Mouser Adds Over 50 New Suppliers in 2018 to Expand Industry-Leading Line Card
Galvanic Isolation Secures New 48-volt Electrical Architectures
Nordic’s nRF91 SiP, Now at Mouser, Offers Compact, Low-Power Cellular IoT Solution
u-blox seeks fair, reasonable and non-discriminatory (FRAND) licensing terms
Mouser Electronics New Product Insider: December 2018
HID Global Unites High Security Authentication and Convenience with Its Crescendo Mobile Smart Card
Mouser Electronics New Product Insider: November 2018
PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cable Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost
Tracealyzer 4 Now Supports On Time RTOS-32
Mouser Electronics and Grant Imahara Launch New Series All Things IoT about Technology Redefining How We Live
Percepio Partners with UltraSoC For Unified Hardware and Software Tracing
Percepio, announces an important step in its partnership with SoC analytics IP vendor UltraSoC. Together the two companies have integrated Percepio Tracealyzer with UltraDevelop 2, announced today. UltraDevelop is UltraSoC’s complete integrated development environment (IDE) for system-on-chip (SoC) development teams. The visualization capabilities of Tracealyzer 4 will provide UltraDevelop 2 users with an integrated view of both hardware and software operation in multicore SoCs. “Our cooperation with UltraSoC signals Percepio’s transition from an RTOS tracing tool vendor into the leading visualization specialist in a broader spectrum of systems development. Tracealyzer is no longer just for RTOS software developers. By combining hardware and software visualization, developers get a much better picture of how their systems work, from bus activity up to OS scheduling. It is all connected and now you can see how,” says Percepio CEO and founder Johan Kraft. Rupert Baines, UltraSoC CEO, comments: “Developers are desperate for technologies that can help them manage the complexities of today’s systems. UltraDevelop 2 allows engineering teams to view their designs in real-time, interactively and at exactly the level of detail they require – and with strong links between the worlds of hardware and software. Working with Percepio has allowed us to create an extremely powerful toolset that delivers the actionable insights required by system developers to foster innovation, increase product quality, cut time-to-market and reduce costs.” The UltraDevelop 2 IDE, including Tracealyzer visualization, will be available for UltraSoC customers starting in Q1 2019.
Percepio Announces Tracealyzer Support for STLINK-V3 Debug Probes
Percepio, the leader in software trace visualization for embedded systems and IoT, announces Tracealyzer support for the newly released STLINK-V3 debug probe from STMicroelectronics. “The new STLINK support in Tracealyzer makes trace visualization much more accessible for developers using STM32 MCUs, allowing them to better understand their software’s runtime behavior and speed up their development. We are happy that STMicroelectronics recognizes the importance of software trace visualization by allowing us to support STLINK-V3 directly at the launch,” said Percepio CEO and founder Dr. Johan Kraft. “ST having added to STLINK-V3 such important features as mass-storage support, a virtual COM port with multipath bridge, and three-times faster write performance makes this competitively-priced STM32 and STM8 debugger even more powerful and useful,” said Daniel Colonna, Marketing Director Microcontrollers Division, STMicroelectronics. “Now, with the upgrade of Percepio’s Tracealyzer to support STLINK-V3 and its availability in a time-limited evaluation license, developers can see the valuable debug features it provides and evaluate its power to accelerate their design and debug cycles.” Stand-alone and onboard probes The STLINK-V3 is a programmer and debugger for the STM8 and STM32 microcontroller, that is available both as a stand-alone probe, STLINK-V3SET, and for onboard USB interfaces on development boards. STLINK-V3SET is composed of a main module and a complementary adapter board. It provides a virtual COM port interface that can emulate e.g. SPI, a CAN bus, or GPIO pins, and it delivers up to 3x the performance of ST’s previous V2 probe.
