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Mouser Electronics New Product Insider: Over 3,100 New Parts Added in June 2021Global Distributor Leads in New Product Introductions
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Nuvoton Technology launches new NuMicro M031BT/M032BT series: Low-power BLE 5.0 and 2.4G dual-mode microcontroller
Nuvoton Technology launches new NuMicro® M031BT/M032BT series: a low-power BLE 5.0 and 2.4 GHz dual-mode microcontroller series based on Arm® Cortex®-M0 core operating up to 72 MHz, with up to 512 KB Flash and 96 KB SRAM. In addition to the BLE 5.0 and 2.4GHz RF wireless connectivity, the NuMicro M031BT/M032BT series feature built-in rich peripherals and analog functions for applications that need advanced and precise control functions in industrial control applications that it also requires wireless connectivity for sensor hubs in rigid working environments. The 5mm x 5mm QFN48 and 8mm x 8mm QFN68 package reduce the PCB size and RF layout difficulty. Furthermore, Nuvoton provides reference designs and rich sample codes to speed up the application development based on this M031BT/M032BT low-power BLE/2.4G RF microcontroller. The NuMicro M031BT/M032BT series provide up to +8 dBm RF transmit power, a good receiving sensitivity of -94 dBm, 1 Mb/s, or 2 Mb/s transmission speed RF applications, and outstanding anti-noise performance in 2.4GHz interference environments to ensure communication distance and reliability. With these, the M031BT/M032BT series are expected to meet the needs of application scenarios such as industrial Internet of Things (IIoT), smart home, consumer electronics, etc. The NuMicro M031BT/M032BT series operate at a voltage ranging from 1.8V to 3.6V. They feature a built-in 32-bit hardware divider, up to 9-channel PDMA, a 16-channel 12-bit 2 MSPS high sampling rate ADC that can run down to 1.8V low voltage, and 24-channel PWM running up to 144 MHz that can quickly respond and accurately control external devices. Besides, M031BT/M032BT also provide many peripherals such as one set USB, eight sets of 6 MHz UART supporting single-wire transmission, two sets of I2C, and up to two sets of highly flexible universal serial control interface (USCI) that can be configured as UART, I2C or SPI. To protect intellectual property rights, the NuMicro M031BT/M032BT series are embedded with an additional security protection Flash block (Security Protection ROM, SPROM) to provide an independent and secure encrypted execution area protect critical program code. Flash lock bits are designed to provide firmware to prevent external access or write protection. In addition, there is a 96-bit unique chip identification (Unique Identification, UID) and a 128-bit unique customer identification (UCID) on each M031BT/M032BT, which significantly improves product confidentiality and code security. Nuvoton provides complete development tools, such as the NuMaker-M031BT and NuMaker-M032BT evaluation boards, software development kits, and sample codes. In addition, free downloadable Keil® MDK is available to speed up the end-product evaluation and development cycle. More information about the Nuvoton NuMicro M031BT/M032BT series: M031BT series; M032BT series The NuMaker-M032BT development board is now open for sample application; interested applicants may apply online: https://www.nuvoton.com/support/technical-support/form/ The M031BT/M032BT series provide rich digital and analog peripherals, low-power Bluetooth BLE 5.0 and 2.4G dual-mode communication, and excellent radio frequency networking functions. These features significantly reduce transmission power consumption, prolong battery life, and allow traditional microcontrollers with rich control functions for IIoT that need wireless connectivity. Nuvoton Technology would continue releasing new low-power Bluetooth microcontrollers for consumer devices, industrial control, smart home, and automotive applications.
