New Interactive Content Series from Mouser Electronics and Molex Explores the Future of Miniaturization in Technology
Mouser Electronics Promotes FPGA Vision Webcast for Intel and its Newly Independent Programmable Solutions Group
Vision Amplified: EQM-EHL Unleashes the Full Potential of Qseven
Samtec Introduces 0.635 mm pitch, Slim Body Edge Rate Connectors
Authorized Distributor Mouser Electronics Offers Engineers the Latest Products from ams OSRAM
Researchers turn up the heat on flexible temperature sensor development using microwaves
Vantage Lighting Control Helps Hotel Verdant Achieve Sustainability
EM Microelectronic’s em|bleu sets new market benchmark for Bluetooth™ 5.4 in tiny, ultra-low power devices
Samtec FireFly Micro Flyover System Shipping for Optical and Copper Designs to 28 Gbps
Surpassing Performance Limits, Avalue Unveils the Latest Emerald Rapids Server Boards
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ONiO and Epishine Alliance Unveils a New Era of Truly Batteryless IoT Solutions
ONiO®, a pioneer in the batteryless microcontroller space, and Epishine, the Swedish pioneer in printed organic solar cells announced a strategic partnership today. A partnership aimed at bringing to life a shared vision of self-powered IoT devices - i.e 100% batteryless IoT devices that can eliminate the toxic environmental effects of disposable batteries. ONiO's cutting-edge, ultra-low-power microcontrollers are now about to join forces with Epishine's leading indoor solar cells, seamlessly combined to eliminate the scourge of battery waste. This strategic confluence is poised to revolutionize the IoT industry by introducing a groundbreaking model of eco-friendly, autonomous electronics. The initiative is focused on creating innately sustainable devices that eliminate the need for battery replacement and charging— cutting down on electronic waste and reducing running costs. Kjetil Meisal, CEO of ONiO, said, "Our alliance with Epishine marks a seamless leap into a sustainable technological future and the start of a Nordic industry initiative to drive sustainable electronics into the future. With Epishine's organic solar cells and unique ability to harness energy from low light conditions, combined with our extremely energy-efficient microcontrollers, we're seamlessly integrating the upper class of solar and semiconductor technologies. This paves the way for the next generation of IoT devices—sustainable, maintenance-free, and truly autonomous." In our recent tests with Epishine, ONiO.zero's advanced microcontrollers have displayed exceptional cold start capabilities, powering up in mere seconds—a tall order for other technologies that need several minutes. This breakthrough not only enhances the user experience by dramatically slashing wait times but also positions ONiO at the forefront of instant-on IoT solutions, seamlessly complementing Epishine's organic photovoltaic innovations. Anders Kottenauer, CEO of Epishine, said, "Our partnership with ONiO represents a milestone in our journey towards sustainable low-power electronics. Leveraging ONiO's ultra-low-power microcontrollers alongside our indoor solar cells, we are an innovative example to the IoT industry. This alliance is not just about combining two cutting-edge technologies; it's about reducing reliance on traditional battery systems and leading the charge towards sustainable electronics. Together, we are crafting devices that are not only self-sustaining but are also a testament to the power of sustainable innovation" The partnership reflects a profound synergy of shared values and a commitment to technological innovation that addresses today's environmental challenges. Epishine's dedication to creating the world's most sustainable solar cells perfectly complements ONiO's vision for an IoT that is unfettered by batteries.
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Samtec Introduces New PCIe 6.0 Capable Micro Edge Card Connector
Samtec, Inc.’s Generate™ high-speed edge card sockets (HSEC6-DV Series) support 64 Gbps PAM4 (32 Gbps NRZ) applications and are PCIe® 6.0 capable. HSEC6-DV is used in prototypical PCIe 6.0 AI hardware designs serving as the interconnect between the motherboard and add-in cards. The HSEC6-DV’s rugged Edge Rate® contacts, in a differential pair configuration on 0.60 mm pitch, are optimized for signal integrity performance and high cycle life. HSEC6-DV is compliant to SFF-TA-1002 x4 (1C), x8 (2C), x16 (4C and 4C+). The edge card socket strip is available with 28, 42, 70, and 84 positions per row, and mates with 1.60 mm (.062”) thick cards. Optional weld tabs provide extra mechanical strength of the connector to the PCB. The HSEC6-DV is RoHS compliant, lead-free solderable, is rated at 240 VAC, and the current rating is 1.92 A with 2 pins energized. Mating cable assemblies (GC6 Series) are also PCIe 6.0 compatible, supporting 64 Gbps PAM4 (32 Gbps NRZ) applications. The cable is 34 AWG Samtec Eye Speed® ultra-low skew twinax. GC6 cable assemblies are available in 28, 42, and 70 positions, and are standard with 100-ohm differential pair signal routing. HSEC6-DV is the latest in a full-line of Generate™ high-speed edge card connectors, rated up to 56 Gbps PAM4, on 0.80, and 1.00 mm centerline. These products are available in vertical, right-angle, edge mount, and pass-through orientations. They are also available in power/signal combos, with press-fit tails, locks and latches.