Samtec Announces Acquisition of PCI
Samtec, Inc., a worldwide leader in the manufacture of electronic interconnect solutions, is pleased to announce the recent acquisition of the assets and going-forward business relationship of Precision Connector, Inc., or PCI. PCI specializes in the design and manufacture of precision RF and microwave coaxial connectors and brings over 25 years of design experience in the RF/Microwave industry to the Samtec team. The additional engineering support and product offering of precision interconnects—such as 3.50 mm, 2.92 mm, SMP, 2.40 mm, 1.85 mm, SMPM and 1.0 mm—will further strengthen Samtec’s RF portfolio and accelerate Samtec advancements into the precision RF sector. Precision RF operations will continue at the Franklin, IN location, as a division of Samtec. “We are proud to have the PCI team onboard. PCI core values directly align with Samtec’s, with the goal of providing the best customer service in the industry, advanced technical support, with the highest quality products.” —Mike Dunne, Samtec Director of RF Business Development. “We are very excited to be a part of the Samtec team and look forward to the opportunities of being a part of a global leader, supplying high quality interconnects to markets all over the world.” —Steve McGeary, Precision Connector, Inc. In addition to the precision RF product line acquisition, Samtec offers a broad line of RF interconnects (www.samtec.com/RF). Cataloged-standard solutions are available with 24-hour samples and quotes, no minimum order quantity, 2 to 5-day lead times, and mix-and-match end options on cable assemblies. Samtec also offers support with launch designs, custom product solutions, simulations, and physical test and measurement verifications. For more information on the Samtec RF product line, please contact Mike Dunne, Samtec Director of RF Business Development.
Mouser Electronics First Authorized Distributor to Receive AS6496 Accreditation for Strong Anti-Counterfeit Measures
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor, announces that it has received accreditation to AS6496, making it the industry’s first authorized distributor to be accredited with the aerospace industry’s high standard for anti-counterfeit measures in authorized electronic component distribution. Mouser Offers Intel RealSense D400 Series Depth-Sensing Cameras with Unparalleled Functionality and SizeMouser received this accreditation from the Performance Review Institute (PRI), as part of the Counterfeit Avoidance Accreditation Program (CAAP). The CAAP audit was based on audit criteria (AC7403) created jointly by PRI, the Electronic Components Industry Association (ECIA) and aerospace OEM representatives. The AS6496 aerospace standard sets requirements for the avoidance, detection, mitigation and disposition of counterfeit products in the authorized distribution supply chain. This international standard requires authorized distributors to have a counterfeit mitigation policy and a counterfeit electronics parts control plan. AS6496 is geared for all industries and individuals looking to reduce the risk of counterfeit electronic parts entering the supply chain. “By becoming accredited to AS6496, Mouser demonstrates that we are committed to providing customers with only authorized, genuine components,” said Chuck Amsden, Mouser Electronics’ Vice President of Quality. “At Mouser, we can provide full traceability to the manufacturer on everything we sell. From sales to shipping, Mouser is committed to providing our customers with the right product, on time, every time. Our mission is to be the source most preferred by engineers and buyers to design, prototype, test and manufacture electronics.” Mouser is also registered to AS9100D, ISO 9001:2015, and ANSI/ESD S20.20-2014, the industry’s gold standards for quality, control, and electrostatic discharge (ESD). Registration to these standards lets customers know that Mouser is an authorized distributor of the highest quality components by providing traceability, risk management, process control, customer support, product availability and document control. With growing concerns over counterfeit parts entering the supply chain, Mouser customers can order with confidence knowing that Mouser has rigorous processes in place to mitigate the risk of counterfeit products penetrating its inventory.
