps, 2.5Gbps, 1Gbps and 100Mbps). The SFP+/RJ45 (copper) combo port enables users to realize higher network speeds with existing Cat 5e and 6a cables. "The QNAP QSW-308 switch series offers a highly cost-optimized 10GbE solution for home and SOHO users," said Boden Chen, Product Manager of QNAP, adding "The QNAP QSW-308 switch series features the integration of SFP+ and RJ45 ports, allowing it to meet versatile network infrastructure deployment requirements. When integrated with QNAP 10GbE NAS, Network Adapters and Expansion Cards, the devices can empower many types of bandwidth-demanding tasks, while enabling you to easily connect to 10GbE-capable workstations or servers for an enhanced productivity network environment." The desktop-sized and fanless QNAP QSW-308 switch series is sleekly-designed to blend in with other devices in digital homes and offices. It also features plug-and-play for simple set-up, auto-negotiation for optimal speed, and performs duplex detection when connecting devices. Key specifications • QSW-308-1C: 11-port (3 10GbE SFP+ fiber ports, 1 SFP+/RJ45 copper combo port and 8 Gigabit RJ45 ports) • QSW-308S: 11-port (3 10GbE SFP+ fiber ports, 8 Gigabit RJ45 ports) Fanless design; Auto Negotiation; QSW-308-1C compatible with 10GbE and NBASE-T technologies to support five network speeds (10Gbps, 5Gbps, 2.5Gbps, 1Gbps, and 100Mbps).
Panasonic to Launch Full-scale Mass Production of an Automotive "Board to FPC Connector"
Panasonic Corporation announced today that it will launch full-scale mass production of a "Board to FPC Connector" (Series name: CF1) in July 2019, which allows the use of fewer components and fewer assembly person-hours for vehicles, as well as making room for improved design of automotive LED lights, etc. Due to the increasing use of DRLs (daylight running lamps)  following changes in the law governing automotive LED lights in Europe and Japan in recent years and improved designs for vehicle compartment instrument panels, etc., demand for automotive FPCs is expected to grow, accompanied by greater use in cable connection applications such as BMSs . Panasonic has designed and commercialized a connector with a unique structure that allows direct connection between the automotive FPC and the board. This connector eliminates the need for wire harnesses previously needed for connection, allowing the use of fewer components and fewer assembly person-hours, as well as enabling vehicle weight reduction and therefore lower fuel consumption. . Panasonic's new Board to FPC Connector has the following features: 1.Panasonic's unique metal terminal connection structure, which allows direct connection between the FPC and the board, eliminates the need for relay harnesses, allowing the use of fewer components and assembly person-hours. 2.The connector's double-clip contact structure achieves excellent resistance to vibration, making it compatible with automotive applications such as LED lights and BMSs. 3.The connector's inertial lock structure prevents incomplete engagement, achieving high reliability. Product Features 1.Panasonic's unique metal terminal connection structure, which allows direct connection between the FPC and the board, eliminates the need for relay harnesses, allowing the use of fewer components and assembly person-hours. Opportunities for the use of FPCs have been expanding with the increasing refinement of the design of DRLs, rear lamps, vehicle compartment instrument panels, shift levers, etc. Although FPCs and boards are conventionally connected mainly by using relay harnesses or by soldering FPCs and boards, there are drawbacks such as the additional weight and poor assembly workability of wire harnesses. By adopting a unique structure that allows direct connection between the FPC and the board, this connector eliminates the need for relay harnesses, allowing the use of fewer components and assembly person-hours. 2.The connector's double-clip contact structure achieves excellent resistance to vibration, making it compatible with automotive applications such as LED lights and BMSs. Automotive connectors are required to meet strict vibration criteria. This connector has achieved excellent resistance to vibration by adopting a unique double-clip contact structure that reliably grips the plug, i.e., the metal terminal (FPC side), and the receptacle (board side). The connector can also be used for FPCs for connecting BMS battery packs and boards, as well as for LED lights that require resistance to vibration. 3.The connector's inertial lock structure prevents incomplete engagement, achieving high reliability. The connector, which is a two-piece type consisting of a plug (FPC side) and a receptacle (board side), is designed for easy connection. Furthermore, the connector has achieved high reliability by adopting an inertial lock structure capable of preventing incomplete engagement between the receptacle and plug during assembly. . Suitable Applications: Cable connection for DRLs (headlamps), rear lamps, side mirrors, instrument panels, shift levers, steering switches, BMSs, cameras, etc.. Area of Sales: Global . Basic Specifications: - Rated current: Max. 2.0 A/pin - Rated voltage: 50 V DC - Ambient temperature: -40 to +125°C - Contact resistance: Max. 20 mΩ (Initial) - Insulation resistance: Min. 100 MΩ - Dielectric strength: 1000 V AC for 1 min. - Housing retention force: Min. 30 N (Initial) . [Term Descriptions]  FPC (Flexible Printed Circuit) Flexible circuit board  Wire harness Set (bundle) of electric wires for power supply and signal communication, used for in-vehicle wiring, etc.  DRL (Daylight Running Lamps, Daytime Running Lights) Lighting device that is also lit during the daytime  BMS (Battery Management System) Voltage monitoring system for lithium-ion batteries .