Toray Develops Low-Dielectric-Loss PBT for 5G Communications, Automated Driving and Intelligent Transportation Systems Applications
Toray Industries, Inc., announced today that it has developed a high-performance polybutylene terephthalate (PBT) (see Glossary note 1) whose dielectric losses (note 2) in the high-frequency millimeter wave band are around 40% lower than those of conventional PBT without compromising dimensional stability and moldability. The new offering product should significantly enhance the performances of high-speed transmission connectors, communication modules, millimeter wave radars, and other equipment for 5G base stations and automated driving systems. The company looks to initiate full-fledged sample work to meet demand for materials used in 5G communication materials. It will develop applications for advanced driver-assistance systems (note 3) and intelligent transportation systems (note 4) for automated driving setups. Applications for PBT include automotive, electrical, and electronic parts. This reflects its outstanding balance of dimensional stability, strength, and other performance elements. It is also easy to mold and process. There has been a growing need in recent years to lower dielectric losses and thereby cut transmission losses in high-frequency components for automated driving and other applications. This has led to the adoption of polymer alloys (note 5) and fillers. There are limits to reducing dielectric losses, however, as such losses from the resin itself are large. Other issues are heat resistance and mechanical property degradation. Toray’s PBT delivers a loss tangent (note 6) of 0.006 in the ultra-wide 79 GHz millimeter wave band. Losses from that factor are around 40% below those of conventional PBT resins while retaining their basic properties. That is because the company constrained the polymer’s molecular motion in the high-frequency range by leveraging polymerization technology to attain a new structure. The new offering keeps the dielectric loss low across 5G communication frequency bands, from sub-6 GHz through high-frequency millimeter wave bands. Dielectric stability is superb in very hot and humid environments. It cuts transmission losses and enables wide-area sensing for incident waves from wide angles, which is an issue in designing high-frequency components. It has been challenging to downsize products without changing the electrical resistance of electric circuits and connectors. The low dielectric loss of Toray’s new resin makes it possible to keep electrical resistance unchanged, which should contribute to shrinking products, reducing weight, and improving performance. Toray has commercialized a range of 5G-suitable resins, and will promote its new offering for use in semiconductor devices and electronic components to support advanced communication technologies. The company will keep developing revolutionary materials that contribute to social progress in line with its commitment to innovating ideas, technologies, and products that deliver new value. An application of Toray’s low-dielectric-loss PBT resin ### [Glossary] Polybutylene terephthalate offers excellent long-term thermal, chemical, and weather resistance and electrical characteristics. A dielectric loss is an energy loss caused by the conversion of electromagnetic wave energy into heat in a material. Advanced driver-assistance systems employ various sensors to assess surrounding conditions, inform and warn to drivers, and modify steering wheel and brake control to enhance safety for all road users. Intelligent transport systems manage information on people, roads, and automobiles to help reduce accidents, congestion, and environmental impact. Polymer alloys are performance-enhancing polymer blends. The loss tangent indicates the extent of dielectric losses. Plastics : https://www.toray.jp/plastics/en/
Mouser Electronics New Product Insider: Almost 4,500 New Parts Added in May 2021
As an authorized distributor, Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,100 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. In May, Mouser launched more than 4,465 products ready for shipment. Some of the products introduced by Mouser last month include: NXP Semiconductors S32G2 Vehicle Network Processor : NXP S32G2 is a high-performance vehicle network processor that combines CAN, LIN, and FlexRay networking with high-data-rate Ethernet networking. Sensirion SFC5500 Digital Multi-Gas Mass Flow Controllers : Sensirion SFC5500 are CMOSens®-based devices that measure gas mass flow by the calorimetric principle based on heat transfer. OSRAM Opto Semiconductors Micro SIDELED 3806 LED : OSRAM Micro SIDELED® 3806 is an SMT side-emitting LED with 180lm/W optical efficacy, 120° typical radiation, and 1B corrosion robustness class. DIGI IX15 Gateway and Cellular Routers : DIGI IX15 industrial-grade gateway and cellular routers connect Digi XBee® modules to cloud applications over the cellular network, providing an easy path to internet connectivity for the Digi XBee ecosystem. To see more of the New Product Insider highlights, go to https://www.mouser.com/newproductinsider
Unlock More Control Customization With the Latest RTI Training Opportunities
Leading control and automation manufacturer RTI has announced its summer training schedule, covering a range of topics from on-screen display to APEX layers to video matrices and video walls. Hosted by RTI Dealer Experience Director Vincent Bova, the four new webinars will take a deep dive into RTI systems to unlock more customization and power that integrators can leverage to elevate the control experience for customers. "Our latest webinar series is designed to help integrators get the most out of their RTI systems," said Bova. "We developed the topics in response to requests from RTI dealers." The webinars include: Programming the T1B+ and the XP-8v On-Screen Interface in APEX, Advanced Layer Programming in APEX, Programming the VX44/88-18GIG and Control Devices Through CEC, and Building Video Walls With RTI VIP Solution in APEX. Each topic will be offered twice each day, at 11 a.m. and 5 p.m. EDT. Registration for the new webinars is at https://www.rticontrol.com/june-july-training. The first webinar, "Programming the T1B+ and the XP-8v On-Screen Interface in APEX," will