Authorized Distributor Mouser Electronics Stocking Widest Selection of Texas Instruments Products
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor, is an authorized global distributor of Texas Instruments (TI) solutions. With over 44,000 TI products, including over 4,000 development kits, Mouser offers the broadest portfolio of the newest Texas Instruments semiconductor solutions, adding new products every day. Authorized Distributor Mouser Electronics Stocking Widest Selection of Texas Instruments Products The following are just a few of the latest TI products available from Mouser: The TI TAS5760M/TAS5760M-Q1 is a stereo I2S input Class-D amplifier that includes hardware- and software-control (I2C) control modes, integrated digital clipper, several gain options, and a wide power supply operating range to enable use in a multitude of audio and video applications. The TAS5760M-Q1 devices are AEC-Q100 qualified for automotive applications. MSP430FR215x and MSP430FR235x embedded microcontrollers, part of the MSP430 microcontroller portfolio, feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The MSP430FR235x microcontrollers integrate four configurable signal-chain modules called smart analog combos, each of which can be used as a 12-bit digital-to-analog converter (DAC) or a configurable programmable-gain operation amplifier. BQ27Z561 Impedance Track™ gas gauge solution is a highly integrated and accurate 1-series cell gas gauge with a flash-programmable custom RISC and SHA-256 authentication for lithium-ion and lithium-polymer battery packs. The bq27z561 gas gauge communicates via I2C-compatible and HDQ one-wire interfaces and includes several key features that can help facilitate accurate gas gauging applications. TMS320C6748 fixed- and floating-point DSP is a low-power applications processor based on a TI C674x DSP core with a two-level cache-based architecture. The device enables design engineers to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance.
oneM2M Release 3: Leading Global IoT Standard Delivers Enhanced Operator Support, New Capabilities for Home and Industrial Uses
oneM2M, the leading global IoT interoperability standard, today announced the publication of Release 3, its third set of specifications. On the menu: dramatically enhanced 3GPP interworking – in particular cellular IoT – and new capabilities to unlock value in industrial and smart home applications. 3GPP, the world’s global standards-setting organisation for cellular wireless, has been adding IoT-centric features, including capabilities to avoid network congestion, use networks more effectively, enhance security and, crucially, enable IoT devices to manage power resources efficiently. oneM2M’s Release 3 enables seamless interworking with these underlying 3GPP network services, in particular NB-IoT and LTE-M, via the 3GPP Service Capability Exposure Function (SCEF). The combination of oneM2M’s service layer and 3GPP’s underlying network represent a significant move forward for operators in deploying IoT capabilities. The growing momentum behind LPWAN solutions, including NB-IoT and LTE-M, is expected to fuel large volumes of low price-point connected devices. Their commercial success will depend on efficient approaches for gathering and sharing IoT data, both at scale and across heterogeneous device populations. By enabling interworking with LPWAN technologies from 3GPP, Release 3 further supports operators in deploying cellular IoT services and tapping into new revenue opportunities higher up the value chain. “The ultimate goal of oneM2M is to open up the IoT ecosystem and improve the business case for players looking to launch services,” said Omar Elloumi, of Nokia, Technical Plenary Chair at oneM2M. “Release 3 does exactly this by creating an abstraction layer that simplifies the exchange of cross-silo data. Furthermore, by supporting a set of 3GPP-defined APIs, Release 3 opens up new revenue streams for mobile operators while lowering the cost of deployments.” The announcement comes as the results of one of the largest operator surveys in the area of IoT were released by Mobile World Live, the media arm of the leading wireless industry association, the GSMA. Those results showed that operators worldwide consider cellular technology to be key to their IoT offerings. The survey also showed that an overwhelming majority of respondents – 92% – consider fragmentation of standards to be an issue of concern in IoT deployment. Some examples of cellular IoT value add services enabled by oneM2M’s Release 3 include: IoT Device Enrolment – provides cellular IoT devices connected to an operator’s network with proper security credentials, authentication and registration. IoT Device Location Tracking – supports current location tracking, stores past device locations and generates notifications to IoT apps. Manage Data Delivery Methods – manages data delivery based on schedule and priority of requests. Network Communication Pattern Configuration – helps operators proactively manage network resources by anticipating the communication patterns of IoT devices based on input from IoT apps. Wake a Sleeping Device – monitors if a device is sleeping and wakes it up to process a request from the app if needed. “These features open up a multitude of possibilities for the IoT industry and cellular ecosystem, including how to monetise NB-IoT and LTE-M,” said Elloumi. “A standardised approach at the IoT service layer helps application proliferation through removing the burden of understanding diverse LPWAN flavours.”