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Mouser Electronics Now Stocking Qorvo Wi-Fi 7 Front End Modules for Mobile and Home Network Equipment
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is now stocking the newest Wi-Fi® 7 front end modules (FEM) from Qorvo. Wi-Fi 7 is the newest Wi-Fi standard, also known as IEEE 802.11be Extremely High Throughput (EHT). Wi-Fi 7 works across three separate bands (2.4 GHz, 5 GHz, and 6 GHz) to fully utilize spectrum resources. Wi-fi 7 offers faster data speeds, lower latencies, and increased network capacity thanks to new capabilities designed to support large numbers of users and devices in bandwidth-intensive environments, as well as exceptional performance for customer premises equipment, smart home devices, portable consumer electronics and wearables. The Qorvo QM42500 and QM45500, available from Mouser, offer 2.4 GHz and 5 GHz to 7 GHz frequency ranges, respectively. These devices are optimized for a broad 3 V to 5 V operating range, making them ideal for mobile applications such as smartphones, tablets and wearables such as VR/AR goggles. The QPF4259 and QPF4559 are 2 GHz and 5 GHz modules well suited for wireless access points, wireless routers, set-top boxes and customer premise equipment. The performance of these devices is focused on optimizing the integrated power amplifier for a 5 V supply voltage. This design conserves power consumption while maintaining the highest linear output power and leading-edge throughput. As Wi-Fi 7 devices, these FEMs offer compatibility with Matter™, a new connectivity standard for Internet of Things (IoT) devices. Matter is a universal software layer, a foundation for connected things and their applications, built upon and compatible with various protocols. By using standard IP as the communication protocol, Matter acts as the universal IoT standard compatible with the multiple protocols deployed in homes today. The QM42500EVB, QM45500EVB, QPF4259EVB01, and QPF4559EVB01 evaluation boards, also available to order from Mouser, provide a demonstration and development platform for these Wi-Fi 7 modules. Each board features a pre-mounted target device, along with the required support circuitry. These evaluation boards provide an example application circuit, allowing rapid prototyping when incorporated into existing designs. To learn more about the QM42500 and QM45500 mobile Wi-Fi FEMs, visit https://www.mouser.com/new/qorvo/qorvo-qm42500-module/ and https://www.mouser.com/new/qorvo/qorvo-qm45500-module/ To learn more about the QPF4259 and QPF4559 network equipment FEMs, visit https://www.mouser.com/new/qorvo/qorvo-qpf4259-module/ and https://www.mouser.com/new/qorvo/qorvo-qpf4559-fems/ To learn more about Wi-Fi 7, visit https://www.mouser.com/empowering-innovation/wifi7/
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1 million smart meters deployed in India with Wirepas technology
Wirepas, a global leader in wireless connectivity technology, announces a significant achievement with the deployment of 1 million smart meters powered by Wirepas mesh technology across India. This landmark underscores Wirepas' commitment to advancing smart metering solutions and positioning RF mesh technology as the most reliable technology for smart meters. Jani Vehkalahti, Senior Vice President of Smart Grids at Wirepas, states, "Unrivalled reliability, that’s our secret. Together with our partners we had already achieved the highest 99.9% SLA in the demanding European smart metering market. Now exceeding 1 million smart meters deployed in India proves the robustness of Wirepas technology in harsh conditions. Our focus on affordable reliability positions Wirepas as the trusted wireless technology partner for any utility." Wirepas stands out in the market with its ultra-reliable, yet affordable RF mesh technology. Unlike cellular solutions, RF mesh offers inherent advantages in terms of cost-effectiveness and reliability. The decentralized nature of mesh ensures a resilient and self-healing network enabling seamless communication with minimal infrastructure even in challenging environments. Despite unlimited scale, Wirepas technology can run in a minimal memory configuration compared to the traditional routing table approach, and therefore enables the most cost-efficient radio chipsets. India has one of the toughest smart metering requirements in the world, demanding features such as frequent reading intervals and a pioneering cloud-based prepayment system. Technology used must ensure immediate access to electricity upon balance top-up, emphasizing consumer satisfaction. In regions with minimal electricity consumption, users upload small amounts to their prepaid accounts, leading to over 10% of smart meters receiving disconnect and connect commands daily. Additionally, many smart meters in India are situated in secured metering rooms where cellular coverage is severely restricted. Wirepas mesh technology has demonstrated exceptional reliability in linking smart meters within these enclosed spaces. Essentially, only a single smart meter is required to establish a route to the rest of the network. These requirements highlight the need for a very robust connectivity. Wirepas technology, through its partnerships, has demonstrated its ability to meet the rigorous requirements of the Indian IS-16444 standard and Standard Bidding Document in Advanced Metering Infrastructure (AMI) solutions. Vehkalahti further explains, "As the market evolves, we are steadfast in our mission to help the Indian government to succeed in the world’s most ambitious electricity smart metering roll-out. Wirepas has heavily invested in core technology but also on a complete AMI reference enabling its partners to accelerate their projects execution while ensuring performance and reliability at scale. Wirepas is also increasing its local investments to bring more high-quality partners into the mission of deploying 250 million meters in India. Our strong partnerships, which are already delivering and building solutions in India, stand as testament to our capabilities. The first million is a great start but less than 1% of our target. We are determined to help the ecosystem to meet the challenge that the India government has set.”