be held Thursday, June 17. Integrators will learn just how simple the T1B+ remote controller is to use and how programming it to communicate with third-party devices takes only a few minutes using RTI drivers. Attendees will learn how to control music, climate, lighting, and security devices, and how to use the built-in XP-8v user interface. In the "Advanced Layer Programming in APEX" sessions, offered June 24, attendees will discover how the powerful layers feature can enhance a client's experience on any RTI interface. Integrators will learn how to use the layer feature to bundle multiroom control interfaces and the layer switch driver that eliminates flags in programming. The "Programming the VX44/88-18G and Control Devices Through CEC" webinar on July 8 will showcase the rich integration features and CEC control within the RTI full-bandwidth 18-GIG matrix solutions. With this option, integrators can enable systems that can control all of customer's televisions and source devices, including Firestick, Apple TV, Android boxes, and more, without having to run any control wiring or using drivers. Attendees will also learn how CEC control has never been easier and can be used to increase productivity. Finally, on July 15, in the "Building Video Walls With RTI VIP Solution in APEX" webinar, integrators will learn how to meet the exploding video wall demand, as bars and restaurants make a comeback, using different video-wall combinations within RTI video-over-IP products. APEX' drag-and-drop simplicity will be demonstrated, as well as some powerful programming tips to use when incorporating video walls into an interface. More information about RTI is available at http://www.rticontrol.com
Teledyne Optech launches CZMIL SuperNova
Teledyne Optech and Teledyne CARIS, both Teledyne Technologies [NYSE:TDY] companies and global leaders in advanced lidar sensors and marine mapping software, announce their next generation bathymetric lidar, the CZMIL SuperNova. The CZMIL SuperNova boasts the best depth performance and the highest green laser point density in its class. Introducing SmartSpacing technology for even and efficient point spacing, real-time processing capability for reduced post-processing time and configurable modes for maximizing performance in different water environments, the SuperNova provides a wide range of inputs for climate change modelling and is Ideal for inland water environments, base mapping for coastal zones and shoreline. To complete the solution, Teledyne CARIS has integrated its BASE Editor software for seamless data processing capacity. Leveraging AI techniques for land/water discrimination and noise classification the CZMIL SuperNova bathymetric solution effectively delivers on marketplace demands for efficiencies in the processing workflow. CZMIL SuperNova Product Manager Jennifer Aitken explained: “CZMIL SuperNova builds on over 30 years of experience with airborne green laser bathymetry. The ability to configure the system on-the-fly and optimize data collection for local conditions has significant benefit. We are getting plenty of signal at 600 meters altitude and even higher, so our coverage area is increasing without sacrificing depth penetration.”
New Mouser Electronics Hub Highlights Newest Articles, Videos and Product Releases from TE Connectivity
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, and TE Connectivity (TE), a world leader in connectivity and sensors, have partnered to create a new content platform devoted to TE’s newest resources, products, and technical insights. Engineers and designers can find the platform by visiting https://te.mouser.com/ New Mouser Electronics Hub Highlights Newest Articles, Videos and Product Releases from TE Connectivity The new site from Mouser and TE offers a comprehensive, continually updated archive of infographics, videos, and technical articles, providing valuable insights into some of the most challenging aspects of connected automobile and smart home design. The platform is launching with more than 50 pieces of content, covering technologies including antennas, sensors, Internet of Things devices, and medical solutions. Each article include links to relevant TE products, connecting usable information from industry experts to the technologies and solutions needed to support each application. With over 69,000 TE products, Mouser offers an ever-broadening selection of the newest TE interconnect, passive, and sensor solutions, constantly adding new products. For example, Mouser stocks TE’s FAKRA automotive connector system, which is based on FAKRA RF and USCAR standards requirements and includes RF cable assemblies, terminals, and housings. The AmbiMate sensor module MS4 series boards offer a set of four core sensors — motion, light, temperature, and humidity — with optional sensors for volatile organic compounds (VOCs), sound, and CO2. The modules enable easy integration into a host product for applications such as indoor lighting, air quality, building automation, and energy management applications.
Forget wearables: Future washable smart clothes powered by Wi-Fi will monitor your health
Purdue University engineers have developed a method to transform existing cloth items into battery-free wearables resistant to laundry. These smart clothes are powered wirelessly through a flexible, silk-based coil sewn on the textile. In the near future, all your clothes will become smart. These smart cloths will outperform conventional passive garments, thanks to their miniaturized electronic circuits and sensors, which will allow you to seamlessly communicate with your phone, computer, car and other machines. This smart clothing will not only make you more productive but also check on your health status and even call for help if you suffer an accident. The reason why this smart clothing is not all over your closet yet is that the fabrication of this smart clothing is quite challenging, as clothes need to be periodically washed and electronics despise water. Purdue engineers have developed a new spray/sewing method to transform any conventional cloth items into battery-free wearables that can be cleaned in the washing machine. "By spray-coating smart clothes with highly hydrophobic molecules, we are able to render them repellent to water, oil and mud," said Ramses