NETCOMM’S New Industrial IoT Product to Accelerate Businesses Productivity using LTE CAT M1/NB-IOT Networks
NetComm today announced a new addition to its industrial IoT portfolio to allow businesses to connect all low power, low bandwidth devices to LTE networks. Low-power devices that only require a very limited amount of bandwidth are being introduced by businesses to optimise operations and reduce running costs. With the new NetComm NTC-100 product, businesses are less dependent on proprietary unlicensed networks in the area to manage and control these devices remotely. Els Baert, NetComm Director of Marketing and Communications, said “This is the first low power, low bandwidth device introduced to our industrial IoT portfolio and the only device of its kind to integrate a dual technology LTE module using Cat M1 and NB-IoT technologies to economically track and monitor low-cost applications that were traditionally too costly to connect. “This will accelerate the uptake of Industrial IoT by providing diverse industry sectors with the chance to connect and cost-effectively manage large fleets of small, low-value assets everywhere where there is an LTE network available.” Businesses across all industry sectors can now connect devices with the new standards developed by 3GPP: Cat M1 and NB-IoT. Widely available LTE networks support these applications by adding low bandwidth capabilities to extend range and battery life. The new NetComm NTC-100 is the first commercially available modem to support Cat M1 and NB-IoT connections to any device that needs network connectivity, giving businesses a new way to remotely manage, control and gather data from their devices. The device also features remote management capabilities to query status information, run advanced diagnostics, troubleshoot and execute commands via SMS. Whether it’s to find an economically viable means of monitoring environmental conditions, such as ocean levels, improve smart metering, monitor the farm or introduce smart city applications such as road signage, parking meters and bin collection, a growing number of devices can now leverage LTE networks worldwide. Built to endure vibration and extreme temperatures in harsh industrial, commercial and automotive environments, the robust NTC-100 features rugged IP40 rated industrial housing to ensure reliability and longevity in harsh remote and isolated climates ensuring always-on connectivity. The advanced remote management allows for a wide range of automation and monitoring features to avoid unnecessary truck rolls.
Intel Arria 10 module, smaller than a credit card
At the heart of the high-end Mercury+ AA1 SoC module from Enclustra is the Intel Arria 10 SoC, which features 20 nm technology and comes with an integrated dual-core ARM processor. Up to 286 user I/Os are available for communication with the outside world, including 12 multi-gigabit transceivers, each offering a data transfer rate of up to 12.5 Gbit/sec. Featuring interfaces for USB 3.0, PCIe Gen3 x8 and Gigabit Ethernet, the connectivity requirements of almost every application can be easily met. The module’s up to 4 GByte large DDR4 SDRAM with ECC also allows for immense data throughput with guaranteed integrity. The module is available in both commercial and industrial temperature ranges, needs just a single 5-15 V supply for operation and has a planned availability of 10 years. - Reference design and Linux at the push of a button Enclustra offers broad design-in support for their products. With the Mercury+ PE1-300 or Mercury+ PE1-400 baseboards, the Mercury+ AA1 is a powerful development and prototyping platform. Further expansion options are provided by the LPC/HPC FMC connectors on the PE1 base board, which is compatible with a wide range of plug-in cards from various manufacturers - ADCs, DACs, motor control cards and RF links are just a small selection of the possibilities on offer. Enclustra also offers a comprehensive ecosystem for the AA1, offering all of the hardware, software and support materials required. Detailed documentation and reference designs make it easy to get started, in addition to the user manual, schema, a 3D-model (STEP), PCB footprint Footprint (Altium®, OrCAD®, PADS®, EAGLE®) and differential I/O length tables. The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and base board are selected by a graphical interface. Afterwards, the Enclustra Build Environment downloads the appropriate Bitstream, Bootloader and the required source code. Finally, U-Boot, Linux and the root file system, which is based on BusyBox, are compiled. Thanks to the family concept with compatible connectors, different types of modules can be used on the same base board, such as the Intel Cylcone V SoC-based Mercury SA1 or Mercury+ SA2.