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WiTTRA Expands IoT Footprint Through Membership in PROFIBUS & PROFINET International (PI)
WiTTRA, a trailblazer in the Internet of Things (IoT), proudly declares its recent inclusion in PROFIBUS & PROFINET International (PI), the foremost global automation community boasting over 1700 members. Since its establishment in 1989, PI has played a pivotal role in championing worldwide automation technology, overseeing critical technologies that are integral to the automation industry. PI's commitment to innovation is further demonstrated with the incorporation of omlox, setting the standard for locating technologies and paving the way for precise real-time indoor localization systems. omlox, an open standard, provides interoperable interfaces for a unified localization system, empowering industries to use a singular infrastructure with diverse applications from various providers. By leveraging the same upper layer infrastructure, omlox significantly reduces the Total Cost of Ownership (TCO), allowing seamless integration of different applications within a shared ecosystem. WiTTRA, committed to open standards, employs a unified gateway providing infrastructure for flexible deployment, enabling third-party sensors to seamlessly become part of the ecosystem. WiTTRA's patented technology ensures a reliable and accurate positioning system. The technology has been a game-changer for IoT, enabling quick, low-cost Proof of Value installations that directly link to business value. The Total Cost of Ownership for WiTTRA technology is 70 – 80% less than competing technologies, marking a significant shift in the economics of IoT deployment. WiTTRA's decision to align with PI and adopt omlox showcases its unwavering dedication to driving innovation. Warwick Taws, CTO at WiTTRA, expresses enthusiasm about the partnership, stating, "We are thrilled to join PI, an organisation at the forefront of automation technology. It aligns perfectly with our commitment to driving innovation and leveraging our unique positioning technology." WiTTRA's collaboration with PI and integration of omlox reinforces its standing as an industry leader, committed to pushing the boundaries of IoT technologies and contributing to the evolution of industrial automation.
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Arrow Electronics Offers Engineering Support to Indian IoT Solutions Developers
Global technology solutions provider Arrow Electronics, Inc. today announced it has provided engineering support to enable Bharat Pi, an India-based tech startup to design and build enterprise grade IoT development boards that deliver benefits of reliability, quality and scalability to millions of smart and connected devices. According to the IoT device management platform analysis by Future Market Insights, the demand in India is expected to increase at a compound annual growth rate of 34% over the next ten years. The adoption of IIoT (Industrial Internet of Things) in the manufacturing industry and increasing usage of technologies such as 5G, AI, and Big Data are expected to continue fueling this demand. Founded in 2020 by Prabhu Stavarmath, Savitri Patil, and Naveen Gopalkrishna, Bharat Pi has set out on a mission to accelerate IoT development by building cost-effective IoT development boards to help developers, startups, and innovators to convert their idea into a quick pre-sales demo in hours. Bharat Pi is also one of the incubates at IoT Open Lab in Bangalore, a joint collaboration between Arrow Electronics the Software Technology Park of India (STPI). With the help of Arrow and its global technology suppliers, Bharat Pi has recently launched RedPill STM32G0 series-based development board. "Todays' enterprise IoT applications like industry 4.0, remote asset monitoring, healthcare, connected automobiles, and smart cities require a massive network of robust and connected edge devices which can handle large amount of data collection and processing and deliver real-time responses. Some of the IoT development boards in the market are not designed to handle diverse AI or machine learning workflows and often require custom design efforts to build a prototype," said Prabhu Stavarmath, Chief Business Officer, Bharat Pi. "Every IoT use case is different and some enterprises struggle to build quick pre-sales IoT device demos to minimize deal cycle and revenue impact. To address these unmet needs, our IoT development boards are designed to be easily customizable and versatile, providing a flexibility to build rapid pre-sales demos and prototypes for IoT use cases across a range of industry verticals. Arrow's engineering team has provided us with everything we need, from product knowledge, technical insights, to evaluation. Their technical expertise and supply chain experience have enabled us to jump-start and scale up the design and manufacturing of IoT development tools, so that we can in turn to extend our plug-and-play offerings to the broader IoT developer community." Some of the key features of RedPill STM32G0 series-based development board: Full Pin Access: Based on STMicroelectronics's STM32G0 MCUs, it exposes all 48 pins of the chip, allowing it to be connected to a myriad of sensors and devices. Simplified Programming: It is equipped with a USB to UART Silicon Labs – CP2102 bridge, simplifying programming efforts. Versatile Connectivity: With exposed headers for programming and 8-pin headers featuring SPI and UART interfaces, it allows seamless integration with various modules, including Wi-Fi and 4G. Open-Source Compatibility: It is compatible with various open-source platforms and development environments. Bharat Pi also offers technical resources and community support to assist developers, hobbyists, startups, and tech enthusiasts, pushing the boundaries of embedded systems development forward. "Today's IoT ecosystem requires ample technology competencies which span from product idea, design and engineering to supply-chain and manufacturing. With our global network of technology suppliers and world-class technology capabilities, we are well positioned to extend best possible support and help Bharat Pi as well as many other technology companies as they strive to simplify and scale up IoT deployment," said Bhartendu Mishra, Arrow Electronics' managing director of India. Equipped with advanced engineering equipment and testing modules, the IoT Open Lab has assisted the start-up community from the region in their idea-to-prototype-to-product innovation journey. Arrow's experienced vertical segment experts and engineers with expertise in areas of embedded computing, sensing, connectivity and system integration are on site to provide professional advice to these innovators and makers.