QNAP Partners with ATTO on Integrated Fibre Channel SAN Solution
QNAP® Systems, Inc. (QNAP) a leading computing, networking, and storage solution innovator, today announced a partnership with ATTO Technology Inc. (ATTO), to jointly deliver integrated Fibre Channel (FC) SAN Solution, allowing users to add QNAP NAS to their existing SAN environment hassle-free and at a more affordable price than typical SAN devices. The new FC SAN solutions builds upon QNAP’s recently added FC support technology for QTS 4.4.1 and later versions. Representatives from Solkenix, ATTO’s exclusive agent in Taiwan, will join QNAP product managers to jointly introduce the Integrated Fibre Channel SAN Solution at 17:00 (UTC+8) on July 9, 2019. During the Live Stream, Scott Hu, Director of Solkenix, Amber Hu. Marketing Manager of Solkenix, and QNAP Product Manager will demonstrate how to deploy the FC SAN environment with QNAP NAS, ATTO Celerity™ 32Gb/s and 16Gb/s FC cards, and explore diverse enterprise applications in QTS. “The FC SAN Solution comprised of QNAP NAS with ATTO FC Cards offers highly-reliable, flexible, and cost-effective storage and back-up services.” said Jason Hsu, Product Manager of QNAP, adding “QNAP NAS also provides a multitude of enterprise features to make storage applications more efficient, including LUN snapshot protection, Qtier™ tiering storage, SSD cache acceleration, and other features to realize Copy Data Management (CDM) applications.” Additionally, QNAP and ATTO will launch the FC SAN Storage Trial Program to invite interested SAN users the opportunity to experience the new FC SAN Solution. Selected applicants will win one QNAP NAS and one Fibre Channel Card for testing in their existing SAN environment. For more details and the latest announcements, please see the QNAP website. QNAP and ATTO will live stream the Integrated Fibre Channel SAN Solution introduction at 17:00 (UTC+8) on July 9, 2019.