Samtec Releases Flyover QSFP28 Cable System
Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the Flyover™ QSFP28 Cable System. This new system can support 28G NRZ/56G PAM 4 data rates per channel, and it provides system design flexibility. Samtec’s Flyover™ QSFP28 Cable System allows sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew. This system can provide aggregate data rates of 100Gbps NRZ/200 Gbps PAM4, and is compatible with all MSA QSFP pluggables. A variety of heat sink options are available and allow a heat dissipation of approximately 3.5W per cable. The Samtec Flyover™ QSFP28 Cable System consists of the FQSFP assembly, the QSFPC cage, HS-QSFP heat sink, and LP-FQSFP light pipe. The FQSFP offers multiple End 2 options including DCH, ECUE, and ARC6. FQSFP utilizes 30 & 34 AWG 100 Ω Eye Speed® Ultra Low Skew Twinax Cable. Samtec also offers an FQSFP SI Characterization Kit for evaluation and development. “Using the FQSFP series allows for a much longer electrical trace and convenient selection for the endpoint of the SerDes termination,” said Aaron Ram, Applications Engineer at Samtec, Inc. “The process of routing through the FQFSP series allows designers to locate the QSFP interface much further from the ASIC or processor than traditional PCB routing would allow. This also removes the need for expensive retimers or power hungry drivers and receivers.”
Mouser Electronics New Product Insider: August 2018
Mouser Electronics, Inc. specializes in the rapid introduction of new products and technologies. As the industry leader in New Product Introductions (NPIs), Mouser makes it a priority to stock the newest products and technologies from our 700+ manufacturer partners, giving customers an edge and helping speed time to market. February 2018 Product Insider Last month, Mouser launched more than 433 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Linear Technology / Analog Devices LTM46xx µModule Regulators Analog Devices LTM46xx µModule regulators are system-in-package (SiP) power management solutions with integrated DC-DC controllers, inductors, power transistors, compensation components, input and output capacitors in compact, surface-mount BGA or LGA packages. ROHM Semiconductor BH1749NUC Digital Color Sensor IC ROHM Semiconductor BH1749NUC is a 16-bit serial-output color sensor with I2C bus interface and built-in IR-cut filter. Molex HarshIO modules for EtherNet/IP Molex HarshIO IP67 compact modules for EtherNet/IP are four- or eight-port modules that provide a reliable solution for connecting industrial controllers to I/O devices. Dialog Semiconductor SmartBond DA14585 IoT Sensor Development Kit Developed by Dialog Semiconductor and including TDK Invensense motion and Bosch Sensortec environmental sensors, the DA14585 IoT Multi-sensor Development Kit combines Bluetooth® wireless communications and an Arm® Cortex®-M0 processor with an accelerometer, gyroscope, magnetometer and environmental sensors.
Samtec Announces Completion of new VITA 57.4 FMC+ Standard
As an ANSI/VITA member, Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly supports the release of the new ANSI/VITA 57.4-2018 FPGA Mezzanine Card Plus Standard. VITA 57.4, also referred to as FMC+, expands upon the I/O capabilities defined in ANSI/VITA 57.1 FMC by adding two new connectors that enable higher data rates. FMC+ modules provide a standardized mezzanine card often employed in FPGA development solutions and by COTS manufacturers. Due to features such as their small form factor and user defined pins, FMC+ provides attractive features to the end user while maintaining modularity. In addition to providing backwards compatibility with FMC mezzanine cards, FMC+ also extends computing performance and bandwidth, all fitting within the same form factor as FMC. Samtec’s SEARAY™ vertical connectors are featured in the VITA 57.4 standard, which specifies 8.5 mm and 10 mm stack heights. SEARAY™ is capable of speeds up to 28 Gbps, provides low insertion/extraction forces, and also features solder charge terminations. In addition, the FMC+ standard also specifies the use of an optional extension connector (the High Serial Pin Connector extension, or HSPCe). Employing this extension connector increases the total pin count by 80 positions, arranged in a 4 x 20 array. This brings data rates from 28 to 32 Gbps over full duplex channels. The expanded SEARAY™ connector was chosen based on its successful performance in the VITA 57.1 FMC Standard, as well as its high-speed capabilities and rugged design. “Samtec is proud to offer the next-generation FMC+ connector solution” says David Givens, Standards Director at Samtec. “The customized SEARAY™ has flawless reliability. It provides extensive flexibility to FPGA developers and VITA-hardware users alike, while maintaining ideal signal integrity.”