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Mouser Electronics Unveils Technical Resource Site for Engineering Smart Home Devices
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, explores how to seamlessly connect, control, and automate all our home devices with its all-encompassing Smart Home resource center. Mouser makes it easy and accessible to navigate complex networks including Matter, Thread, and Wi-Fi 6, helping electronic design engineers keep up with the latest trends. Smart home systems that were once siloed can be designed to work together. Informative articles, such as how to use Microchip's integrated graphics and touch curiosity kit to enable home automation, enable users to gain knowledge from tailored content, backed by decades of expertise from top industry leaders. Mouser has partnered with leading manufacturers to create this exclusive resource hub that documents innovative solutions and cutting-edge products to support designers and industry professionals in their home projects. Readers will be empowered to build a smarter home with dozens of engaging eBooks, articles, and blogs detailing the significant advancements in connectivity. Mouser stocks the industry’s widest selection of semiconductors and electronic components, including the following solutions for smart home applications: Qorvo Wi-Fi 6 & 6E Solutions delivers broader coverage for the entire smart home, office building, or outdoor space. With multiple RF standards coexisting with Wi-Fi networks, Qorvo’s BAW (Bulk Acoustic Wave) filter technology helps designers meet system-level specifications in Wi-Fi 6 and 6E while mitigating cross-over interferences. It supports applications like office buildings, wireless routers, smart homes, and more. Nordic Semiconductor nRF7002 Wi-Fi 6 Companion IC provides seamless connectivity and Wi-Fi-based location and is designed to be used alongside Nordic’s existing nRF products, as well as a wide range of non-Nordic host devices. The Nordic Semiconductor nRF7002 Wi-Fi 6 Companion IC can also be used in conjunction with non-Nordic host devices. It features an nRF5340 host processor connected to the nRF7002 via QSPI. M5Stack M5GO IoT Starter Kit V2.7 is a cost-effective kit that contains core controller M5GO + 6 expansion units with different functions. It features a Microsoft Azure authentication device, 16MB flash, and an integrated HD IPS display panel with various hardware peripherals. The kit offers finely tuned RF circuitry for stable and reliable wireless communication and a 2-inch IPS display panel. This kit is ideal for STEM education, smart homes, IoT controllers, and more. Espressif Systems ESP32-C6-DevKitC-1 Development Board integrates complete Wi-Fi, Bluetooth® LE, Zigbee®, and thread functions, with ports to supply power to the board, as well as for communication with the ESP32-C6 chip. The development board is well suited for applications like industrial automation, healthcare, and smart homes. Amphenol RF External Antennas send and receive RF signals and are designed to mate with a broad range of RF connector interfaces or be mounted directly to a PCB. These antennas are available as either monopoles or dipoles and are typically used for higher power transmission and reception. These antennas are ideal for wireless routers, set-top boxes, WLAN/WWAN, surveillance cameras, and IoT applications. To learn more, visit https://resources.mouser.com/smart-home/
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Technological Innovations in Next-Generation Image Sensors Discussed by IDTechEx
Author: Dr Miguel El Guendy, Technology Analyst at IDTechEx The use of image sensors is set to revolutionize multiple industries from advanced driver-assistance system (ADAS)/autonomous driving to agriculture, industrial inspections, and medical imaging. The visualization of images beyond the visible light spectrum and the traditional red, green, and blue (RGB) is gaining traction and is set to impact the future of sensors in many more applications. The new IDTechEx report, "Emerging Image Sensor Technologies 2024-2034: Applications and Markets", explores a diverse range of image sensing technologies capable of resolutions and wavelength detection far beyond what is currently attainable. IDTechEx expects that the growing importance of autonomous technologies will lead the emerging image sensor market to over US$739 million by 2034. Figure 1: Emerging image sensor technologies covered in IDTechEx's "Emerging Image Sensor Technologies 2024-2034: Applications and Markets”. Source: IDTechEx There are several unique selling points to adopting these types of image sensors, one of which is the broadening of the spectral coverage over the commonly used CMOS RGB sensors. CMOS detectors are highly effective and reliable for visible light image capture and are widely used in robotics, industrial inspections, and consumer electronics applications. Their cost-effectiveness and ease of implementation into a variety of applications ensure successful adoption in the market. Nevertheless, with a growing need to visualize a wider range of frequencies in the electromagnetic spectrum comes a new market opportunity with immense potential. One of the areas of interest is capturing images in the short-wave infrared (SWIR) region (1000-2000nm). The autonomous vehicle industry, for instance, is particularly invested in technologies operating in this region, as visible light image capture is less effective in foggy/misty/dusty/dark conditions. Similarly, industrial inspections could benefit from SWIR imaging as this region has different absorption ratios that can help distinguish materials that look the same in the visible spectrum. The main challenge, however, is lowering the costs associated with the existing technologies in this space. The dominant technology in this sector is based on indium gallium arsenide (InGaAs), and while these devices perform well and have high sensitivity in these frequency ranges, they are also costly, with average pricing approximating US$20,000. As a result, they are used on very specialized applications and remain inaccessible for autonomous driving and consumer electronics, for instance. The potential demand for more affordable SWIR image sensors has triggered the emergence of novel technologies that are determined to fill this customer need. These include hybrid image sensors, where organic semiconductors or quantum dots are placed above a CMOS readout integrated circuit (ROIC), and extended silicon, where the physical properties of silicon are altered, enabling its absorption range beyond its bandgap capabilities. Despite promises of performance enhancement, these technologies require further maturity to compete with InGaAs. Nevertheless, there is more innovation happening in the image-sensing space. Companies are not solely looking at expanding the spectral range; there is also ongoing work in imaging over a larger area whilst increasing temporal resolution and dynamic range. An example of this is event-based vision, where each pixel in the sensor detects changes in intensity and sets a timestamp reporting this change. Rather than using a frame-based approach that would require extensive computational processing, this method increases the temporal resolution for a fraction of the computation. The growth of the Internet of Things (IoT) and smart consumer electronics is driving another phenomenon in the image sensor sector, which is the miniaturization of these sensors to conform within the smallest form factor devices. Miniaturized spectrometers, for instance, target these applications and aim to deliver sufficiently small and low-cost solutions to the market. There is one main trend that remains consistent irrespective of the frequency sensitivity ranges, and this is cost. While CMOS sensors are already relatively mature and affordable, there is ample opportunity to deliver similar products for other frequencies in the electromagnetic spectrum. The challenge consists in lowering the cost of manufacturing and the form factor whilst replicating or even surpassing the performance of CMOS in the visible light region for other frequency ranges in the electromagnetic spectrum. IoT devices are getting increasingly smaller, and thus, sensors fitted into these devices should conform to their shape and draw minimal power, which is also an added difficulty, considering many high-resolution image sensors have high computational requirements associated with them. The world of image sensors has enormous potential and could impact multiple industries, from autonomous vehicles to industrial inspections and agriculture. The fulfillment of its potential is dependent, however, on its cost and performance, and while there are currently many technological players in the running for dominance in the sector, the technology that delivers on these points most suitably will earn a significant share of this large market, that in the future will supply to autonomous vehicle manufacturers and IoT providers in the consumer electronics space. For more details on the emerging image sensor market and the future of autonomous driving, please see the IDTechEx market reports, “Emerging Image Sensor Technologies 2024-2034: Applications and Markets” and “Autonomous Cars, Robotaxis and Sensors 2024-2044”, respectively.