Mouser Electronics Further Expands Headquarters, Global Presence, and Widest Product Selection to Meet Growing Demand
Mouser Electronics, Inc. is greatly expanding its large global headquarters and distribution center to meet the needs of its flourishing business well into the next decade. Construction is under way to add more than 125,000 square feet to the distribution center, as well as a new 50,000 square-foot office building on Mouser’s campus, located south of Dallas-Fort Worth, Texas. Upon completion of the new construction, Mouser’s 78-acre global headquarters and massive distribution center will consist of 1 million square feet to accommodate Mouser’s vast inventory of 1 million unique SKUs for products and technologies from over 750 electronic component manufacturers. With a positive industry outlook, double-digit revenue growth and the addition of many new manufacturer partners, the industry-leading electronic components distributor is expanding its global footprint and growing its business position to meet increasing customer demand worldwide. In 2018 Mouser’s sales hit $1.9 billion, and the company is on track to surpass that number this year. All this comes as Mouser has expanded its full-time global workforce to more than 2,400 and is set to provide local customer service in four new global locations: Brazil, Poland, Vietnam, and the Philippines. “With the rapid increase in technological advancements such as IoT, electric vehicles, artificial intelligence, robotics, and 5G, we definitely find ourselves in a very robust and fortunate position,” explained Glenn Smith, Mouser’s President and CEO. “We are planning for future growth as our customer needs increase.” An industry leader in new product introductions, Mouser stocks the widest selection of authorized components and continues to expand its vast line card with additional manufacturers from major electronic component product categories, including semiconductors, embedded modules, optoelectronics, passives, interconnects and wire/cable assemblies, electromechanical, power, test and measurement, and tools. “Adding new products and manufacturers reinforces our steadfast commitment to our customers as a single destination for all the components and development tools necessary for the design process,” Smith added. “Our focus on providing the industry’s widest breadth of products is resonating with our growing customer base of engineers and procurement agents in every corner of the world.” Today, Mouser’s 24-hour global distribution center handles tens of thousands of orders per day, processing and shipping — same day in most cases — to over 600,000 customers in 220 countries/territories. Over the past several years, the global distributor has made significant capital investments in state-of-the-art, automated equipment to process orders with best-in-class efficiency and accuracy. With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.
Mouser Electronics Receives Record Number of Awards for Excellence from Manufacturer Partners
Mouser Electronics, Inc., is proud to announce that it has received a record 40 top business awards from its manufacturer partners for exemplary distribution performance during 2018 and 2019. A variety of reasons were cited for the awards, including double-digit sales growth, digital excellence, fastest new product introductions (NPIs), investment in inventory and breadth of inventory, best-in-class global logistics, successful marketing campaigns, customer growth, expanding footprint and commitment to teamwork. “We truly appreciate these top accolades from our valued manufacturer partners,” said Jeff Newell, Senior Vice President of Products at Mouser Electronics. “These awards celebrate the outstanding teamwork and commitment to customer service excellence that we mutually share. We are elated by this recognition.” Performance awards for excellence in 2018 and 2019 include: • TE Connectivity – Customer Expansion Awards for Japan, APAC and EMEA regions; Application and Tooling Business Unit Distributor of the Year 2018; Data and Devices Business Unit Distributor of the Year 2018 • Vishay Intertechnology – Overall Catalog Distributor of the Year; Semiconductor Catalog Distributor of the Year; e-Commerce Distributor of the Year for Europe • Molex – European e-Catalogue Distributor of the Year; APAC e-Catalogue Distributor of the Year • Bourns – e-Commerce Distributor of the Year • Amphenol Corporation – Best High Service — Digital Performance • Amphenol Industrial – Industrial Distributor of the Year • Amphenol SV Microwave – Distributor of the Year • ON Semiconductor – Global High Service Distributor of the Year • TDK – Sales Achievement Award for Highest Growth Distributor for Fiscal Year 2019; European Distribution Award 2018 in High-Service Distribution • TDK-Lambda – Exceptional Sales Growth for Fiscal Year 2019 • Digi International – NPI Partner of the Year • KEMET – Digital Marketing Partner of the Year • Littelfuse – High Service Distributor of the Year • HARTING – Global High Service Distributor of the Year; New Product Introduction Award • Epson America, Inc. – Greatest Increase in Customer Count • Ohmite – Chairman’s Award • Neutrik – Distributor of the Year — Top Revenue • JAE Electronics – Distribution Partner of the Year • FTDI Chip – Global Distribution Award • Kingbright – Achievement Award for Sales & Leads • Altech – Sales Achievement Award • Eaton – Partnership Award • Wakefield-Vette – Highest Percentage NPI POS Growth • Sunon – Fastest Growing Distributor of the Year • Yageo – Largest Customer Growth Award • Panduit – Consecutive Distributor POS Growth Year After Year • RAFI – Distributor of the Year • ECS Inc. – Distributor of the Year • RECOM – Distributor of the Year for International Sales Growth • Schaffner – Distributor Global Achievement Award • Keystone – Platinum Level Distributor Award With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.