Coilcraft Wirewound Ferrite Beads Offer a High Magnitude of Attenuation across a Wide Frequency Range
Coilcraft offers a broad range of wirewound ferrite beads in standard package sizes from 0201 (0603) to 1812 (4532). Superior attenuation and frequency performance enable smaller solution sizes compared to traditional thick-film chip ferrite beads. Ferrite beads are used as low pass filters to eliminate high frequency noise while allowing low frequency signals or DC current to pass through a circuit. Coilcraft wirewound ferrite beads feature a ferrite construction and heavy gauge wire for high current handling. They provide extremely low DCR while maintaining high filtering impedance across a wide bandwidth – up to GHz band. These features enhance the performance of the choke circuit while potentially reducing board space by replacing a larger chip ferrite bead with an equivalent, or higher-performing wirewound ferrite bead. Coilcraft offers 11 families of wirewound ferrite beads, all of which are RoHS-compliant and halogen free. Three models (the 0603LS, 0805LS and 1008LS) are qualified to AEC-Q200 Grade 3 standards (-40° to +85°C ambient), making them suitable for automotive and other harsh-environment applications.
Samtec Announces New VITA 57.4 FMC+ Development Kits with FireFly Optical Engines
Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the two new FireFly™ FMC+ Development Kits. The first supports data rates of 25 Gbps per channel while the second runs at 28 Gbps per channel. These new solutions offer easy-to-use evaluation and development platforms for Samtec’s FireFly™ optical engines. Samtec’s 25/28 Gbps FireFly™ FMC+ Modules provides up to 400/448 Gbps full-duplex bandwidth over up to 16 channels from an FPGA/SoC to an industry-standard multi-mode fiber optic cable. The new kits support protocols including Ethernet, InfiniBandTM, Fibre Channel and Aurora typically found in Video, Mil/Aero, Embedded Computing, Instrumentation, HPC and Date Center applications. FireFly™ optical engines make the electrical to optical conversion in the transmit path and the optical to electrical conversion in the receive path. They are based on proven MultiMode optics and support cable lengths up to 100 m. As a VITA 57.4-compliant FMC+ Module, Samtec’s new solutions can be used for optical data communication on any FPGA/SoC development platform that supports the VITA 57.4 interface. Both kits can run system data or BERT testing from a single channel to all sixteen channels in parallel. Technical documentation and FPGA reference designs are available for quick start-up. “Evaluating 100 Gbps/112 Gbps optical engine technology has high barriers of entry,” said Matt Burns, Product Marketing Manager at Samtec, Inc. “Samtec’s new FireFly™ FMC+ Development Kits simplify the evaluation and development of FireFly™ technology by using the emerging FMC+ interface typcal of high-performance FPGA/SoC development tools.”