Martinez, an assistant professor in Purdue's School of Industrial Engineering and in the Weldon School of Biomedical Engineering in Purdue's College of Engineering. "These smart clothes are almost impossible to stain and can be used underwater and washed in conventional washing machines without damaging the electronic components sewn on their surface." This technology is published in the May 25 edition of Nano Energy. Martinez's laboratory group has several videos about the technology on its dedicated YouTube channel: "Wireless non-contact voltage detection glove" "Powering OSC-based e-textiles underwater" "Wirelessly powered washable textiles" The rigidity of typical waterproof garments and their reduced breathability make them feel uncomfortable after being worn for a few hours. "Thanks to their ultrathin coating, our smart clothes remain as flexible, stretchable and breathable as conventional cotton T-shirts," Martinez said. Unlike common wearables, the Purdue smart clothes do not require batteries for powering. By simply harvesting energy from Wi-Fi or radio waves in the environment, the clothes are capable of powering the circuitry sewn on the textile. One example is a battery-free glove that illuminates its fingertips every time the user is near a live cable to warn about the possibility of an electric shock. Another is a miniaturized cardiac monitoring system sewn on a washable sweatband capable of monitoring the health status of the wearer. "Such wearable devices, powered by ubiquitous Wi-Fi signals, will make us not only think of clothing as just a garment that keeps us warm but also as wearable tools designed to help us in our daily life, monitor our health and protect us from accidents," Martinez said. "I envision smart clothes will be able to transmit information about the posture and motion of the wearer to mobile apps, allowing machines to understand human intent without the need of other interfaces, expanding the way we communicate, interact with devices, and play video games." This technology can be fabricated in conventional, large-scale sewing facilities, which are expected to accelerate the development and commercialization of future smart clothes. Martinez and his team have worked with the Purdue Research Foundation Office of Technology Commercialization to protect the intellectual property. The innovations are patent pending. For information on licensing a Purdue innovation, contact the Office of Technology Commercialization at firstname.lastname@example.org
Wirepas announces game-changing connectivity system for smart tracking
Wirepas, a software connectivity company bringing massive IoT to all enterprises, has launched Wirepas Massive Tracking, a new smart tracking software suite. Virtually no infrastructure, no wires Scalable network with no limit in size A 100,000 m² facility installed in a single day by anyone Zero disruption to site operations An inventory of up to 5,000 devices with 100% accuracy in under a minute Game changing vendor interoperability Vastly improved user experience Wirepas, a Finnish connectivity company on a mission to change enterprise IoT, today announced the release of Wirepas Massive Tracking. The new smart tracking software suite embeds Wirepas Massive – the company’s large-scale mesh connectivity software for massive IoT. Deploying wired positioning infrastructure across large spaces like warehouses, construction sites, campuses or hospitals is costly and time consuming. Wirepas Massive Tracking solves exactly these issues. First since Wirepas Massive Tracking needs virtually no infrastructure, a smart tracking system in a 100,000 m² facility can be installed in a single day, without disrupting site operations. Then, Wirepas Massive Tracking’s Inventory Mode allows users to add an inventory of up to 5,000 devices with 100% accuracy in under a minute. And finally, the new suite introduces industry-leading interoperability between tag vendors. This enables true diversity in form factors and price points – previously unseen in smart tracking and sensing projects. “System integrators and solution providers alike will find Wirepas Massive Tracking extremely easy to use. It includes ready-to-use tag software – which supports a large variety of tag vendors – as well as open-source gateway software and a positioning backend framework based on modern APIs. This significantly shortens time-to-market for system integrations and solution providers to develop and release new IoT solutions,” said Youssef Kamel, SVP, Head of Smart Tracking at Wirepas. Wirepas Massive Tracking is tailor-made to suit diverse tracking use cases, including assets, goods and people. Its unique benefits will help companies in the logistics and warehousing, healthcare, construction and manufacturing sectors to streamline and future-proof their operations. Wirepas Massive Tracking is already supported by many Wirepas partners, including Axones, BlueUp, ELA Innovation, Fujitsu Components, Good Way, Haltian, Redlore, Tatwah, Treon and SolidRun, as well as system integrators such as Apitrak, Arenzi, Bornemann, DMI, Indutrax, Intranav, Mecomo, Omniscient, Orange, Succesful Endeavours and Wakecap. This ecosystem of locator, asset tag, gateway providers and system integrators is expected to grow significantly in the future, as more partners continue to come on-board. “This release significantly reduces the cost and complexity of large smart tracking projects. Building on the existing capabilities of Wirepas Massive, it significantly lowers the barrier for adoption of modern Smart Tracking technology. As such, it will be available to a much larger ecosystem of integrators globally. I am delighted with the release of Wirepas Massive Tracking and look forward to many successful smart tracking engagements,” added Youssef Kamel, SVP, Head of Smart Tracking at Wirepas. To learn more about Wirepas, please visit: www.wirepas.com
Mouser Electronics Examines Power Management in Latest from Empowering Innovation Together Series