Coilcraft Introduces New Family of Power Line EMI Chokes
Coilcraft’s new Cx Family of surface-mount common mode chokes includes 16 sizes/configurations for a broad range of power line circuits. They suppress high frequency common mode noise up to 100 MHz and offer greater than 40 dB common mode attenuation, making them ideal for use in consumer electronics and industrial applications. All Cx Family EMI chokes feature a low-profile, toroidal construction in a surface-mount, magnetically-shielded package with footprints as small as 13 x 13 mm. They are available with current ratings up to 10 Amps (Irms) and provide 1000/1500 Vrms isolation (hipot) between windings. They feature RoHS-compliant tin-silver-copper over tin over nickel over phos bronze terminations and withstand a maximum reflow temperature of 260°C. As with all Coilcraft parts, free evaluation samples and complete technical specifications for the Cx Family are available online at www.coilcraft.com. Parts are available from stock and can be ordered online at buy.coilcraft.com or by calling Coilcraft sales.
Samtec Features Latest 32gt/S Interconnect Solutions at PCI-Sig Developers Conference 2019
Samtec Inc. will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019. Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted. Demonstrations: • Scalable 32 GT/s Silicon Test Platform: Demonstration of configurable, next-generation GPU-based system combining a cable mesh backplane (AcceleRate® Slim Body Cable Assemblies) and next-generation Edge Rate® High-Speed Edge Card Connector topologies. • 56 Gbps PAM4 Active Product Demonstrator: The 56 Gbps PAM4 Active Product Demonstrator showcases Samtec’s comprehensive portfolio of high-performance interconnect in a typical data center chassis application. Technical Sessions: 1:00 PM Tuesday, June 18, 2019 - Kevin Burt Sr. System Architect – Optical Systems • Enable PCI Express® (PCIe® ) 5.0 System Design with Ethernet Architectures: As PCIe technology data rates increase to 32 GT/s, system SI becomes critical. As other interfaces (Ethernet, InfiniBand, etc.) achieve higher data rates, opportunities exist to leverage industry-wide techniques that optimize power, thermal efficiency and cost-effectiveness across the system. Samtec will explore options enabling PCIe technology system architects to achieve similar results. 11:30 AM Wednesday, June 19, 2019 - Steve Krooswyk Sr. SI Engineer • 2GT/s Test Platform for AI and ML Implementations: Confident SI evaluation in emerging AI/ML forms factors and cable mesh topologies requires realistic interconnect stress. Current length extenders and multiple PCIe topologies present challenges for adequate SI evaluation. Samtec will present the advantages of next-generation Scalable 32 GT/s Silicon Test Platforms. The demonstrations can be seen in the Samtec booth at PCI-SIG Developers Conference 2019 at the Santa Clara (CA) Convention Center. The conference is June 18-19, 2019.
Samtec Features Latest 32GT/s Interconnect Solutions at PCI-SIG Developers Conference 2019
Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019. Flexible Power MicroSamtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted. Demonstrations: Scalable 32 GT/s Silicon Test Platform: Demonstration of configurable, next-generation GPU-based system combining a cable mesh backplane (AcceleRate® Slim Body Cable Assemblies) and next-generation Edge Rate® High-Speed Edge Card Connector topologies. 56 Gbps PAM4 Active Product Demonstrator: The 56 Gbps PAM4 Active Product Demonstrator showcases Samtec’s comprehensive portfolio of high-performance interconnect in a typical data center chassis application. Technical Sessions: 1:00 PM Tuesday, June 18, 2019 - Kevin Burt Sr. System Architect – Optical Systems Enable PCI Express® (PCIe® ) 5.0 System Design with Ethernet Architectures: As PCIe technology data rates increase to 32 GT/s, system SI becomes critical. As other interfaces (Ethernet, InfiniBand, etc.) achieve higher data rates, opportunities exist to leverage industry-wide techniques that optimize power, thermal efficiency and cost-effectiveness across the system. Samtec will explore options enabling PCIe technology system architects to achieve similar results. 11:30 AM Wednesday, June 19, 2019 - Steve Krooswyk Sr. SI Engineer 2GT/s Test Platform for AI and ML Implementations: Confident SI evaluation in emerging AI/ML forms factors and cable mesh topologies requires realistic interconnect stress. Current length extenders and multiple PCIe topologies present challenges for adequate SI evaluation. Samtec will present the advantages of next-generation Scalable 32 GT/s Silicon Test Platforms. The demonstrations can be seen in the Samtec booth at PCI-SIG Developers Conference 2019 at the Santa Clara (CA) Convention Center. The conference is June 18-19, 2019.