Mouser Offers Intel RealSense D400 Series Depth-Sensing Cameras with Unparalleled Functionality and Size
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is now stocking the Intel®RealSense™ D400 product family. Built specifically to help embedded systems sense, understand, interact and learn from real-world environments, the Intel RealSense D400 product family offers designers a comprehensive platform of ready-to-use cameras, depth modules and vision processors that deliver embedded depth-sensing technology, real-time processing, and high-speed 3D imaging that is versatile and robust for a variety of indoor and outdoor applications.Mouser Offers Intel RealSense D400 Series Depth-Sensing Cameras with Unparalleled Functionality and SizeThe Intel RealSense D400 product family, available from Mouser Electronics, includes two depth-sensing cameras: the D415 and D435. Both incorporate the latest Intel RealSense Vision Processor D4 to handle the complex depth algorithm, and use stereo image sensors to capture and calculate disparity between images. The D415 camera features a rolling shutter stereo camera pair, standard infrared (IR) projector and a full HD RGB camera that is ideal for stationary and slow-moving applications. The D435 camera, by contrast, features a global shutter stereo camera pair, wide IR projector and a full HD RGB camera, which is more suitable for applications such as virtual reality (VR) or robotics. Both cameras deliver low light performance with less than 1 lux minimum sensitivity and use a USB 3.0 connection with power over USB. Both cameras offer a depth stream output resolution of up to 1280 × 720 px with a frame rate of 30 fps.For higher volume embedded applications, Intel offers the Vision Processor D4 and Depth Module D400 Series, also available from Mouser Electronics. The compact Vision Processor D4 computes high-resolution 3D depth maps in real time without requiring a dedicated GPU or host processor when paired with RealSense Depth Modules. The D400 Depth Module Series can capture indoor or outdoor environments with long-range capabilities, high-depth resolution and IR stereo, and are offered with multiple options, including standard or wide field of view, rolling or global shutter technology and passive or active IR depth sensing.The Intel RealSense Depth Camera D400 product family is supported by a cross-platform (Windows, Linux, macOS) and open-source software development kit (SDK), which features libraries, wrappers, computer vision sample code and tools to help designers start coding projects and debugging camera settings. Additionally, designers can quickly download the Intel RealSense viewer for use with either the D435 or D415 Depth Camera to quickly evaluate the D400 product family.
Xilinx Zynq UltraScale+ SoC module with two memory channels
The Mercury XU5 SoC module from Enclustra is an extremely powerful all- rounder. Based on the Xilinx Zynq UltraScale+ MPSoC, it features 6 ARM cores, a Mali 400MP2 GPU, up to 10 GByte of extremely fast DDR4 SDRAM, numerous standard interfaces, 178 user I/Os and up to 256,000 LUT4 equivalents. Thanks to two independent storage channels – one on the PS and one on the PL – it achieves memory bandwidths of up to 24 GByte/sec. Mars XU3The Mercury XU5 MPSoC module from FPGA specialists Enclustra features more direct interfaces to the FPGA fabric, in addition to a Gigabit Ethernet connection as well as up to 2 GByte DDR4 SDRAM. The module, with dimensions of just 56 × 54 mm, has up to 8 GByte DDR4 ECC SDRAM connected directly to the processing system, 16 GByte eMMC flash memory as well as various standard interfaces, such as Gigabit Ethernet, USB 3.0, a display port, SATA and SGMII. Both the processing system and the FPGA matrix boast four PCIe® Gen2/3 connections. The Xilinx Zynq UltraScale+ MPSoC is manufactured in a 16 nm FinFET+ process and comes equipped with 6 ARM cores – four 64-bit ARM CortexTM- A53 with a clock rate of up to 1333 MHz as well as a 600 MHz fast 32-bit ARM® dual-core CortexTM-R5. The processors are supported by a MaliTM 400MP2 GPU and a H.264/H.265 video codec (EV variants). - Reference design and Linux at the push of a button Enclustra offers broad design-in support for their products. With the Mercury PE1-200 baseboard, the Mercury XU5 is a powerful development and prototyping platform. Further expansion options are provided by the LPC FMC connector on the PE1 base board, which is compatible with a wide range of plug-in cards from various manufacturers - ADCs, DACs, motor control cards and RF links are just a small selection of the possibilities on offer. Enclustra also offers a comprehensive ecosystem for the XU5, offering all of the hardware, software and support materials required. Detailed documentation and reference designs make it easy to get started, in addition to the user manual, user schema, a 3D-model (STEP), PCB footprint (Altium®, OrCAD®, PADS®, EAGLE®) and differential I/O length tables. The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and base board are selected by a graphical interface. Afterwards, the Enclustra Build Environment downloads the appropriate Bitstream, First Stage Boot Loader (FSBL) and the required source code. Finally, U-Boot, Linux and the root file system, which is based on BusyBox, are compiled. Thanks to the family concept with compatible connectors, different types of modules can be used on the same base board. If, for example, an ARM processor is not required, the Mercury KX1 FPGA module can be used on the same base board instead.