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Samtec Releases Analog over Array Reference Designs
Samtec, Inc., the service leader in the connector industry, has enhanced its open-pin-field arrays to simultaneously run analog, digital, and power signals. New reference designs allow Samtec’s proven high-performance connector arrays, such as the SEARAY™, to support analog signals. Intended for use in high-density RF applications, the new Analog over Array reference designs allow dense, open-pin-field connectors to support digital and analog differential or single-ended signaling, as well as power. These high-density array connectors are already proven in high-speed, high-performance digital and power applications; now, their differential ground pattern can be used to support RF SOCs and applications such as 5G wireless, remote PHY/MSOs, phased array radar, test and measurement, and LEO/MEO satellites. Performance is specified at 8 GHz bandwidth 50 ohm system impedance for single-ended; 100 ohm for differential Return loss of -12 dB up to 4 GHz; -10 dB up to 8 GHz; Crosstalk isolation between channels: -69 dBc to 4 GHz, -63 dBc to 8 GHz The reference design includes recommended pin mapping as part of a full characterization report. Additional reference designs are in development for applications out to 40 GHz. For more information on PCB materials selection, stackup, and launch optimizations for your design, email sig@samtec.com. Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers develop and advance technologies, strategies, and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between.
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New Electronic Rotary Latch From Southco Simplifies Large Cabinet Security Retrofits
Southco Asia Ltd., a subsidiary of Southco Inc., a leading global provider of engineered access solutions such as locks, latches, captive fasteners, electronic access solutions and hinges/ positioning technology has expanded its line of electronic rotary latches with a new version that facilitates equipment security upgrades. Southco's new R4-05 Electronic Rotary Latch is designed to be used with a mechanical multipoint latching system or other combination of swinghandles and flat, round or hex rod solutions commonly used to drive multiple latching points to secure large cabinet doors. With the rollout of 5G technology, Telecom operators are increasing the value and quantity of their equipment, which is often added to existing network enclosures located in remote outdoor areas. The R4-05 Electronic Rotary Latch can be easily added to existing systems in the field without having to disassemble the mechanical latching system, allowing operators to retrofit existing hardware in the field and enhance security with minimal effort. Constructed of corrosion resistant stainless steel, the R4-05 Electronic Rotary Latch is sealed to IP67 and suitable for outdoor use. The R4-05 Electronic Rotary Latch combines a mechanical rotary latch with an electronic actuator for enhanced security and remote access control. It can be easily integrated with an existing mechanical multipoint latching system by installing the R4-05 latch on the door, next to the rod. When the striker is engaged with the lock, the rods cannot move, preventing operators from actuating the latch from outside of the enclosure. To access the door, a signal is sent to the R4-05 Electronic Rotary Latch from either an existing access control system or a standalone access controller, like a Bluetooth or RFID card reader. It then releases the striker, but remains in a closed, but unlocked position until the latch is operated normally from the outside of the enclosure. If the latch is not opened from the outside of the door, it moves back to the locked state, providing an added layer of security. When combined with the R4-05 Electronic Rotary Latch, Southco Multi-Point Latch Systems provide a comprehensive solution for large door security applications. A simple handle turn of the multipoint locking system can secure multiple latch points along large doors. A wide range of locking security and handle styles, along with optional sealing features, make them suitable for most large door applications. When used as a standalone latch, the R4-05 Electronic Rotary Latch provides a concealed, push-to-close access control solution for a wide variety of industry applications where space is at a premium and remote access is needed. Commercial Product Manager Todd Schwanger adds, "The R4-05 Electronic Rotary Latch makes it easy to upgrade the security of Telecom enclosures and other valuable equipment. With a drop in assembly designed to fit most cabinet types and rod styles, the R4-05 Electronic Rotary Latch is ideal for quick field retrofits." For more information about the R4-05 Electronic Rotary Latch, please visit www.southco.com/R4-05 or email the 24/7 customer service at info@southco.com
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Avalue EPS-ADS High-Performance Fanless Rugged System