Mouser Electronics Inc. today released the second installment of the 2021 series of its award-winning Empowering Innovation Together™ program and The Tech Between Us podcast. The series’ second episode, available on the Mouser website, Alexa, Apple Podcasts, Google Podcasts, iHeartRadio, Pandora and Spotify, explores power management and the potential behind wide bandgap technology. Mouser Electronics Examines Power Management in Latest from Empowering Innovation Together Series Each month, the series brings a closer look to industry-changing technologies shaping modern society, and encompasses a timely collection of podcasts, videos, blogs, articles and infographics that center around today’s key tech trends. In this episode, Raymond Yin, Mouser’s Director of Technical Content, is joined by Steven Shackell, ON Semiconductors’ Product Line Manager for Silicon Carbide and Gallium Nitride, for a conversation about current wide bandgap devices. As they define what makes a semiconductor “wide bandgap,” the pair shares more about the technology’s applications, benefits and limitations for power management design. “This latest installment of the EIT program presents engineers with what the future may hold for power management technology,” says Glenn Smith, President and CEO of Mouser Electronics. “As demand for energy increases, wide bandgap offers significant opportunities for further improvement in power efficiency, positioning it as the future of semiconductors.” Future tech topics in the 2021 EIT series following power management will delve deeper into artificial intelligence, automation and more, and review new product technologies like sensors and RF and wireless. The program spotlights various new product developments and unveils the technical developments required to stay up-to-date with new trends in the marketplace. The second installment of the 2021 Empowering Innovation Together program is sponsored by Mouser’s valued manufacturer partners Infineon Technologies, ON Semiconductor and Wolfspeed. Established in 2015, Mouser’s Empowering Innovation Together program is one of the industry’s most recognized electronic component programs. To learn more, visit https://www.mouser.com/empowering-innovation and follow Mouser on Facebook and Twitter.
Mouser Electronics New Product Insider:Over 3,000 New Parts Added in April 2021
Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,100 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. - October 2020 Product Insider In April, Mouser launched 3,069 new parts for shipment to customers. Some of those innovative new components and technologies include: Texas Instruments TMS570LS1227 16/32-Bit RISC Flash Microcontroller The TI TMS570LS1227 is an automotive-grade solution ideal for high-performance real-time control applications with safety-critical requirements. The microcontroller family provides advanced safety architecture that includes dual CPUs in lockstep, CPU and memory BIST logic, ECC on both the flash and the data SRAM, and many more features. STMicroelectronics Wireless Connectivity Solutions ST’s wireless connectivity solutions are a portfolio of wireless technologies that feature specific communication ranges, power efficiencies, latencies, bandwidths, and networking topologies. The portfolio covers the widest range of connectivity, including sub-1GHz long-range networking devices (enabling LoRaWAN®, Sigfox, and Wireless M-Bus connectivity), 60 GHz short-range millimeter-wave RF, Bluetooth® Low Energy, 802-15-4, OpenThread, LTE Cat 1, and Narrowband IoT. TE Connectivity NTSEAL 20-Position Connectors TE’s NTSEAL 20-position connectors provide flexible, robust wire-to-wire connectivity in a compact format for harsh environments with extreme temperatures and engine-level vibrations. Applications include wire-to-wire, panel/bulkhead mount, engine, chassis, after-treatment, and automation. ROHM Semiconductor BM6437xS-VA 600V IGBT Intelligent Power Modules The BM6437xS-VA Intelligent Power Modules (IPMs) integrate gate drivers, bootstrap diodes, IGBTs, and flywheel diodes. To see more of New Product Insider highlights, visit https://www.mouser.com/newproductinsider As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.
Mouser Electronics Meets Design Engineers’ Needs with Expansive Portfolio of ON Semiconductor Products
Mouser Electronics, Inc. is a global authorized distributor of products from ON Semiconductor, a leading supplier of semiconductor-based solutions driving energy-efficient innovations, empowering customers to reduce global energy use. With over 21,000 ON Semiconductor products in stock, Mouser offers an ever-broadening selection of the manufacturer’s newest semiconductor solutions, adding new products every day. Mouser Electronics Meets Design Engineers’ Needs with Expansive Portfolio of ON Semiconductor Products This year, Mouser and ON Semiconductor celebrate 15 years of partnership and success. Throughout this history, the global distributor has received several top awards for exceptional performance from ON Semiconductor, including two consecutive Global Distributor of the Year awards. The following are just a few of the popular ON Semiconductor products available from Mouser: ON Semiconductor offers a complete portfolio of USB Type-C and Power Delivery (PD) solutions, including host and device controllers, cable markers, and protection switches. Suitable for end products such as mobile chargers, power adapters, notebook and desktop PCs, mobile phones, and tablets, the portfolio also includes AEC-Q101-qualified and PPAP-capable options specifically engineered and qualified for automotive industry applications. SuperFET® III MOSFETs are high-voltage, super-junction N-channel MOSFETs designed to meet the high power density, system efficiency, and exceptional reliability requirements of telecom, server, electric vehicle (EV) charger, and solar products. ON Semiconductor’s wide-bandgap silicon carbide (SiC) portfolio of 650V and 1200V diodes, 650V and 1200V IGBT and SiC diode Power Integrated Modules (PIMs), and more offer highest efficiency, faster-operating frequency, increased power density, reduced EMI, and reduced system size and cost. In addition to offering a broad selection of ON Semiconductor products, Mouser is proud to sponsor the 2021 ON Semiconductor Power Webinar. At each of the 10 single-day webinar events, occurring throughout May and June 2021, engineers can experience an information-packed presentation that brings together technical knowledge, advanced power supply concepts, and design principles with “hands-on” real-world application examples.