Fujikura Europe Announces Launch of its New Smart Single Fibre Fusion Splicer: The 41S
Fujikura Europe, leaders in connectivity and splicing technology, has announced the launch of its latest single fibre active cladding alignment fusion splicer. Designed for FTTX applications, the next-generation smart 41S splicer boasts innovative features in a compact and robust package. Wirelessly connecting to the CT50 fibre cleaver using Bluetooth technology, the 41S enables a range of pioneering functions that will improve the overall installation time, cost and efficiency for operators. Compared to its predecessor the 22S, the 41S has been upgraded and offers installers the convenience of a 5” colour touch-panel display, improved v-groove illumination and the benefit of easy splice protector positioning. The machine re-assures users of reliable splice results using CORE loss estimation using Warm Image Splicing Technology. The issue of poor fibre cleaving due to worn, incorrectly adjusted or damaged cleaver blades is conveniently dealt with. When the 41S detects a high cleave angle or bad end shape, it sends a blade position change instruction to the cleaver. The CT50 cleaver then rotates the cleaver blade automatically to the next position, restoring optimum cleaving performance. By utilising the low radio power of Bluetooth technology, other equipment nearby will not be interfered with. Operators can benefit from the “always on” technology due to the low power consumption of the Bluetooth, which means that batteries can last for several months. “To ensure optimum results, fibres need to be spliced in a safe, hassle-free and efficient manner to avoid unnecessary, extra work for operators,” said Neil Bessant at Fujikura Europe. “Cleaving fibres using a cleaver without the benefit of wireless connectivity for an operator is a tricky, and often a less than successful game to play. If multiple errors are made it leads to increased costs to replace the fibres, as well as lost time and ultimately a decrease in overall optical performance. “Our latest addition to the splicing family, the 41S, is flexible, smart and efficient and therefore makes a huge difference to this process. The easy-to-handle qualities of the solution means quick and simple splicing, with performance never being compromised.” In addition to cleave performance, the smart splicer can also wirelessly monitor battery and power usage of the CT50 cleaver. The 41S comes enabled with a touch screen menu as standard, but also maintains the traditional easy-to-use hard button navigation system. The splicer retains all of the unique, class-leading features from the current high-performance flagship line-up of Fujikura splicers, including: quick splice and heat times, fully ruggedized features, and user customizable settings. The 41S, along with a full range of Fujikura Europe’s fibre optic solutions, will first be displayed at ECOC (European Conference on Optical Communication) in Rome, Italy from the 24th – 26th September 2018
Samtec Introduces new VITA 42 XMC 12 mm mated connector sets
As an ANSI/VITA member, Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, is proud to release new connector sets compliant with the revised ANSI/VITA 42.0-2016 XMC Standard. VITA 42 XMC defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed form factor. This revision further defined the concept for the preferred Standard connectors in XMC applications including: Solder ball attachment replaced Paste-On-Pad (POP) for improved solder joints Low Insertion Force (LIF) sockets to ease mating and un-mating Tin-lead alloy available as a solder option Revised ASP catalog numbers 12 mm stack height Based on these guidelines, Samtec is proud to release 12 mm stack height options expanding the existing family of ANSI/VITA 42 XMC Standard connectors. Chosen for high reliability stemming from the multipoint-of-contact SamArray® sockets and robust solder ball design, the updated connector set has been specified for current XMC systems. Samtec's growing catalog of XMC connectors enable switched communication between a mezzanine card and its carrier. In addition to transmitting sensitive high-speed data, these connectors provide power, ground, and auxiliary signals to the mezzanine. The 12 mm mated connector set further optimizes XMC cards for use in wider modules, designed for 1.00" pitch cage systems. “We were excited at the opportunity to update VITA 42.0, bringing the specified connectors to the state-of-the-art,” said David Givens, Standards Director. “Since the Standard was launched, Samtec supported hundreds of system designers who expressed the need for an alternative to Paste-On-Pad attachments while providing Low Insertion Force contacts.” For more information on Samtec’s complete line of VITA 42 XMC or SamArray® solutions, please email our technical experts at XMC@samtec.com or visit https://www.samtec.com/xmc