TCG launches initiative to develop “world’s tiniest TPM”
Groundbreaking work to assure cybersecurity in the Internet of Things (IoT) era has been initiated, as the Trusted Computing Group (TCG) launched a new project to create the “world’s tiniest Trusted Platform Module (TPM).” Many manufacturers want to build devices that include Roots of Trust for Measurement (RTM), Storage (RTS) and Reporting (RTR) so that these devices can work securely within the TCG Measurement and Attestation framework. Today, TPM chips are used to implement the RTS and RTR in a highly secure manner. As IoT adoption continues to grow, a rising number of devices are so small that the inclusion of a full TPM chip might be impractical due to factors such as cost, space and power. TCG’s new Measurement and Attestation RootS (MARS) Subgroup has been formed to develop specifications that will enable manufacturers to build compliant chips with very little overhead for them and their customers. “In a nutshell, we want to specify what the tiniest TPM needs to be so it can be integrated directly within the host chip,” said Tom Brostrom, Chair of the MARS Subgroup. “This will ensure that devices that aren’t big enough to integrate a separate TPM will still be able to retain the required RTS/RTR capabilities. In turn, this will allow greater reach of trusted computing technologies over a wider set of devices and use cases.” The first prototype for such a TPM (known as Radicle) was exhibited during TCG’s members’ meeting held in Warsaw, Poland, this week during the inaugural session of the MARS Subgroup. The team also agreed on the scope of its work, which will focus on the hardware requirements necessary to control and operate the primitives supporting the RTS and RTR, and the software API to access them. A number of TCG’s other ongoing projects were also progressed during the members’ meeting, including work on specifications for secure software and firmware updates for embedded systems. Security in the Internet of Things (IoT), including industrial applications and the automotive industry was another key focus. “As we put greater trust in things like autonomous cars, smart homes and healthcare sensors, and connect them to the Internet, we need to take steps to make sure connected devices are ubiquitously secure to protect them from data breaches and hackers,” said Dr. Joerg Borchert, President of TCG. “As an international standard, TCG’s TPM is widely deployed and a proven solution. This makes our technologies ideally suited to deliver on the new security needs emerging as we move towards a world where everything is connected. The work undertaken at our latest members’ meeting will ultimately deliver the specifications needed to achieve this.”
Nuvoton announces NuMicro M2351 Series Microcontrollers
Nuvoton Technology Corporation is demonstrating the capability of FreeRTOS kernel support with the NuMicro® M2351 Series. The M2351 is one of the first Arm® Cortex®-M23 based MCUs that has a preconfigured example that embedded developers can use to run FreeRTOS on the officially supported Armv8-M architecture. Amazon Web Services (AWS) released the latest FreeRTOS kernel that includes a preconfigured example project for the Nuvoton NuMaker-PFM-M2351 evaluation board. At the beginning of 2019, the M2351 Series had achieved with Arm PSA (Platform System Architecture) Level 1 Certified and PSA Functional Certification. PSA Certified enables device makers to achieve the security required for their use cases through three progressive levels of security assurance, each requiring increasingly rigorous hardware and software evaluation, which are assigned by analyzing the use case threat vectors. In achieving Arm PSA Functional API Certification, Nuvoton better enables ecosystem software compatibility to PSA standards, independent of hardware platforms. It’s highly configurable to suit target applications on constrained devices. As a very early Armv8-M architecture-based microcontroller vendor, Nuvoton has accumulated several Internet of Things (IoT) use cases covering a lot of devices connected to the internet with the M2351 Series. With the latest support in the FreeRTOS kernel, Nuvoton keeps its leading position in Armv8-M microcontroller application field. We believe developers can leverage IoT security and low power features of the M2351., and the Armv8-M supported FreeRTOS kernel., to develop versatile IoT devices with speed and security. To understand more about the FreeRTOS kernel support for M2351 Series.