SMPM Solutions: Ganged, Cable-to-Board, and Board-to-Board
Samtec has released a family of SMPM products designed to support demands of emerging technologies where space is limited and a high operating frequency up to 65 GHz is required. Samtec offers ganged, multi-port solutions in both cable-to-board and board-to-board applications. Standard SMPM connectors with bullet adaptors, and cable assemblies using .047" and .086" cable, are also available and offer a maximum VSWR of 1.40 or better. For more information, please visit www.samtec.com/SMPM
EVK9351AUT Accelerates Project Launch for Optical Gigabit Connectivity
leading supplier for gigabit connectivity over fiber optics – presents the new extensive evaluation kit EVK9351AUT for a quick and easy project launch of optical gigabit connectivity in vehicles. “Our new EVK9351AUT equips carmakers, suppliers, and test houses to fully evaluate the KDPOF automotive transceivers KD9351 and KD1053 for automotive optical 1000BASE-RHC PHY implementation,” explained Carlos Pardo, CEO and Co-founder of KDPOF. “We thus support our recently announced new integrated KD9351 Fiber Optic Transceiver (FOT) for comprehensive evaluation.” The platform provides all the functional and performance evaluation capabilities requested by automotive OEMs, Tier1s, and test houses. It therefore enables product designers to successfully evaluate KDPOF’s technology and shorten the time-to-market. The new KD9351, in combination with the continuing KD1053 IC, cuts the cost for 1 Gb/s optical connectivity by 30 percent, providing competitive pricing for EMC critical or galvanic isolated critical links. Applications include safe Ethernet backbones and sensor links for advanced driver assist systems (ADAS). Evaluation Kit for 1000BASE-RHC Automotive Bridge The extensive evaluation kit EVK9351AUT contains 2 EVB9351AUT evaluation boards, 2 evaluation board metal enclosures (optional), 2 1000BASE-T SFP modules, 2 100BASE-TX SFP modules (optional), 1 USB2ALL monitoring box, 1 optical harness, 2 Cat. 5e UTP cables, 2 direct-attach passive SFP twinax cables (optional), as well as user and design documentation. The evaluation boards can operate at 100 and 1,000 Mb/s. A single version of a board is compatible with multiple headers and harnesses from different manufacturers. The user can plug a standard SFP module into the cage and have media converter functionality supporting Wake-Up & Sleep. Complementary items can be provided, such as optical harness, loopback SFP, or SFP direct-attach passive twinax cable. The board is configured in an EEPROM memory. The provided SDK allows the generation of binaries for different configuration options and flashing of the EEPROM. In addition, control and status of the KD1053 transceiver is accessed through the GUI (included in the SDK), which may be run on a computer connected via a USB2All module. The GUI includes several panels that provide complete access to the KDPOF transceiver, providing information on the link status and its parameters. User and design documentation is included in order to simplify the evaluation and the development of automotive end products based on the two-part numbers.
Mouser Electronics Stocks Wide Selection of Latest Analog Devices Products
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is also an authorized global distributor of solutions from Analog Devices, Inc., a leading global high-performance analog technology company dedicated to solving the toughest engineering challenges. With over 23,000 Analog Devices products, including 4,000 development tools, Mouser offers an ever-broadening selection of the newest high-performance analog, mixed-signal, and digital signal processing (DSP) integrated circuits from Analog Devices. The following are just a few of the popular Analog Devices products available from Mouser: AD4695 and AD4696 are 16-channel,16-bit successive approximation register (SAR) analog-to-digital converters (ADCs) with Easy Drive features that relax the drive requirements of the analog front end (AFE) and reference circuitry. The compact, high-accuracy, low-power devices are optimal for use in space-constrained, multichannel, precision data acquisition systems and monitoring circuits. The AD9081 Mixed-Signal Front-End (MxFE®) incorporates a 16-bit, 12-GSPS radio frequency (RF) digital-to-analog converter (DAC) core and a 12-bit, 4-GSPS ADC core. The device also includes a 16-lane, 24.75 Gbps JESD204C or 15.5 Gbps JESD204B data transceiver port, an on-chip clock multiplier, and digital signal processing capability targeted at single- and dual-band direct-to-RF radio applications. HMC8362 and HMC8364 low-noise, quad-band voltage-controlled oscillators (VCOs) are designed to offer wideband capabilities without compromising phase noise performance. The HMC8362 and HMC8364 VCOs integrate four independent, narrowband VCOs with overlapping frequency bands, operating at a fundamental frequency range of 11.90 GHz to 18.30 GHz (HMC8362) or 18.10 GHz to 26.60 GHz (HMC8364). The ADAQ23875 µModule® data acquisition solution integrates multiple common signal-processing and conditioning blocks into a single device, reducing end system component count and development cycles of precision measurement systems. In addition to stocking the latest solutions, Mouser also regularly collaborates with Analog Devices to produce engaging, informative e-books on cutting-edge technologies that engineers want to know more about. Most recently Mouser and Analog Devices gave engineers a deep dive into key energy storage technologies and their applications as well as and valuable insight into the importance of precision measurement Internet of Things (IoT) devices.