Avalue Technology Inc. (TAIEX: 3479-TW), a global industrial PC solution provider and a Titanium member of the Intel® Internet of Things Solutions Alliance, endeavors to provide a complete range of smart retail, smart healthcare, smart manufacturing, smart transportation and embedded solutions. Avalue Technology has announced the launch of its EPS-ADS rugged fanless embedded system. Driven by Intel®12th Gen CoreTM processor (codenamed Alder Lake-S) with Intel® Iris UHD Graphics, EPS-ADS redefines high-performance computing, providing exceptional computing power, flexibility and scalability, making it applicable for industrial automation, smart control, machine vision, data analysis and embedded applications. To meet different challenges, Avalue EPS-ADS provides powerful support driven by Intel® 12th Gen Alder Lake-S processor with Intel® UHD Graphics 770, which offer up to 32 graphics execution units (EUs) for outstanding computing performance. Using silent fanless design, passing 50G shock test and 5G vibration test, plus IP50 rating for water and dust resistance, and operating at a wide temperature range from -10°C to 55°C, EPS-ADS rugged system is sturdy and reliable, ensuring exceptional stability and reliability even in harsh environments. Equipped with a variety of I/O ports, including four 4K@60Hz display outputs, two HDMI 2.0b and two DP++ 1.4 ports, two Intel® Gigabit Ethernet (2.5GbE and 1GbE) ports, three storage options (one 2.5-inch hard disk slot and two M.2 B/M slots), six COM ports (two RS232 and four RS232/422/485), and eight USB ports (two USB 2.0 and six USB 3.2), EPS-ADS offers a myriad of connectivity options to meet different application scenarios, giving users high flexibility and expandability. Furthermore, EPS-ADS fanless rugged system has a compact size, measuring 21.5cm x 20cm and only 7.5cm thick, does not take up much space and is easy to install in different places. Given its flexible I/O and fan options, Avalue EPS-ADS may be customized to users’ specific requirements and provide solutions to meet specific project requirements. Being CE and FCC Class B certified, and having an IP50 rating for water and dust resistance, Avalue EPS-ADS possesses outstanding industrial-grade reliability. Not only is it highly effective in applications such as automated warehousing and logistics operations, AI inspection equipment, automated robotic assembly and automated production line, it can also be used for automated payment at airports, hotels and malls, and integrated into robot guide or usher. With its wide variety of I/O ports for flexible expansion, high-speed Wi-Fi and 5G transmission, and compact size and easy installation, Avalue EPS-ADS fanless rugged system is your best choice for industrial-grade embedded solution. Visit www.avalue.com.tw for more information on Avalue products, or contact sales@avalue.com.tw to talk to our sales team.
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Samtec Releases Line of DC to 90GHz Connectors with Alignment Features
Samtec has fully released its line of vertical solderless, compression mount connectors that incorporate precision alignment features. Spanning DC to 90 GHz, the new connectors are well suited for use in high-frequency test and measurement applications and are available in full production quantities. The connectors come standard with precision alignment features that are exclusive to Samtec and ensure peak connector performance. The solderless launch (where the connector is compressed onto the PCB using mounting hardware) allows for easy, field replaceable, cost-effective assembly to the PCB and eliminates possible performance degradation commonly found with solder reflow. This new line of connectors includes both threaded and push-on interface types: 135 Series: 35 mm (90 GHz) 185 Series: 85 mm (65 GHz) 240 Series: 2.40 mm (50 GHz) 292 Series: 92 mm (40 GHz) GPPC Series, -CMM option: SMPM (65 GHz) Complete electrical, mechanical, and environmental specifications are available in the Product Specification Sheets for each series on samtec.com. A brief technical overview, along with board thickness and torque specifications, is available in the eBrochure: samtec.com/solderless-compression. “In extremely high frequency test and measurement applications, compression mount connectors have become the connector of choice. Samtec has noticed that when compression mounting, slight misalignment between the connector and the landing pad can occur causing signal degradation. While at lower-frequencies this degradation is minor, at high-frequencies it can become problematic yet very difficult to detect. This has been observed even when mounting screws are tightened to proper torque specifications.” says Dan Birch Global RF Engineering Manager at Samtec. “To prevent this issue, alignment features are now standard with all Samtec vertical compression mount RF products.” - GPPC Series for Test & Measurement For differential pair test and measurement applications, Samtec has released its vertical GPPC Series with a -CMM solderless option. It’s the only ganged, solderless connector of its kind in the industry. The push-on coupling design enables quick-attach for ease of use in a lab setting. As frequency requirements continue to scale, optimizing the PCB launch structure becomes more important. Engineers looking for assistance with board launch optimization and/or complete channel analysis can contact RFGroup@samtec.com Samtec offers a full line of off-the-shelf solutions suitable for microwave and millimeter wave applications from 18 GHz to 110 GHz. Samtec precision RF products support next-generation technology advancements in wireless communication, automotive, radar, SATCOM, aerospace, defense, and test and measurement. Customization of products, both quick-turn modifications and new designs, is also available.