Coilcraft Introduces New High-inductance Shielded Power Inductors
Coilcraft’s new XAL7050 Series of high-temperature power inductors is available with inductance values from 22 to 47 µH and current ratings as high as 5.5 Amps, with low DCR for greater efficiency. For lower inductance values, Coilcraft offers a lower-profile companion, the XAL7030, with an identical footprint and inductance range of 0.16 to 10 µH. The XAL7050 measures just 7.2 x 7.5 x 5.0 mm and features a rugged, composite construction that provides magnetic shielding and minimizes audible buzzing. It is qualified to AEC-Q200 Grade 1 (−40°C to +125°C) standards and exhibits no thermal aging issues, making it ideal for automotive and other harsh-environment applications. Soft saturation characteristics allow the XAL7050 to withstand high current spikes. The XAL7050 features RoHS-compliant tin-silver (96.5/3.5) over copper terminations and offers a maximum reflow temperature of 260°C. COTS Plus tin-silver-copper and tin-lead terminations are also available. As with all Coilcraft parts, free evaluation samples and complete technical specifications for the XAL7050 are available online at www.coilcraft.com. Parts are available from stock and can be ordered online at buy.coilcraft.com or by calling Coilcraft sales.
HUBER+SUHNER launches outdoor MIMO antennas to ease urban 5G deployments
HUBER+SUHNER has today launched its compact omnidirectional and directional outdoor antennas for use in 4G and 5G deployments. Operators are faced with the challenge of providing cost-effective 4G and 5G in urban areas. Small cells are critical to providing increased capacity and coverage in urban areas where networks are highly congested with growing numbers of wireless devices. However, creating new cellular sites in urban areas is very challenging with only limited space available for installation and restrictions by municipal governments. To overcome this, HUBER+SUHNER has developed small omnidirectional and directional antennas to maximise performance. The new SENCITY Urban 100 and 200 outdoor MIMO antennas cover both 4G and 5G high frequency ranges and are as compact as possible for discreet installation in different types of street furniture, such as bus shelters, poles or walls, depending on the location, thanks to various bracket mounting options. “Operators are under pressure to provide widespread, fast 4G and 5G coverage in urban areas where space is limited and existing infrastructure is condensed and our unique range of outdoor MIMO antennas can play a major role in overcoming these challenges in small cell deployment,” said Claudia Bartholdi, Product Manager at HUBER+SUHNER. “At the moment there are no other antennas on the market that are as compact as the SENCITY Urban 100 and 200 that cover 4G and 5G bands, so we are incredibly excited to be releasing the SENCITY Urban series to the wider industry.” The SENCITY Urban range is available from this month and is the latest addition to the broad 5G portfolio from HUBER+SUHNER.