TYAN Uses New 3rd Gen Intel Xeon Scalable Processors to Drive Performance for AI and Cloud Data Centers
TYAN®, an industry-leading server platform design manufacturer and MiTAC Computing Technology Corporation subsidiary, today introduced the 3rd Gen Intel Xeon Scalable processor-based server platformsfeaturing built-in AI acceleration, enhanced security, and PCIe Gen4 support for the most demanding workloads in cloud, enterprise, AI and HPC fields. "Thanks to new features, such as higher per-core performance, Intel SGX, Intel Crypto Acceleration, Intel Optane persistent memory, and increased memory bandwidth, the new 3rd Gen Intel Xeon Scalable processors along with TYAN’s AI, cloud computing, and storage platforms enable our customers to drive fast time to value for their businesses", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation’s Server Infrastructure BU. “Optimized for cloud, enterprise, AI, HPC, network, security and IoT workloads, 3rd Gen Intel Xeon Scalable processors come with 8 to 40 powerful cores and a wide range of frequency, feature and power levels to deliver the infrastructure flexibility customers need to achieve more”, said Greg Ernst, Intel Vice President and General Manager US Sales. AI optimized server platforms to deliver faster time-to-results Optimized for AI and HPC applications, the Tempest HX S7120 is a mainstream server motherboard in SSI EEB (12" x 13.1") form factor, and the Tempest HX S5642 is a standard server motherboard in SSI CEB (12" x 10.6") form factor. The S7120 supports dual 3rd Gen Intel Xeon Scalable processors with Intel Deep Learning Boost, 16 DDR4-3200 DIMM slots, dual 10GbE or GbE onboard network connections, three PCIe Gen4 x16 and two MVMe M.2 slots. The HX S5642 is equipped with a single 3rd Gen Intel Xeon Scalable processor, 8 DDR4-3200 DIMM slots, two 10GbE and one GbE LAN ports, three PCIe Gen4 x16 and two MVMe M.2 slots. Fueled by 3rd Gen Intel Xeon Scalable processors with built-in AI acceleration, TYAN’s Thunder HX TS65-B7120 is a self-contained system and is ideal for AI inference applications. The 2U system features 16 DDR4 DIMM slots, five standard PCIe Gen4 slots, twelve front 3.5-inch tool-less SATA drive bays with support up to four NVMe U.2, and two rear 2.5-inch tool-less SATA drive bays for boot drive deployment. High performance computing servers with higher I/O throughput to power cloud The TYAN Tempest CX S7126 is a rack-optimized server motherboard in EATX (12" x 13.1") form factor designed for datacenters with dual 3rd Gen Intel Xeon Scalable processors, 16 DDR4-3200 DIMM slots, two PCIe Gen4 x32 high-density riser slots, two GbE onboard LAN ports and one NVMe M.2 slot. Moreover, the Thunder CX GC68-B7126 and Thunder CX GC68A-B7126 deploy the same S7126 board to offer a variety of cloud applications with high-density deployment in 1U chassis. The GC68-B7126 accommodates four 3.5-inch SATA and four 2.5-inch tool-less NVMe drive bays for applications requiring large storage capacity with sufficient cache space, while GC68A-B7126 offers twelve 2.5-inch tool-less drive bays with support for up to two NVMe U.2 devices for high IOPS storage requirements. Two systems provide up to a pair of PCIe Gen4 x16 expansion and an OCP 2.0 LAN mezzanine slot.