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Mouser Electronics New Product Insider: Over 16,000 New Parts Added in Third Quarter of 2023
As an authorized distributor, Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,200 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. Last quarter, Mouser launched more than 16,000 part numbers ready for shipment. Some of the products introduced by Mouser from July through September include: Seeed Studio NVIDIA® Jetson Orin™ Nano 8GB Developer Kit The NVIDIA Jetson Orin™ Jetson Orin Nano 8GB module by Seeed Studio delivers up to 40 TOPS performance for entry-level edge artificial intelligence (AI) and robotics. The kit includes a Jetson Orin Nano 8GB module, heat sink, carrier board, and power supply. The rich set of IOs includes USB 3.2 Gen 2 ports, 2x M.2 Key M for SSD, a pre-installed Wi-Fi® module, and more. STMicroelectronics VL53L7CH Time-of-Flight (ToF) Sensor The VL53L7CH Time-of-Flight (ToF) sensor from STMicroelectronics features an ultrawide 90° diagonal field-of-view (FoV) and low power consumption. The compact and normalized histogram (CNH) innovative data output is specially designed for AI applications requiring multizone raw data from a high-performance multizone ToF sensor. Cree LED XLamp® XP-G4 LEDs The XLamp XP-G4 LEDs from Cree LED incorporate the latest high-power LED technology advancements for improved optical performance while delivering industry-leading efficacy. The XP-G4 LEDs are optimized for a wide range of both indoor and outdoor directional lighting applications requiring precise light control, good color over angle and long-term reliability. Molex Brad M12 Power L-Code Connector System Providing space-saving flexibility with the power capacity needed for modern Industry 4.0 innovation, the Brad M12 Power L-Code connector system by Molex meets PROFIBUS and PROFINET International (PI) standards for PROFINET systems. The IP67-sealed connectors and Weld-Slag and Oil-Resistant (WSOR) cables ensure durability and reliability in harsh industrial environments. To see more of the New Product Insider highlights, go to https://info.mouser.com/new_products/
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New eBook from Mouser Electronics and NXP Semiconductors Offers Insights into Design Challenges for Vehicle Electrification
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, launched a new eBook in collaboration with NXP® Semiconductors, a world leader in secure connectivity solutions for embedded applications, which is pushing boundaries in the automotive, industrial and IoT, mobile, and communication infrastructure markets while delivering solutions that advance a more sustainable future. In this eBook, Mouser and NXP explore design challenges in vehicle electrification systems, with insights into potential pathways for solutions. In 7 Experts on Designing Vehicle Electrification Solutions, the new eBook from Mouser and NXP, subject matter experts from across the electric vehicle (EV) industry and NXP offer their perspectives on how they're addressing challenges surrounding data-driven optimization, safety, EV charging and efficiency, to help manufacturers bring innovation to the EV market in record time. Modern EVs, with advanced driver assistance systems, feature dozens of integrated sensor systems that work together to achieve higher performance and enhance driver safety. These sensors also gather actionable data regarding the EVs subsystems, including motor and battery performance, and most importantly, provide a wealth of data-driven information to facilitate system optimization while refining EV design decisions into the future. The eBook explores how NXP and Mouser deliver data-driven technology solutions to the EV market's specific challenges, like charging compatibility, battery lifespan, capacity, navigation and safety, and emerging innovations to improve EV efficiency and design. Of course, safety is the paramount consideration in vehicle electrification design. NXP provides a suite of analog sensing hardware solutions to help obtain vehicle data and offers a variety of low-power, scalable, functional, and safe microcontrollers for streamlining secure communications and improving performance. 7 Experts on Designing Vehicle Electrification Solutions includes product information on the latest related NXP solutions, available at Mouser Electronics, like NXP's S32K3 microcontrollers, a family of scalable 32-bit Arm® Cortex® -M7 based MCUs in single, dual and Lockstep core configurations supporting up to ASIL D level safety. Also featured are NXP’s GD316x family of ASIL D compliant, high voltage isolated gate drivers, that offers efficiency enhancing features such as dynamic gate strength control and segmented drive. The advanced, functionally safe HV gate drivers GD3162 and GD3160 provide a high level of integration, allowing for a smaller footprint and simplified design for xEV traction inverters. To read the new e-book, visit https://resources.mouser.com/manufacturer-ebooks/nxp-7-experts-on-designing-vehicle-electrification-solutions/ To browse all of Mouser’s eBooks, visit https://resources.mouser.com/manufacturer-ebooks/
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Epishine Unveils Groundbreaking Low-Carbon Footprint and Takes Global Lead in Sustainable Power Solutions for IOT and CE
Epishine, a leading energy impact company, proudly announces a significant breakthrough in the sustainability aspects of its technology. Through extensive research and development efforts, Epishine’s patented production process has achieved a groundbreaking low carbon footprint of 0,86 g CO2eq/cm2. Solidifying its position as a frontrunner in environmentally conscious technology, with significantly less CO2 emission than the batteries that has previously powered the same devices. Epishine's comparison was conducted independently of the study. Life Cycle Assessment (LCA) is a vital tool in quantifying the environmental impact of products from beginning to end-of-life. It encompasses every stage of a product's life cycle, including raw material extraction, production, distribution, use, and disposal. The purpose of LCA is to provide a basis for describing environmental impact in a manner that supports change and identifies measures within the analyzed life cycle that can contribute to more sustainable development. By achieving such a remarkable low-carbon footprint, Epishine sets a new standard for sustainability in their field. Epishine's commitment to minimizing environmental impact through the development of their cutting-edge technology has paved the way for this achievement. By leveraging the latest advancements in solar cell technology and manufacturing processes, Epishine has optimized its production methods, resulting in a significant reduction in energy consumption, waste generation, and greenhouse gas emissions throughout the product life cycle. The LCA report, conducted by the Swedish environmental consultancy company Miljögiraff and third-party reviewed by Sweco, validates these improvements. Annie Johansson, Life Cycle Analyst at Miljögiraff said "I have really appreciated working with Epishine. They have incorporated the results of our LCA into their roadmap and immediately iterated to reduce the environmental impact of their product. We look forward to continuing to provide Epishine with environmental calculations to aid their journey towards driving sustainable change." The low-carbon