ZTE launches its first cybersecurity lab in China to boost ICT industry security
ZTE Corporation (0763.HK / 000063.SZ), a major international provider of telecommunications, enterprise and consumer technology solutions for the Mobile Internet, has today verified its commitment to the ICT industry against cybersecurity threats by launching its first cybersecurity lab in Nanjing, China. Following the establishment of the Nanjing complex, the company is already planning to expand across the globe with cybersecurity developments in Italy and Belgium already in the pipeline. The opening of a new lab represents an important milestone for ZTE as it looks to increase transparency and enhance trust with third parties. With the vision of “Security in DNA, Trust through Transparency”, ZTE is committed to providing customers with end-to-end security products and services by integrating security considerations and controls into every aspect of the product's life cycle. The cybersecurity lab aims to provide global customers, regulators and other stakeholders with security assessment and audit services, such as source code reviews on ZTE products including 4G and 5G, security design audit, procedural document review, black box testing and penetration testing. Furthermore, the cybersecurity lab, functioning as an industry cooperation and research platform, will also facilitate in-depth researches and explorations in the security field. “The security lab is an open and cooperative platform for the industry,” said Zhong Hong, Chief Security Officer at ZTE. “ZTE plans to gradually achieve its cybersecurity goals through three steps: first, meeting the requirements of cybersecurity laws, regulations and industry standards as well as certification schemes; second, conducting an open dialogue to enhance transparency and establishing cooperation with customers as well as regulatory agencies; and third, sustaining the open cooperation mechanism to contribute to cybersecurity standardization.” ZTE is committed to meeting the security demands of customers and regulators and leveraging the platform of the cybersecurity lab for further transparency, cooperation and communication. Moving forward, the company will collaborate with world-class security organizations to jointly conduct security assessment, certification, training and consulting. Confronted with the cybersecurity challenges in the 5G era, ZTE will continue to adhere to the company’s vision of “Enabling Connectivity and Trust Everywhere” and bring trustworthy cybersecurity capabilities worldwide.
Mouser’s Revolutionary BOM Tool, FORTE, Gives Engineers and Buyers More Power to Select and Purchase
Mouser Electronics, Inc. has helped customers process more than 11 million lines through its comprehensive bill of materials (BOM) management tool FORTE. In 2018 customers completed more than 140,000 BOMs through FORTE, Mouser’s tool designed to increase confidence, save time, and improve order accuracy in specifying and purchasing electronic components. FORTE provides a Risk Evaluator feature based on a unique relevancy engine that analyzes partial part numbers and descriptions to suggest the best options for customers — an industry-leading feature. The tool, free to anyone with a My Mouser account, evaluates the millions of daily interactions of purchasing professionals and engineers. FORTE then quickly validates part numbers, product availability, and price, and recommends alternative products to reduce design and product lifecycle risks. Mouser is constantly improving its tools to help buyers and engineers manage their specification and purchasing; FORTE was developed to be what purchasing professionals really need in a BOM tool. With FORTE, customers receive intelligent advice even when they search for outdated or partial part numbers. The new tool can match a higher percentage of parts and help customers understand the confidence and risk of each part. FORTE offers expanded customization, added intelligence, and enhanced part match confidence that makes the BOM-building process faster, easier to use, and easier to share. The highly intelligent tool remembers users’ preferences, spreadsheet layouts, naming conventions, and previous product orders. FORTE also offers legacy features like translations for all of Mouser’s supported languages, support for the most common file formats, real-time product pricing and availability, and easy purchasing directly from the BOM.
Percepio Announces Tracealyzer 4.3 With FreeRTOS Stack Analysis, Interval Details And More
Percepio announces the release of Tracealyzer version 4.3. The new version has new features for state machine analysis, stack usage analysis for Amazon FreeRTOS and major performance improvements when working with large traces. “This is a major step in the Tracealyzer evolution. For instance, the new Interval Details view provides a much better overview of state machines and other custom intervals in the trace. This works just like for tasks and events, just double-click on an entry in an Interval field. When recording really long traces, several hours or more, you will appreciate that loading specific sections from the Trace Preview is now magnitudes faster than before, thanks to improved indexing. This means you can also work effectively with very large traces. Finally, the new stack usage analysis allows you to see the highest stack usage of each FreeRTOS task, and over long tests. This way you can optimize the stack size and free up RAM for new features. You will even be able to deploy this stack monitoring in the field, via our upcoming Device Firmware Monitor service.” says Percepio CEO Dr. Johan Kraft. Version 4.3 also brings improvements of the trace view, as well as data exporting. All point graph views, like the User Event Signal Plot, now allows for exporting to CSV files that can be imported in many other applications, such as spreadsheets. This can be used for e.g. sensor readings logged as User Events, task response times, memory allocations, or the duration of custom intervals between any two events in the trace. Tracealyzer 4.3 is available for evaluation and download at percepio.com