Samtec Compression Mount PCB Connectors With Reach To 65 GHz
Samtec now offers compression mount PCB connectors for microwave applications up to 65 GHz. The solderless vertical launch allows for easy, field replaceable, cost-effective assembly to the board. Connector interfaces include 1.85 mm (65 GHz), 2.40 mm (50 GHz) and 2.92 mm (40 GHz) with microstrip and stripline options available. Threaded coupling provides superior repeatability with high mechanical stability. Mating cable assemblies are also available. 1.35 mm (90 GHz) connectors coming soon. About Samtec Founded in 1976, Samtec is a privately held, $822 million (USD) global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Two-Piece Board-to-Board, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. Samtec is the recognized service leader in the connector industry, having won the Bishop and Associates Customer Survey of the Electronic Connector Industry a record 17 times.
TYAN Now Offering AMD EPYC™ 7003 Processor Powered Systems
TYAN®, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introducedAMD EPYC™ 7003 Series Processor-based server platformsfeaturing efficiency and performance enhancements in hardware, security, and memory density for the modern data center. “Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN’s industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision,” said Danny Hsu, Vice President of MiTAC Computing Technology Corporation’s Server Infrastructure BU. “Moving the bar once more for workload performance, EPYC™ 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes." High memory capacity, multi-node and data cache servers to power the cloud TYAN’s Transport CX lineup with AMD EPYC 7003 Series processors is designed for cloud and data analytics that require large memory capacity and fast data processing. The Transport CX GC79-B8252 and Transport CX GC79A-B8252 are 1U dual-socket server platforms which are ideal for high-density data center deployment with a variety of memory-based computing applications. Two systems feature 32 DDR4 DIMM slots, two standard PCIe Gen.4 x16 expansion slots, and an OCP 3.0 LAN mezzanine slot. The GC79-B8252 platform provides four 3.5-inch SATA drive bays and four 2.5-inch NVMe drive bays with tool-less carriers, while the GC79A-B8252 platform offers twelve 2.5-inch drive bays with up to twelve NVMe U.2 support. The Transport CX GC68-B8036-LE and Transport CX GC68A-B8036are cost-optimized single-socket cache server platforms featuring 16 DDR4 DIMMs, a pair of PCIe Gen.4 x16 expansion and an OCP 2.0 LAN mezzanine slot in 1U. The GC68-B8036-LE supports four 3.5-inch SATA and four 2.5-inch tool-less NVMe drive bays for large storage capacity; the GC68A-B8036 accommodates twelve 2.5-inch tool-less drive bays with support for up to twelve NVMe U.2 devices for applications with high storage performance requirements. The Transport CX TN73-B8037-X4S is a 2U multi-node server platform with four front-serviced compute nodes. Each node supports one AMD EPYC 7003 Series processor, four 2.5-inch tool-less NVMe/SATA drive bays, eight DDR4 DIMM slots, three internal cooling fans, two standard PCIe Gen.4 x16 expansion slots, two internal NVMe M.2 slots and one OCP 2.0 LAN mezzanine slot. The platform is suited for high-density data center deployments and targets scale-out applications with large numbers of nodes. Optimized for accelerate computational workloads in HPC, AI and deep learning Leveraging 3rd AMD EPYC processors, the TYAN Transport HX product line delivers leadership compute in supercomputing and deep learning. The Transport HX TN83-B8251 is a 2U 4-GPU server with two CPUs, two PCIe 4.0 x16 high-speed networking cards, and eight 3.5-inch hot-swap SATA or NVMe U.2 tool-less drive bays. The platform supports up to four double-width GPU cards that can be used to scale up the number of GPUs to improve HPC and deep learning performance. Optimized for HPC and virtualization applications, the Transport HX TS75-B8252 and Transport HX TS75A-B8252 are 2U dual-socket server platforms with support for 32 DIMM slots and up to nine PCIe 4.0 slots. The TS75-B8252 accommodates twelve hot-swap, tool-less 3.5-inch drive bays with up to four NVMe U.2 support; TS75A-B8252 accommodates 26 hot-swap, tool-less 2.5-inch drive bays with up to eight NVMe U.2. Hybrid software-defined storage server to drive outstanding performance TYAN Transport SX lineup is designed to deliver massive I/O and memory bandwidth for storage applications. The Transport SX TS65-B8253 is a 2U hybrid software storage server for various datacenter and enterprise deployment supporting the dual-socket AMD EPYC 7003 Series processor, 16 DDR4 DIMM slots and seven standard PCIe 4.0 slots. The platform is equipped with up to two 10GbE and two GbE onboard network connections, twelve front 3.5-inch tool-less SATA drive bays, up to four NVMe U.2 devices, and two rear 2.5-inch tool-less SATA drive bays for boot drive deployment. In addition, TYAN offers drop-in AMD EPYC 7003 Series processor support on existing EPYC 7002 Series processor-optimized server platforms through a BIOS update. Customers can enjoy all-new "Zen 3" CPU architecture with full feature functionality from their current 2ndGen AMD EPYC processor-based platforms.