footprint achieved by Epishine's products not only benefits the environment but also offers numerous advantages to customers. The exceptional LCA performance of Epishine's products positions customers for enhanced sustainability reporting and compliance with increasingly stringent regulations, meeting the growing demands from end customers for sustainable IOT products. "Sustainability has always been our top priority in developing our patented production method. This is reflected in our continuous choices in the development of our production process such as avoiding high temperatures and excluding certain materials." stated Jonas Bergqvist, CTO at Epishine. "This milestone demonstrates our unwavering dedication to creating sustainable energy solutions that minimize our ecological footprint. While today’s results mark a gratifying achievement, we remain committed to further improving our products’ environmental performance. Epishine's groundbreaking carbon footprint underscores its commitment to sustainable development. As the company continues to push the boundaries of innovation, it aims to inspire industry-wide adoption of environmentally conscious practices and accelerate the global transition to renewable energy. The Life Cycle Assessment of Epishine’s production and the product (LEH3_50x50_6_10) was conducted by the Swedish environmental consultancy company Miljögiraff and third-party reviewed by Sweco. This excludes the product comparisons that was performed by Epishine, more information about that here: https://www.epishine.com/lca-calculations
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Introducing the APC-2138: Avalue’s Latest Multi-Function Touch Panel PC Revolutionizes Retail and Semi-Industrial Applications
Avalue Technology Inc. (TAIEX: 3479-TW), a global industrial PC solution provider and a Titanium member of the Intel® Internet of Things Solutions Alliance, is committed to providing a complete range of smart retail, smart healthcare, smart manufacturing, smart transportation and embedded solutions. Avalue Technology is proud to announce the launch of the APC-2138, a state-of-the-art multifunction touch panel PC designed to meet the dynamic demands of the retail and semi-industrial sectors. The APC-2138 is tailored for a wide range of applications including hospitality workstation, interactive point of interest (POI) and kitchen display. High performance for increased productivity At the heart of the APC-2138 is the Intel® Tiger Lake Core-i processor, part of the 11th generation Tiger Lake U Core™ i family. This ensures unmatched processing power, exceptional graphics performance, and compatibility with 5G technology. The APC-2138 is designed to power your business with seamless multitasking and fast data processing, making it the ideal choice for businesses that demand the highest level of performance. Data & access security at your fingertips Data security and access control are top concerns for businesses today. To address these concerns, the APC-2138 is equipped with a Trusted Platform Module (TPM 2.0). These features ensure that your sensitive data remains protected and provide streamlined access control to your systems, strengthening your overall security framework. Cost-effective solution with Agile Line family benefits As the latest addition to the Avalue Agile Line family, the APC-2138 leverages the cost advantage of Agile Line SBC (Single Board Computer) technology. This means you get a rugged, cost-effective Panel PC solution without compromising on quality. In addition, the APC-2138 has undergone high-reliability testing and is CE/FCC Class B certified, ensuring that it meets the highest industry standards. Sleek and functional design The APC-2138's design is as impressive as its performance. It features a true flat front panel with PCAP (Projected Capacitive) touch technology for a seamless and intuitive user experience. The plastic enclosure enhances its aesthetic appeal, and with a low profile of just 45.5mm, it blends seamlessly into any environment. Durability and low noise for Hassle-Free operation In busy retail and semi-industrial environments, reliability and minimal disruption are essential. The APC-2138 addresses this with a fanless design that reduces system noise and minimizes the risk of fan failure. In addition, the fully enclosed chassis prevents dust accumulation, making daily maintenance a breeze. Main features of APC-2138: l 21.5” PCAP Multi Touch l Onboard 11th Gen. Intel® Core™ SoC i5/i3 BGA Processor l 2 x 260-pin DDR4 3200 MHz SO-DIMM supports up to 64GB l 2 x GLAN, 2 x DP++, 4 x USB2 x 2W Speakers l Front IP65, Fanless System & VESA Compliance l 1 x 2.5” SSD w/Service Window l Optional WiFi 802.11 ac/a/b/g/n For more information about the APC-2138 and other innovative solutions from Avalue, please visit www.avalue.com.tw for more information on Avalue products, or contact sales@avalue-usa.com to talk to our sales team.
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Samtec Opens New Coaxial Cable and RF Connector Manufacturing Facility in Royersford, Pennsylvania
Samtec Inc., a global leader in the design and manufacturer of electronic interconnect solutions, announced the opening of its newest manufacturing facility in Royersford, Pennsylvania. The facility will specialize in the production of coaxial cables and RF connectors, servicing industries such as aerospace/defense, medical device, datacom, automotive, computer semiconductor, instrumentation, and consumer electronics. About Samtec’s New Facility This state-of-the-art facility is the latest addition to Samtec's extensive manufacturing network, which includes over 40+ global locations. The 24,000 square foot facility will leverage Samtec's decades of experience and industry-leading technology to produce high-quality coaxial cable and RF connectors. The new PA facility is developing next-generation precision RF cable assemblies that offer improved stability and flexure over time and address common industry concerns of phase length, delay, loss, and shielding effectiveness. Specifically colored in distinctive Samtec orange, this family of three new RF cables aims to balance application with cost sensitivities. These immediately recognizable orange Samtec cables will be manufactured in the new facility in Royersford, PA as well as Samtec’s Wilsonville, OR plant. The new PA cable facility is being staffed with highly skilled cable and RF professionals who bring a wealth of knowledge and experience to the production process. The facility is focused on developing next-generation products by harnessing the latest advancements in material science and signal integrity. Samtec Inc. is confident that this new facility will play a key role in supporting our customer’s needs of delivering high-quality products and Sudden Service®. “Samtec is pleased to announce this exciting opportunity of expanding our cable and RF connector product offering for mil/aero, consumer, medical, and harsh environments. This new manufacturing plant will provide robust product and technology solutions for our customers. Opening this new facility reinforces Samtec’s continued dedication to stay at the forefront of technological advancements in the interconnect industry.” – Brian Vicich, CTO at Samtec For more information on Samtec and its products and services, please visit: www.samtec.com For more information on career opportunities available at this or any Samtec location visit: www.samtec.com/careers